Dimensions (mm)
Solder pad Layout (mm)
NOTE:
I hold = Hold current: maximum current device will pass without tripping in 20 °C still air. I trip = Trip current: minimum current at which the device will trip in 20 °C still air.
V max = Maximum voltage device can withstand without damage at rated current (I max ) I max = Maximum fault current device can withstand without damage at rated voltage (V max )
P d = Power dissipated from device when in the tripped state at 20 °C still air.R min = Minimum resistance of device in initial (un-soldered) state.
R 1max = Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.Caution: Operation beyond the speci ? ed rating may result in damage and possible arcing and ? ame.Speci ? cations are subject to change without notice
Order
P OLYFUSE ? R ESETTABLE F USES
Speci ? cations
Packaging A
Blistertape and reel ? 178 mm
Materials Terminals: Solder-plated copper TS: Solder Material: 63/37 SnPb TF: Lead free plating on request Max. Device Surface Temperature in Tripped State 125 °C
Operating / Storage Temperature
-40 oC to +85 oC (consider de-rating)Humidity Ageing
+85 °C, 85 % R.H., 1000 hours, ± 5 % typical resistance change Vibration
MIL-STD-883C, Method 2007.1, Condition A, no change Thermal Shock
MIL-STD-202F, Method 107G
+85 °C to -40 °C 20 times, -30 % typical resistance change Solderability
Meets EIA Speci ? cation RS186-9E, ANSI/J-STD-002, Category 3 Re ? ow only
Solvent Resistance
MIL-STD-202, Method 215, no change Marking
“P”, Part Code
SMD Type, 6 V - 30 V
Standard
UL 1434 1st
Edition
CSA C22.2 No. 0 CSA TIL No. CA-3A
Approvals
cULus Recognition TüV
Features
This product line is designed for surface-mount applications with a range in hold currents from 50 mA to 1.5 A and voltages from 6 V to 30 V. These smaller devices (1210-mil footprint) are ideally suited for palm PC, PDAs and applications where space is constrained and circuit protec-tion is required.Suitable for re ? ow soldering
WebLinks
Further info see:
https://www.wendangku.net/doc/556432358.html,
Further application info see fuseology:
https://www.wendangku.net/doc/556432358.html,/download/fuseology.pdf
SMD1210
formerly No. 728
元器件交易网https://www.wendangku.net/doc/556432358.html,
A: SMD1210P005TS /TF B: SMD1210P010TS /TF C: SMD1210P020TS /TF D: SMD1210P035TS /TF E: SMD1210P050TS /TF F: SMD1210P075TS /TF G: SMD1210P110TS /TF H: SMD1210P150TS
/TF
Thermal Derating Chart
0.10
1.00
10.00
Fault Current (Amp.)
0.01
0.10
1.00
10.00
100.00
A
B
C
D E
F
G
H
T i m e t o T r i p (S e c .)
P OLYFUSE ? R ESETTABLE F USES
SMD1210
元器件交易网https://www.wendangku.net/doc/556432358.html,