LMA419中文资料
?FEATURES
?18 GHz to 22 GHz Frequency Band
? 2.5 dB Noise Figure
?22 dB Gain
? 5 dBm Output Power at Saturation
?12 dB Input/Output Return Loss
?+3 V Single Bias Supply
?DESCRIPTION AND APPLICATIONS
The Filtronic Solid State LMA419 is a low noise PHEMT amplifier that operates from 18 to 22GHz.
This 3-stage reactively matched amplifier provides 22dB nominal gain with 2.5dB typical noise figure and saturated power output of +5dBm The LMA419 is designed for commercial mm-W (millimeter-wave) PCN/PCS applications. Ground is provided to the circuitry through vias to the backside metallization.
?ELECTRICAL SPECIFICATIONS @ T Ambient = 25°C
(V DD = +3.0V, Z IN = Z OUT = 50?)
Parameter Symbol Test Conditions Min Typ Max Units Frequency Band F1822GHz
Small Signal Gain S21I DS = 20 mA1822dB Small Signal Gain Flatness?S21±0.8±1.0dB Noise Figure NF 2.5 3.0dB Input Return Loss S11-12-9dB
Output Return Loss S22-12-9dB
Reverse Isolation S12-40dB
?ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Test Conditions Min Max Units Drain Voltage V D T Ambient = 22 ± 3 °C4V
Operating Current I OP T Ambient = 22 ± 3 °C90mA
RF Input Power P IN T Ambient = 22 ± 3 °C-10dBm Total Power Dissipation P TOT T Ambient = 22 ± 3 °C0.4W Channel Operating Temperature T CH T Ambient = 22 ± 3 °C150oC Storage Temperature T STG—-65165oC Maximum Assembly Temperature
T MAX—300oC
(1 min. max.)
Notes:
?Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device.
?Recommended Continuous Operating Limits should be observed for reliable device operation.
?Power Dissipation defined as: P TOT≡ (P DC + P IN) – P OUT, where
P DC: DC Bias Power
P IN: RF Input Power
P OUT: RF Output Power
?This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices.
?ASSEMBLY DRAWING
Notes:
?Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25μm) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended. Ultrasonic bonding is not recommended.
?The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes.
?Bond on bond or stitch bond acceptable.
?Conductor over conductor acceptable. Conductors must not short.
?MECHANICAL OUTLINE
Notes:
?All units are in microns (μm).
?All bond pads are 100 X 100 μm2.
?Bias pad (V DD) size is 100 X 121.5 μm2.
?Unless otherwise specified.
?HANDLING PRECAUTIONS
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263.
All information and specifications are subject to change without notice.