Hitachi 低温ACF AC7823KM

Hitachi Chemical Data Sheet

Anisotropic Conductive Film

ANISOLM?

AC-7823YM

Revised on 20 Nov., 2013

1.Standard specification, bonding condition, storage condition and characteristic (1)

2.Precautions in bonding (2)

3.Connection reliability (3)

4.Reaction rate (7)

5.Physical property (8)

Hitachi Chemical Co., LTD.,

Advanced Interconnect Material R&D Dept.

Material Polymer Science Sector

Notes:

1)Take ANISOLM out of the refrigerator or other storage without taking it out of its hermetic containers. Leave the ANISOLM in the containers at room temperature for about an hour. Then make sure that it does not risk condensation before using it.

2)C onnection resistance: The table indicates a half of the resistance between neighboring circuits.

Current measured: 1mA. Includes the circuit resistances of the FPC and ITO glass.

3)Operating range: As per reliability tests using Hitachi’s test pieces.(This range varies according to the material

used and external stress applied. Check the reliability of specific pieces.)

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2. Precautions in bonding

2.1 Connection time and ANISOLM temperature (Typical)

Boning condition: 180Deg.C-5s / 180Deg.C-10s Heat head setting temp. : 360Deg.C (5s) / 345Deg.C (10s) FPC: P=0.15, Cu: 18um, Au plated Thickness of glass TEG: 1.1mmt

Ratio of temperature reached 2 seconds later: 90% or more of the ultimate temperature (Deg.C)

Ratio of temperature reached 3 seconds later:

90% or more of the ultimate temperature (Deg.C)

2.2 Measuring ANISOLM temperature

2.3 Heat/Pressure Head

(1) Adjust carefully the evenness and parallelism of the heating head to keep the equal pressure. (2) Tip the head with a thin and hard cushion, not a soft and thick one. Silicone rubber (about 0.2 mm

thick with hardness of 70 degrees or above) may be used for example. The use of too soft a cushion or excessive pressure in connection will drive adhesive in the space toward the end,

resulting in insufficient adhesion. Be particularly careful when the space is wider than the circuits.

Misalignment of Opposite Circuits

(1) Align opposite circuits well. Do not let them get misaligned.

(2) In designing TABs (FPCs), allow for the misalignment of opposite circuits due to

their expansion during connection.

(3) Keep the circuit misalignment at or less than the circuit width.

Heat head

Teflon sheet （25,50μｍｔ）

Silicone rubber cushion （0.2～0.3ｍｍｔ）

3 Connection reliability

(1)Peel strength（High temp.- high humidity test）

ACF width: 1.0mm

Bonding condition: 165, 180, 205Deg.C-5s-3MPa, 160, 170, 205Deg.C-10s-3MPa

Silicone rubber 0.2mmt ，Teflon sheet 0.06mmt

TEG: Hitachi’s FPC (P=0.15, Cu: 18um, Au plated) / Hitachi’s ITO all coated TEG glass 1.1mmt Test condition: 85Deg.C-85%RH

5s bonding

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(2)Reliability of connection resistance（High temp.- high humidity test）ACF width: 1.0mm

Bonding condition: 165, 180, 205Deg.C-5s-3MPa, 160, 170, 205Deg.C-10s-3MPa

Silicone rubber 0.2mmt ，Teflon sheet 0.06mmt

TEG: Hitachi’s FPC (P=0.15 Cu: 18um, Au plated) / Hitachi’s ITO all coated TEG glass 1.1mmt Test condition: 85Deg.C-85%RH

5s bonding

10s bonding

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(3)Reliability of connection resistance（Heat cycle）

ACF width: 1.0mm

Bonding condition: 165, 180, 205Deg.C-5s-3MPa, 160, 170, 205Deg.C-10s-3MPa

Silicone rubber 0.2mmt ，Teflon sheet 0.06mmt

TEG: Hitachi’s FPC (P=0.15 Cu: 18um, Au plated) / Hitachi’s ITO all coated TEG glass 1.1mmt Test condition: -40Deg.C(30min)?100Deg.C(30min)

5s bonding

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(4) Reliability of insulation resistance（High temp. - High humidity test）ACF width: 1.0mm

Bonding condition: 185Deg.C-5s-3MPa, 185Deg.C-10s-3MPa

Silicone rubber 0.2mmt ，Teflon sheet 0.06mmt

TEG: Hitachi’s comb circuit TCP (P=0.05 Cu: 18um, Sn plated) / Hitachi’s Insulation glass Test condition: 85Deg.C-85%RH

Resistance measuring condition: 50V-60s

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4 Reaction rate

Bonding condition: 155~205Deg.C-5, 10s-3MPa

Silicone rubber 0.2mmt ，Teflon sheet 0.06mmt

TEG: Hitachi’s FPC (P=0.15 Cu: 18um, Au plated) / Hitachi’s ITO all coated TEG glass (1.1mmt)

The amount of heat generated was measured with a DSC unit, and the reaction rate was determined with the following formula;

Reaction rate = (Q0-Q T)/Q0×100

Q0：initial amount of heat generated

Q T：amount of heat generated after hardening

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5 Physical properties

Curing condition: 180Deg.C-1hour

Measurement condition: -40 ～200Deg.C 5Deg.C/min, 1Hz

ANISOLM Elastic modules(Gpa)

Tg (Deg.C) 40Deg.C

AC-7823 0.4 90

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