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MC74HC1G14DFT1中文资料

MC74HC1G14

Single Inverter with Schmitt?Trigger Input

The MC74HC1G14 is a high speed CMOS inverter with Schmitt?Trigger input fabricated with silicon gate CMOS technology.The internal circuit is composed of multiple stages, including a buffer output which provides high noise immunity and stable output.The MC74HC1G14 output drive current is 1/2 compared to MC74HC series.

?High Speed: t PD = 7.0 ns (Typ) at V CC = 5.0 V

?Low Power Dissipation: I CC = 1.0 m A (Max) at T A = 25_C ?High Noise Immunity

?Balanced Propagation Delays (t PLH = t PHL )

?Symmetrical Output Impedance (I OH = I OL = 2.0 mA)?Chip Complexity: FET = 101?

Pb?Free Packages are Available

Figure 1. Pinout (Top View)

V CC

IN A OUT Y

GND Figure 2. Logic Symbol

IN A

OUT Y

See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.

ORDERING INFORMATION

https://www.wendangku.net/doc/206023572.html,

MAXIMUM RATINGS

Symbol Parameter

Value Unit V CC DC Supply Voltage *0.5 to )7.0V V IN DC Input Voltage *0.5 to V CC )0.5V V OUT DC Output Voltage *0.5 to V CC )0.5

V I IK DC Input Diode Current $20mA I OK DC Output Diode Current $20mA I OUT DC Output Sink Current

$12.5mA I CC DC Supply Current per Supply Pin $25mA T STG Storage Temperature Range

*65 to )150

_C T L Lead Temperature, 1 mm from Case for 10 Seconds 260_C T J Junction Temperature Under Bias )150_C q JA Thermal Resistance

SC70?5/SC?88A/SOT?353 (Note 1)

SOT23?5/TSOP?5/SC59?5

350230_C/W P D Power Dissipation in Still Air at 85_C SC70?5/SC?88A/SOT?353SOT23?5/TSOP?5/SC59?5

150200mW

MSL Moisture Sensitivity Level 1

F R Flammability Rating Oxygen Index: 28 to 34

UL 94 V?0 @ 0.125 in

V ESD

ESD Withstand Voltage

Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

u 2000u 200N/A V I LATCHUP

Latchup Performance Above V CC and Below GND at 125_C (Note 5)

$500

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,damage may occur and reliability may be affected.

1.Measured with minimum pad spacing on an FR4 board, using 10 mm?by?1 inch, 2 ounce copper trace with no air flow.

2.Tested to EIA/JESD22?A114?A.

3.Tested to EIA/JESD22?A115?A.

4.Tested to JESD22?C101?A.

5.Tested to EIA/JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter

Min Max Unit V CC DC Supply Voltage 2.0 6.0V V IN DC Input Voltage 0.0V

CC V V OUT DC Output Voltage

0.0V CC V T A Operating Temperature Range *55)125_C t r , t f

Input Rise and Fall Time

V CC = 3.3 V ± 0.3 V V CC = 5.0 V ± 0.5 V

No Limit No Limit

ns/V

DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES

Junction Temperature °C

Time, Hours Time, Years

801,032,200117.890419,30047.9100178,70020.411079,6009.412037,000 4.213017,800 2.0140

8,900

1.0

100

1000

Figure 3. Failure Rate vs. Time Junction Temperature

N O R M A L I Z E D F A I L U R E R A T E

TIME, YEARS

DC ELECTRICAL CHARACTERISTICS

V CC T A = 25_C T A v 85_C*55_C v T A v 125_C Symbol Parameter Test Conditions(V)Min Typ Max Min Max Min Max Unit

V T+Positive Threshold

Voltage 3.0

4.5

5.5

1.85

2.86

3.50

2.0

3.0

3.6

2.20

3.15

3.85

2.20

3.15

3.85

2.20

3.15

3.85

V T?Negative Threshold

Voltage 3.0

4.5

5.5

0.9

1.35

1.65

1.5

2.3

2.9

1.65

2.46

3.05

0.9

1.35

1.65

0.9

1.35

1.65

V H Hysteresis Voltage 3.0

4.5

5.50.30

0.40

0.50

0.57

0.67

0.74

1.20

1.40

1.60

0.30

0.40

0.50

1.20

1.40

1.60

0.30

0.40

0.50

1.20

1.40

1.60

V OH Minimum High?Level

Output Voltage V IN = V IH or V IL

I OH = ?20 m A

2.0

3.0

4.5

6.0

1.9

2.9

4.4

5.9

2.0

3.0

4.5

6.0

1.9

2.9

4.4

5.9

1.9

2.9

4.4

5.9

V IN v V T*Min

I OH = *2 mA

I OH = *2.6 mA

4.5

6.0

4.18

5.68

4.31

5.80

4.13

5.63

4.08

5.58

V OL Maximum Low?Level

Output Voltage V IN≥ V T)Max

I OL = 20 m A

2.0

3.0

4.5

6.0

0.0

0.1

V IN = V IH or V IL

I OL = 2 mA

I OL = 2.6 mA

4.5

6.0

0.17

0.18

0.26

0.33

0.40

I IN Maximum Input

Leakage Current

V IN = 6.0 V or GND 6.0$0.1$1.0$1.0m A

I CC Maximum Quiescent

Supply Current

V IN = V CC or GND 6.0 1.01040m A

AC ELECTRICAL CHARACTERISTICS (Input t r = t f= 6.0 ns)

T A = 25_C T A v 85_C*55_C v T A v 125_C Symbol Parameter Test Conditions Min Typ Max Min Max Min Max Unit

t PLH, t PHL Maximum

Propagation Delay,

Input A or B to Y

V CC = 5.0 V C L = 15 pF 3.5152025ns

V CC = 2.0 V C L = 50 pF

V CC = 3.0 V

V CC = 4.5 V

V CC = 6.0 V

10.5

7.5

6.5

100

125

155

t TLH, t THL Output Transition

Time

V CC = 5.0 V C L = 15 pF3101520ns

V CC = 2.0 V C L = 50 pF

V CC = 3.0 V

V CC = 4.5 V

V CC = 6.0 V

125

155

200

C IN Maximum Input

Capacitance

5101010pF

Typical @ 25_C, V CC = 5.0 V

C P

D Power Dissipation Capacitance (Note 6)10pF

6.C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.

Average operating current can be obtained by the equation: I CC(OPR) = C PD V CC f in + I CC. C PD is used to determine the no?load dynamic power consumption; P D = C PD V CC2 f in + I CC V CC.

propagation delay tests. Figure 4. Switching Waveforms Figure 5. Test Circuit OUTPUT

INPUT A

OUTPUT Y

DEVICE ORDERING INFORMATION

Device Nomenclature

Device Order Number

Logic

Circuit

Indicator

Temp

Range

Identifier Technology

Device

Function

Package

Suffix

Tape and

Reel

Suffix Package Type

Tape and

Reel Size?

MC74HC1G14DFT1MC74HC1G14DF T1SC70?5/SC?88A/

SOT?353178 mm (7 in) 3000 Unit

MC74HC1G14DFT1G MC74HC1G14DF T1SC70?5/SC?88A/

SOT?353

(Pb?Free)178 mm (7 in) 3000 Unit

MC74HC1G14DFT2MC74HC1G14DF T2SC70?5/SC?88A/

SOT?353178 mm (7 in) 3000 Unit

MC74HC1G14DFT2G MC74HC1G14DF T2SC70?5/SC?88A/

SOT?353

(Pb?Free)178 mm (7 in) 3000 Unit

MC74HC1G14DTT1MC74HC1G14DT T1SOT23?5/TSOP?5/

SC59?5178 mm (7 in) 3000 Unit

MC74HC1G14DTT1G MC74HC1G14DT T1SOT23?5/TSOP?5/

SC59?5

(Pb?Free)178 mm (7 in) 3000 Unit

?For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

NOTES:

1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 198

2.CONTROLLING DIMENSION: INCH.

3.419A?01 OBSOLETE. NEW STANDARD 419A?02.

4.DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.

DIM

A MIN MAX MIN MAX MILLIMETERS

1.80

2.200.0710.087INCHES B 1.15 1.350.0450.053C 0.80 1.100.0310.043D 0.100.300.0040.012G 0.65 BSC 0.026 BSC H ???0.10???0.004J 0.100.250.0040.010K 0.100.300.0040.012N 0.20 REF 0.008 REF S

2.00 2.20

0.0790.087

SC70?5/SC?88A/SOT?353

DF SUFFIX 5?LEAD PACKAGE CASE 419A?02ISSUE G

*For additional information on our Pb?Free strategy and soldering

details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

NOTES:

1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 198

2.CONTROLLING DIMENSION: MILLIMETER.

3.MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.

DIM MIN MAX MIN MAX INCHES

MILLIMETERS A 2.90 3.100.11420.1220B 1.30 1.700.05120.0669C 0.90 1.100.03540.0433D 0.250.500.00980.0197G 0.85 1.050.03350.0413H 0.0130.1000.00050.0040J 0.100.260.00400.0102K 0.200.600.00790.0236L 1.25 1.550.04930.0610

M 0 10 0 10 S

2.50

3.00

0.09850.1181

____SOT23?5/TSOP?5/SC59?5

DT SUFFIX 5?LEAD PACKAGE CASE 483?02ISSUE C

*For additional information on our Pb?Free strategy and soldering

details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION