*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Operating Temperature ......................................-40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................125 °C
Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours ..................±5 % typical resistance change Thermal Shock....................................................+85 °C to -40 °C, 20 times ........................±10 % typical resistance change Solvent Resistance https://www.wendangku.net/doc/07884107.html,-STD-202, Method 215........................No change https://www.wendangku.net/doc/07884107.html,-STD-883C, Method 2007.1,................No change
Condition A Test Test Conditions Accept/Reject Criteria Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description Resistance ......................................In still air @ 23 °C............................................................Rmin ≤R ≤R1max
Time to Trip ....................................At specified current, Vmax, 23 °C..................................T ≤max. time to trip (seconds)Hold Current ..................................30 min. at Ihold ..............................................................No trip
Trip Cycle Life ................................Vmax, Imax, 100 cycles..................................................No arcing or burning Trip Endurance................................Vmax, 48 hours ..............................................................No arcing or burning Solderability....................................ANSI/J-STD-002............................................................95 % min. coverage
UL File Number..................................E174545
https://www.wendangku.net/doc/07884107.html,/ Follow link to Certifications, then UL File No., enter E174545
CSA File Number ..............................CA110338
https://www.wendangku.net/doc/07884107.html,/ Under “Certification Record” and “File Number” enter 110338-0-000
TüV Certificate Number ....................R 02057213
https://www.wendangku.net/doc/07884107.html,/ Follow link to “other certificates”, enter File No. 2057213
Test Procedures And Requirements For Model MF-USMF Series
Thermal Derating Chart - I hold (Amps)
Ambient Operating Temperature
Model -40 °C -20 °C 0 °C 23 °C 40 °C 50 °C 60 °C 70 °C 85 °C
MF-USMF0050.08 0.07 0.06 0.05 0.04 0.04 0.03 0.03 0.02 MF-USMF0100.15 0.13 0.12 0.10 0.09 0.08 0.07 0.06 0.05 MF-USMF0200.32 0.28 0.24 0.20 0.18 0.16 0.14 0.12 0.10 MF-USMF0350.51 0.46 0.40 0.34 0.30 0.27 0.24 0.22 0.18 MF-USMF0500.76 0.66 0.58 0.48 0.42 0.38 0.35 0.29 0.23 MF-USMF075 1.10 0.97 0.86 0.72 0.64 0.58 0.55 0.47 0.39 MF-USMF110 1.60 1.42 1.26 1.100.940.860.800.700.58MF-USMF150
2.30 2.02 1.76 1.43 1.24 1.11 1.00 0.85 0.65
*R
o H
S
C O
M
P L
I A
N T
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Product Dimensions
Packaging: 3000 pcs. per reel.
MF-USMF Series - PTC Resettable Fuses
A
B
C
D Model Min.Max.Min.Max.Min.Max.Min.MF-USMF005 3.00 3.43 2.35 2.800.80 1.10.30(0.118)(0.135)(0.093)(0.110)(0.031)(0.043)(0.012)MF-USMF010 3.00 3.43 2.35 2.800.80 1.10.30(0.118)(0.135)(0.093)(0.110)(0.031)(0.043)(0.012)MF-USMF020 3.00 3.43 2.35 2.80
0.80 1.10.30(0.118)(0.135)(0.093)(0.110)(0.031)(0.043)(0.012)MF-USMF035 3.00 3.43 2.35 2.800.550.850.30(0.118)(0.135)(0.093)(0.110)(0.022)(0.033)(0.012)MF-USMF050 3.00 3.43 2.35 2.800.550.850.30(0.118)(0.135)(0.093)(0.110)
(0.022)(0.033)(0.012)MF-USMF075 3.00 3.43 2.35 2.800.550.850.30(0.118)(0.135)(0.093)(0.110)(0.022)(0.033)(0.012)MF-USMF110 3.00 3.43 2.35 2.800.550.850.30(0.118)(0.135)(0.093)(0.110)(0.022)(0.033)(0.012)MF-USMF150
3.00 3.43 2.35 2.800.400.850.30
(0.118)
(0.135)
(0.093)
(0.110)
(0.016)
(0.033)
(0.012)
MM (INCHES)
UNIT =
Terminal material:
Electroless Ni under immersion Au Termination pad solderability: Standard Au finish:
Meets ANSI/J-STD-002 Category 2.Recommended Storage:40 °C max./70 % RH max.
Top and Bottom View
Side View Recommended Pad Layout 300250200150100500
T e m p e r a t u r e (°C )
Preheating
Soldering
Cooling
Time (seconds)
Notes:
?MF-USMF models cannot be wave soldered.
?If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.?Compatible with Pb and Pb-free solder reflow profiles.
Solder Reflow Recommendations
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
How to Order
MF - USMF 010 - 2
Multifuse ?Product
Designator
Series
USMF = 1210 Surface Mount Component Hold Current, I hold
005-150 (0.05-1.50 Amps)
Packaging
Packaged per EIA 481-1-2 = Tape and Reel
MF-USMF Series - PTC Resettable Fuses
Typical Part Marking
Represents total content. Layout may vary.
WEEK 1 AND 2 = A WEEK 51 AND 52 = Z
environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables.
MF-USMF SERIES, REV. C, 01/06
Circuit Protection Division
Asia-Pacific:
Tel: +886-2 2562-4117 ? Fax: +886-2 2562-4116Europe:
Tel: +41-41 768 5555 ? Fax: +41-41 768 5510The Americas:
Tel: +1-951 781-5500 ? Fax: +1-951 https://www.wendangku.net/doc/07884107.html,
MF-USMF Series Tape and Reel Specifications
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.