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HMC234C8
GaAs MMIC SMT HIGH ISOLATION
SPDT SWITCH, DC - 8.0 GHz
v03.1105
General Description
Features
Functional Diagram The H MC234C8 is a broadband high isolation non-refl ective GaAs MESFET SPDT switch in a non-hermetic surface mount ceramic package. Covering DC to 8.0 GHz, the switch features >52 dB isolation up to 2 GH z and >38 dB isolation up to 8.0 GH z. The switch operates using complementary negative control voltage logic lines of -5/0V and requires no bias supply. This product is an excellent pin-for-pin replacement to the SMDI SSW124.
Isolation: 52 dB @ 2.0 GHz 40 dB @ 6.0 GHz
Insertion Loss: 1.6 dB Typical @ 6.0 GHz Non-Refl
ective Design
Surface Mount Ceramic Package
Electrical Specifications, T A = +25° C, With 0/-5V Control, 50 Ohm System
Typical Applications
The HMC234C8 is ideal for:? Telecom Infrastructure ? Microwave Radio & VSAT ? Military Radios, Radar & ECM
? Test Instrumentation
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Input Third Order Intercept Point
Return Loss
0.1 and 1 dB Input Compression Point
Insertion Loss
Isolation
-5
-4
-3
-2
-1
1
2
3
4
5
6
7
8
I N S E R T I O N L O S S (d B )
FREQUENCY (GHz)
-80
-70-60-50-40-30-20-10
00
1
2
3456
7
8
I S O L A T I O N (d B )
FREQUENCY (GHz)
-30
-25-20-15-10-5
00
1
2
3456
7
8
R E T U R N L O S S (d B )
FREQUENCY (GHz)
15
20
25
3035
1
2
3456
7
8
I N P U T P 1d B (d B m )
FREQUENCY (GHz)
30
35404550
55600
1
2
3456
7
8
I N P U T I P 3 (d B m )FREQUENCY (GHz)
SPDT SWITCH, DC - 8.0 GHz
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Truth Table
Absolute Maximum Ratings
Control Voltages
Outline Drawing
NOTES:
1. PACKAGE BODY MATERIAL: WHITE ALUMINA 92%
2. LEAD, PACKAGE BOTTOM MATERIAL: COPPER
3. PLATING: ELECTROLYTIC GOLD 100-200 MICROINCHES, OVER
ELECTROLYTIC NICKEL 100-250 MICROINCHES.4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. PACKAGE LENGTH AND WIDTH DIMENSIONS DO NOT INCLUDE LID SEAL PROTRUSION .005 PER SIDE.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
Caution: Do not “Hot Switch” power levels greater than +26
dBm (Vctl = 0/-5 Vdc).
ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS
SPDT SWITCH, DC - 8.0 GHz
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Pin Descriptions
Suggested Driver Circuit
SPDT SWITCH, DC - 8.0 GHz
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Evaluation PCB
The circuit board used in the fi nal application should be generated with proper RF circuit design tech-niques. Signal lines at the RF port should have 50 ohm impedance and the package ground leads and package bottom should be connected directly to the ground plane similar to that shown above. The eval-uation circuit board shown above is available from Hittite Microwave Corporation upon request.
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
SPDT SWITCH, DC - 8.0 GHz
List of Materials for Evaluation PCB 105771 [1]
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Notes:
SPDT SWITCH, DC - 8.0 GHz