INF-8074

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SFF Committee

INF-8074i Specification for

SFP (Small Formfactor Pluggable) Transceiver

Rev 1.0 May 12, 2001

Secretariat: SFF Committee

Abstract: This specification describes the SFP (Small Formfactor Pluggable) Transceivers developed by the MSA (Multiple Source Agreement) group. The

following companies participated in the MSA.

Agilent Technologies IBM

Blaze Network Products Lucent Technologies

E2O Communications Molex

ExceLight Communications Optical Communication Products

Finisar Picolight

Fujikura Technology America Stratos Lightwave

Hitachi Cable Tyco Electronics

Infineon Technologies

This Information Specification was not developed or endorsed by the SFF Committee and was submitted for distribution on the basis that it is of interest to industry.

The copyright on the contents remains with the contributor.

Contributors are not required to abide by the SFF patent policy. Readers are advised of the possibility that there may be patent issues associated with an implementation which relies upon the contents of an 'i' specification.

SFF accepts no responsibility for the validity of the contents.

POINTS OF CONTACT:

Schelto van Doorn I. Dal Allan

Technical Editor Chairman SFF Committee

Intel/nSerial 14426 Black Walnut Court

3101 Jay St #110 Saratoga

Santa Clara CA 95054 CA 95070

408-496-3426 408-867-6630

408-486-9783Fx 408-867-2115Fx

schelto.vandoorn@https://www.wendangku.net/doc/207601466.html, endlcom@https://www.wendangku.net/doc/207601466.html,

EXPRESSION OF SUPPORT BY MANUFACTURERS

The following member companies of the SFF Committee voted in favor of this industry specification.

EMC

ENDL

FCI/Berg

Hitachi Cable

Picolight

Toshiba America

Unisys

The following member companies of the SFF Committee voted to abstain on this industry specification.

Fujitsu CPA

IBM

Seagate

Tyco AMP

If you are not a member of the SFF Committee, but you are interested in participating, the following principles have been reprinted here for your information.

PRINCIPLES OF THE SFF COMMITTEE

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Adopting a common industry size simplifies the integration of small drives (2

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Appendix A. Mechanical Interface

A1. SFP Transceiver Package Dimensions

A2. Mating of SFP Transceiver PCB to SFP Electrical Connector

A3. Host Board Layout

A4. Insertion, Extraction and Retention Forces for SFP Transceivers A5. Labeling of SFP Transceivers

A6. Bezel Design for Systems Using SFP Transceivers

A7. SFP Electrical Connector Mechanical Specifications

A8. SFP Cage Assembly Dimensions

Appendix B. Electrical Interface

B1. Introduction

B2. Pin Definitions

B3. Timing Requirements of Control and Status I/O

B4. Module Definition Interface and Data Field Description

Appendix C. Agreement Signatures

Appendix A. Mechanical Interface

A1.SFP Transceiver Package Dimensions

A common mechanical outline is used for all SFP transceivers. The package dimensions for the SFP transceiver are described in Table 1 and Figures 1A and 1B.

Table 1. Dimension Table for Drawing of SFP Transceiver

Designator Dimension

(mm)Tolerance

(mm)

Comments

A13.7± 0.1Transceiver width, nosepiece or front that extends inside cage B8.6± 0.1Transceiver height, front, that extends inside cage

C8.5± 0.1Transceiver height, rear

D13.4± 0.1Transceiver width, rear

E 1.0Maximum Extension of front sides outside of cage, see Note 2 Figure 1B

F 2.3Reference Location of cage grounding springs from centerline, top

G 4.2Reference Location of side cage grounding springs from top

H 2.0Maximum Width of cage grounding springs

J28.5Minimum Location of transition between nose piece and rear of

transceiver

K56.5Reference Transceiver overall length

L 1.1x45°Minimum Chamfer on bottom of housing

M 2.0± 0.25Height of rear shoulder from transceiver printed circuit board N 2.25± 0.1Location of printed circuit board to bottom of transceiver

P 1.0± 0.1Thickness of printed circuit board

Q9.2± 0.1Width of printed circuit board

R0.7Maximum Width of skirt in rear of transceiver

S45.0± 0.2Length from latch shoulder to rear of transceiver

T34.6± 0.3Length from latch shoulder to bottom opening of transceiver

U41.8± 0.15Length from latch shoulder to end of printed circuit board

V 2.5± 0.05Length from latch shoulder to shoulder of transceiver outside

of cage (location of positive stop).

W 1.7± 0.1Clearance for actuator tines

X9.0Reference Transceiver length extending outside of cage, see Note 2

Figure 1B

Y 2.0Maximum Maximum length of top and bottom of transceiver extending

outside of cage, see Note 2 Figure 1B

Z0.45± 0.05Height of latch boss

AA8.6Reference Transceiver height, front, that extends inside cage

AB 2.6Maximum Length of latch boss (design optional)

AC45°± 3°Entry angle of actuator

AD0.3Maximum Radius on entry angle of actuator

AE 6.3Reference Width of cavity that contains the actuator

AF 2.6± 0.05Width of latch boss (design optional)

AG0.40Minimum Maximum radius of front of latch boss, 2 places (design

optional)

Figure 1A. Drawing of SFP Transceiver

Notes:

1. Cage grounding springs permitted in this

area and may extend full length of

transceiver, 4 places. Grounding springs

may contribute a maximum force of 3.5N

(Newtons) to the withdrawal force of the

transceiver from the cage.

2. A representative MT-RJ configuration is

illustrated. Indicated outline defines the

preferred maximum envelope outside of

the cage.

3. Design of actuation method and shape is

optional.

4. Color code: An exposed colored feature of

the transceiver (a feature or surface

extending outside the cage assembly) shall

be color coded as follows:

?Black or beige for multi-mode

?Blue for single mode

Figure 1B. Drawing of SFP Transceiver (Cont.)

A2.Mating of SFP Transceiver PCB to SFP Electrical Connector

The SFP transceiver contains a printed circuit board that mates with the SFP electrical connector. The pads are designed for a sequenced mating:

?First mate – ground contacts

?Second mate – power contacts

?Third mate – signal contacts

The design of the mating portion of the transceiver printed circuit board is illustrated in Figure 2 and the electrical pad layout is illustrated in Figure 3. A typical contact pad plating for the printed circuit board is 0.38 micrometers minimum hard gold over 1.27 micrometers minimum thick nickel.Other plating options that meet the performance requirements are acceptable.

Figure 2. Recommended Pattern Layout for SFP Printed Circuit Board

Figure 3. SFP Transceiver Electrical Pad Layout

A3. Host Board Layout

A typical host board mechanical layout for attaching the SFP Connector and Cage System is shown in Figures 4A and 4B.

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Top of Board

Bottom of Board (as viewed thru top of board)

Figure 4A. SFP Host Board Mechanical Layout

Figure 4B. SFP Host Board Mechanical Layout (Cont.)

A4. Insertion, Extraction and Retention Forces for SFP Transceivers

The requirement for the various functional forces and the durability cycles are specified in Table 2.

Table 2. Insertion, Extraction, and Retention Forces Measurement Minimum Maximum Units Comments

SFP transceiver insertion040Newtons

SFP transceiver extraction011.5Newtons

SFP transceiver retention90170Newtons No damage to transceiver

below 90N Cage retention (Latch strength)180N/A Newtons No damage to latch below

180N Cage kickout spring force11.522Newtons

Insertion / removal cycles,

connector/cage

100N/A cycles

Insertion / removal cycles, SFP transceiver 50N/A cycles

A5. Labeling of SFP Transceivers

Color coding requirements for optical SFP transceivers are specified in Figure 1B.

Each SFP transceiver should be clearly labeled. The complete labeling need not be visible when the SFP transceiver is installed. Labeling should include appropriate manufacturing and part number identification, appropriate regulatory compliance labeling, and a clear specification of the external port characteristics. The external port characteristic label may include such information as optical wavelength, required fiber characteristics, operating data rate, interface standards supported, and link length supported.

A6. Bezel Design for Systems Using SFP Transceivers

Host enclosures that use SFP devices should provide appropriate clearances between the SFP transceivers to allow insertion and extraction without the use of special tools and a bezel enclosure with sufficient mechanical strength. For most systems a nominal centerline to centerline spacing of 16.25mm (0.640”) is sufficient. See Figure 5 for the recommended bezel design. For double-sided board mounting, a printed circuit board thickness of 3.0mm (0.118”) is required.

The SFP transceiver insertion slot should be clear of nearby moldings and covers that might block convenient access to the latching mechanisms, the SFP transceiver, or the cables connected to the SFP transceiver.

Figure 5. Recommended Bezel Design

A7. SFP Electrical Connector Mechanical Specifications

The SFP Connector is a 20-contact, right angle surface mount connector. It is described in Table 3 and Figure 6. The plating on the contacts is specified as follows:

? Contact area:0.38 micrometers minimum hard gold over 2.54 micrometers minimum thick nickel

?Solder terminal area: gold flash or 2.54 micrometers tin lead plating over 2.54 minimum thick nickel.

Table 3. SFP Transceiver Connector Dimensions

Designator Dimension

(mm)Tolerance

(mm)

Comments

A9.4± 0.08Connector card slot width

B 1.4± 0.05Guide pin diameter

C11.2Maximum Connector width

D9.2Maximum Connector length

E 3.5Reference Distance from centerline of connector

to outer contact

F 3.9Reference Distance from centerline of connector

to outer contact

G 1.35Maximum Connector card slot height

H 2.6Minimum Height from bottom of connector to

bottom of card slot

J9.6TP Distance between guide pins

K0.9Reference Diamond guide pin width

L 1.4± 0.05Diamond guide pin length

M 5.4Maximum Connector height

N0.8Reference Length of solder leads past housing,

front & rear

P 6.0Minimum Depth of card slot from front face of

housing

Q 3.0Maximum Depth of contact point from front face

of connector

R0.7± 0.1Size of chamfer on top face of

connector

S0.3Reference Distance boss extends past front face

of connector

T 1.0Minimum Size of chamfer at entry of card slot,

all around

U 4.5Reference Length from centerline of guide posts

to end of solder lead

Figure 6. SFP Transceiver Connector Illustration

A8. SFP Cage Assembly Dimensions

The SFP Cage Assembly consists of two components: a lower cage that is soldered to the host board and a top cage that is assembled to the lower cage after soldering. A reference drawing describing the SFP Cage Assembly is provided in Table 4 and Figures 7A and 7B. The cage material is copper alloy and plating options are:

?Tin-lead plate 2.54 micrometers minimum over copper flash

?Tin plate 2.54 micrometers minimum over 0.76 micrometers minimum nickel

Table 4. Dimension Table for Drawing of SFP Cage Assembly

Designator Dimension

(mm)Tolerance

(mm)

Comments

A48.8Maximum Overall length

B8.3Maximum Length from inside top of cage to latch

C14.0± 0.1Inside width of cage

D14.25Basic Distance between solderleg centerlines on side of cage E0.249± 0.025Thickness of solderleg

F9.0Basic Distance between vent holes along length

G11.8Basic Distance from front of cage to beginning of center vent

hole row

H7.9Basic Distance between vent holes across the width of the

cage

J 2.0± 0.1Diameter of vent holes

K16.5Basic Distance from front of cage to solderleg

L10.0Basic Distance between chassis ground solderlegs along side M0.6± 0.1Width of EMI pins

N0.7± 0.1Width of all chassis ground solderlegs

P 2.0Maximum Width of solderleg shoulder

Q 1.25Maximum Length of solderleg

R 3.95Basic Distance from centerline of cage to centerline of

chassis ground solderleg

S 1.45Basic Distance from centerline of cage to centerline of

chassis ground solderleg

T 1.45Basic Distance from centerline of cage to centerline of

chassis ground solderleg

U 4.8Basic Distance from centerline of cage to centerline of EMI

pins

V0.5± 0.05Width of EMI pins on top cage

W9.2± 0.15Distance from inside top of cage to inside bottom

surface of front section of cage assembly

X9.8Maximum Maximum height of cage assembly from host board

Z10.0Basic Distance between chassis ground solderlegs along side AA11.5Basic Distance from front of cage to solderleg

AB7.5Minimum Length of 9.2 (W) dimension from front of cage

AC15.0Maximum Maximum width of cage assembly

AD13.9Minimum Minimum width of inside of cage

AE8.95± 0.15Height of inside of cage assembly

AF 1.0Minimum Height of clearance slots

AG 2.4Basic Distance of clearance slots from cage centerline

Table 4. Dimension Table for Drawing of SFP Cage Assembly (Cont.)

Designator Dimension

(mm)Tolerance

(mm)

Comments

AH 3.0± 0.1Width of clearance slots

AJ 2.35± 0.1Distance from front of cage to latch opening

AK 2.8± 0.1Length of latch opening

AL0.5Minimum Height of latch lead-in

AM45.6Maximum Distance from front of cage to kickout spring

AN35.0Maximum Distance from front of cage to end of cage floor

AP0.7± 0.1Width of solderlegs that extend from floor of cage

AQ 5.1Maximum Width of latch

AR 3.0± 0.05Width of latch opening

AS16.3Basic Front of cage to beginning of outer vent hole rows

AT0.65Maximum Inside radius of cage, four places

AU 5.8Minimum Distance between panel ground spring supports

AV12.7Maximum

recommended

Length of plug extending outside of the cage AW15.75Maximum Width of plug extending outside of the cage

AX10.9Maximum Height of plug extending outside of the cage

A9. Dust / EMI Cover

The order to prevent contamination of the internal components and to optimize EMI performance, it is recommended that a Dust/EMI Plug be inserted into cage assemblies when no transceiver is present. The maximum dimensions of the Dust/EMI Cover are listed in Table 4 and the maximum size is illustrated in Figure 7A. The Dust/EMI Cover shall exert a maximum force of 4.0 Newtons per side to the inside surfaces of the cage. This force shall be measured as the force/side required to compress the Dust/EMI Cover’s compliant feature(s) to the maximum dimensions listed in Table 4 (Illustrated in Figure 7A).

Figure 7A. SFP Cage Assembly

Figure 7B. SFP Cage Assembly (Cont.)

Appendix B. Electrical Interface

B1. Introduction

This annex contains pin definition data for the small form-factor pluggable (SFP) transceiver.The pin definition data is specific to gigabit rate datacom applications such as Fibre Channel and Gigabit Ethernet. It is expected that different pin definitions will be developed for SONET/ATM and lower data rate datacom applications.

B2. Pin Definitions

Figure 1 below shows the pin names and numbering for the connector block on the host board.The diagram is in the same relative orientation as the host board layout (see Appendix A,Figure 4.). As mentioned, this pinout only applies to gigabit rate datacom applications. The pin functions are defined in Table 1 and the accompanying notes. Figure 2A shows the recommended power supply filtering network. Figure 2B shows an example of a complete SFP host board schematic with connections to SerDes and protocol ICs. For EMI protection the signals to the 20-pin connector should be shut off when the transceiver is removed.Standard board layout practices such as connections to Vcc and GND with Vias, use of short-and equal-length differential signal lines, use of microstrip-lines and 50? terminations are recommended. Chassis grounds and external electromagnetic interference shields should not

be attached to circuit ground.

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Figure 1. Diagram of Host Board Connector Block Pin Numbers and Names