PROTECTION PRODUCTS PROTECTION PRODUCTS - MicroClamp TM Low Profile μClamp TM 1-Line ESD protection
Description
Features
Dimensions
Schematic & PIN Configuration
The μClamp TM series of TVS arrays are designed to pro-tect sensitive electronics from damage or latch-up due to ESD. It is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, note-book computers, and other portable electronics. It fea-tures large cross-sectional area junctions for conducting high transient currents. They offer desirable character-istics for board level protection including fast response time, low operating and clamping voltage, and no device degradation.
The μClamp TM 0501T is in a 2-pin, RoHS/WEEE compli-ant, SLP1006P2T package. It measures 1.0 x 0.6 mm with a nominal height of only 0.4mm. The leads are spaced at a pitch of 0.65mm and are finished with lead-free NiPdAu. Each device will protect one line operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4
(±15kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players.
Applications
Mechanical Characteristics
Cellular Handsets & Accessories Personal Digital Assistants (PDAs) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals
MP3 Players
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)Cable Discharge Event (CDE)
Ultra-small package (1.0 x 0.6 x 0.4mm) Protects one data line Low clamping voltage Working voltage: 5V Low leakage current
Solid-state silicon-avalanche technology
SLP1006P2T package RoHS/WEEE Compliant
Nominal Dimensions: 1.0 x 0.6 x 0.4 mm Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0 Marking : Marking code, cathode band Packaging : Tape and Reel
Absolute Maximum Rating
g
n i t a R l o b m y S e u l a V s t i n U )
s μ02/8=p t (r e w o P e s l u P k a e P P k p 52s t t a W (t n e r r u C e s l u P k a e P m u m i x a M )s μ02/8=p t I p p 2s p m A )
r i A (2-4-00016C E I r e p D S E )t c a t n o C (2-4-00016C E I r e p D S E V D S E 02-/+51-/+V k e r u t a r e p m e T g n i t a r e p O T J 521+o t 55-C °e
r u t a r e p m e T e g a r o t S T G
T S 0
51+o t 55-C
°
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
1020304050607080901001100255075100
125150
Ambient Temperature - T A (o
C)
% o f R a t e d P o w e r o r I P P
Power Derating Curve
Clamping Voltage vs. Peak Pulse Current
Forward Voltage vs. Forward Current
Junction Capacitance vs. Reverse Voltage
ESD Clamping
(8kV Contact per IEC 61000-4-2)
5
10
15
0.5
1
1.5
2
2.5
3
Peak Pulse Current - I PP (A)
C l a m p i n g V o l t a g e - V C (V )
1234567
80
1
234567891011121314
Forward Current - I F (A)
F o r w a r d V o l t a g e - V F V )
00.10.20.30.40.50.60.70.80.911.10
1
23
4
5
Reverse Voltage - V R (V)
C J (V R ) / C J (V R =0)
0.01
0.1
1
10
0.1
1
10
100
Pulse Duration - tp (us)
P e a k P u l s e P o w e r - P P P (k W )
Note: Data is taken with a 10x attenuator
Insertion Loss S21
START
. 030 MHz 3 STOP 000 .000 000 MHz
CH1 S21 LOG
6 dB / REF 0 dB
1: -3.0037dB 572.149 MHz
2: -5.0581 dB 800.00 MHz
3: -5.8299 dB 900.00 MHz
4: -23.207
1.80000 GHz
5: -13.452
2.50000 GHz
0 dB -6 dB -12 dB -18 dB -24 dB -30 dB -36 dB
1
GHz 100 MHz 3 GHz 10 MHz 1 MHz
1
2
3
4
5
Typical Characteristics
Applications Information
Device Connection Options
Circuit Diagram This device is designed to protect one data or power
supply line. The device is unidirectional and may be
The cathode band should be placed towards the line
that is to be protected.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
Applications Information - Spice Model
uClamp0501T Spice Model
5
p
a l C
u
m
s r e t e
T1
a r a
m
e c i p S
P
1
V T(
D
U)S
m
P t i n
r e t e
a r a
1-e5
0.2
A5
S I p
m
B t l o V0.7
V
8.0
J V t l o V0
7.0
O5
S
h
R m
m
A3-E0.1
B I p
V
1-e9
O J C d a r a F2
5.2
T T c e s9-E14
2.0
M--5
N--1.1
1.1
G
E V e1
Outline Drawing - SLP1006P2T
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012Phone: (805)498-2111 FAX (805)498-3804
Marking Code
Ordering Information
r
e b m u N t r a P g n i k r o W e g a t l o V r e p y t Q l e e R l e e R e z i S T
C T .T 1050p m a l C u V
50
00,3h
c n I 7Notes:
1) This is a lead-free, RoHS/WEEE compliant product MicroClamp, uClamp and μClamp are marks of Semtech Corporation
Tape and Reel Specification
e p a T h
t d i W )x a M (,B D 1D E F P 0P 2P T W m
m 8m m 2.4)
561.(m m 1.0+5.1m m 0.0-500.+95.0()
000.-m
m 4.052.0±)
130.(01.±057.1m m )
400.±960.(50.0±5.3m m )200.±831.(01.0±0.4m m -00.±751.()
41.0±0.4m m -00.±751.()
450.0±0.2m m )
200.±970.(20.0±452.0)
610.(m m m m 0.8m m 3.0+m m 1.0-)
210.±213.(0
A 0
B 0
K m
m 01.0-/+96.0m
m 01.0-/+91.1m
m 01.0-/+66.0Device Orientation in Tape