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LCM 各部件模组介绍

LCM 各部件模组介绍
LCM 各部件模组介绍

LCM 模組介紹

一、 各部零件介紹

二、 製程方法

三、 LCM組成方式

四、 LCD介紹

五、 背光介紹

六、 壓縮比

七、 手機背光各零件組成:

八、 名詞解釋

一、各部零件介紹: LCM 零件大致可分為: 1. 鐵框

黑框, 鍍鋅低框, 鍍鋅高框 2. LCD TN 全透 半透 反射 6 點鐘 12 點鐘 9點鐘 3 點鐘 STN 全透 半透 反射 6 點鐘 12 點鐘 9點鐘 3 點鐘 FSTN

全透 半透 反射 6 點鐘 12 點鐘

9點鐘

3 點鐘

3. 導電橡皮

為作LCD 與PCB 導通之介面

導電橡皮的PITCH

寬不可大於LCDITO 或PCB 金手指的PITCH 寬,否則會造成短路

4. PCB(含軟板)

單層板,雙層板,多層板(㈥層板) 5. 背光 CCFL,LED,EL 6. FFC(軟排) 7. CONNECTOR 8. IC

LCD 導電橡皮 PCB

二、依製程可分為:

1. COB – Chip on Board Construction Of Wire Bonding

PC Board & Layout

2. COF – Chip on Film

3. COG – Chip on Glass

Outer Lead Bonding By ACF

4. TAB(Tape Automated Bonding)

三、LCM 組成方式: (1) 字、圖形產品

(2) TAB 產品

(3) COF 產品

鐵框

T/P

PCB Light-Guide

LCD

導電橡皮

背光

四、LCD介紹: 依種類:

(1) TN

(2) STN

(3) FSTN

(4) TFT

依透光度:

(1) 全透

(2) 半透

(3) 反射

依點鐘:

(1) 6 點鐘

(2) 12點鐘

(3) 3點鐘

(4) 9點鐘

㈤、背光介紹:

EL Backlight

Flat surface light source offers simple and even illumination over large area.

Features:

Max.1.3mm thickness ( Max. 1.5mm for lead portion )

Wide driving condition, 60-1,000Hz at 150V AC Max. With inverter, step-up voltage from

1.5V battery is available.

Emitted colors are blue-green, yellow-green and white.

Operating characteristics of PC2002-A SERIES is 110V, 400Hz, 8mA, ( Ta=20oC, 60% RH ) Temperature Range:

Operating 0oC~ +50oC

Storage -20oC~ +60oC

CCFL Backlight( Cold Cathode Fluorescent Lamp )

Bright white color of light source offers clear and even illumination over large viewing area. Features:

High Brightness

Long life time.

Low Power consumption

White color emitted

LED Backlight

Long life, low power consumption and requires a simple power supply. Available colors are red, green and orange, available in array type illumination or edge illumination.

Features

Low driving voltage ( DC ) and does not require an inverter.

Long life of 100,000 hours ( average )

No noise occurrence.

Various colors available in red, green and orange etc. ( multi-color by alternative switch is

also available )

㈥、壓縮比:

字、圖形產品因有導電橡皮為作導電介面,然而因為橡皮有伸縮性,故壓縮的比率將影響顯示畫面

一般而言,未鎖角前:

L(LCD厚度)+Z(導電橡皮高)+B(PCB厚度) > H (鐵框內徑高)

鎖角後:

L + Z1 + B = H

Z1: 為導電橡皮壓縮後的高

壓縮比計算的方式為: Z-Z1/Z

最好的壓縮比約為 10%

(1)壓縮比愈高,表示組裝愈緊密,但容易造成LCD局部泛色或單點紅.

(2)壓縮比愈低,表示組裝不緊密,容易造成顯示異常或斷線

㈦、手機背光各零件組成:

一般而言,背光廠光生產背光的程序為:

進行DICE 的分光分色→貼片(SMT)→組裝→壓合

(1) 手機背光通常為定電壓,因為DICE 的內電阻各不同,若使用定電流時:

依 V = I * R ,V 將不同,隨著內電阻不同,電壓也不同,因此定電流將會使背光DICE 燒毀,背光模組呈現燈死或燈暗的現象

(2) 若DICE 分光分色不完全,將使的背光模組點燈時,發現顏色不一,亮度不一 (3) 導光板若放置位置不正確,將使模組點亮呈現部份燈較暗,部份燈較亮的現象 (4) 若擴散片與錂鏡片放置位置不正確, 將使模組點亮呈現光源散射的現象

(5) 若壓合時間不足時,將使的背光各層無法緊密貼付,點燈時呈現光源散射及B/M 銘板與錂鏡片被撕起的現象

塑座

貼片

上擴散片

上錂鏡片

㈧、名詞解釋:

COB (Chip On Board )

An IC chip is mounted onto a printed circuit board by wire bonding.

SMT (Surface Mount Technology)

Mounting on the surface of PCB

TAB (Tape Automated Bonding)

Tape Automatic Bonding technology for LCD module construction With LCD and TCP LSI

COG (chip On Glass)

A bumped chip directly mounted on LCD panel

COF (Chip On Flex/Film)

A bumped chip mounted on a flexible printed circuit film

ILB (Inner Lead Bonding)

IC Bonding to Flex or Tape

OLB (Outer Lead Bonding)

Laminating flex or Tape with LCD panel

TN (Twisted Nematic)

A nematic liquid crystal with a twist angle about 90 degrees, and the type of display that

STN (Super Twisted Nematic )

A nematic liquid crystal with a twist of roughly 180 degrees to 270 degrees, and the type Of display that uses it

FSTN (Formulated STN )

An optically compensated film is added to STN, and is used as a monochrome display

Color STN

STN display with R/G/B color filter to perform different color

TDF (Transflective Display Film)

To replace the bottom polarizer to improve the readability and style

RDF (Reflective Display Film)

To replace the bottom polarizer to improve the readability and style

EL (Electro Luminescence)

Light generated by an electric field. An EL layer is formed on a high molecular weight

LED (Light Emitting Diode )

A diode which emits light

CCFL (Cold Cathode Fluorescent Lamp)

High brightness suited with graphic LCM display

QFP (Quad Flat Package)

A package formed with leads on surfaces oriented in four directions

TQFP (Thin Quad Flat Package)

A low profile package formed with leads on surfaces oriented in four direction

TCP (Tape carrier Package)

A flexible board printed with a circuit pattern, with IC chips moutned on it.

Tf (Fall Time)

Response time of falling edge .

Tr (Rise Time)

Response time of rising edge .

Vop (Operating Voltage)

Liquid crystal driving voltage.

Vth (Threhold Voltage)

A threshold voltage.

ACF (Anisotropic Circuit )

Adhesive film for laminating COF & TAB module

FPC (Flex Printed Circuit )

A flexible PCB.

FFC (Flex Flat cable)

A flexible Cable.

TFT (Thin Film Transistor)

Active type LCD display for Notebook and other Color application.

OLED (Organic Electro Luminescent )

Organic EL to provide dot-matrix display function wide viewing angleand high.

LTPS (Low Temperature Poly Siiicon)

New type TFT display with low power consumption & high contrast.

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