C1608C0G1H220G,C1608C0G1H150G,C1608C0G1H330G,规格书,Datasheet 资料

Issue date:April 2011

TDK MLCC US Catalog

C Series

Tight Tolerance Capacitors

Type:

C1005 [EIA CC0402]C1608 [EIA CC0603]

REMINDERS

Please read before using this product

REMINDERS

1.If you intend to use a product listed in this catalog for a purpose that may cause loss of life or other

damage,you must contact our company’s sales window.

2.We may modify products or discontinue production of a product listed in this catalog without prior

notification.

3.We provide“Delivery Specification”that explain precautions for the specifications and safety of each

product listed in this catalog.We strongly recommend that you exchange these delivery specifications with customers that use one of these products.

4.If you plan to export a product listed in this catalog,keep in mind that it may be a restricted item according

to the“Foreign Exchange and Foreign Trade Control Law”.In such cases,it is necessary to acquire export permission in harmony with this law.

5.Any reproduction or transferring of the contents of this catalog is prohibited without prior permission from

our company.

6.We are not responsible for problems that occur related to the intellectual property rights or other rights of

our company or a third party when you use a product listed in this catalog.We do not grant license of these rights.

7.This catalog only applies to products purchased through our company or one of our company’s official

agencies.This catalog does not apply to products that are purchased through other third parties.

? Available in 1% and 2% capacitance tolerance ? Suitable for high frequency applications

? A monolithic structure ensures superior mechanical strength and reliability

? High -accuracy automatic mounting is facilitated through the maintenance of very precise dimensional tolerances ? Composed of only ceramics and metals, these

capacitors provide extremely dependable performance, exhibiting virtually no degradation even when subjected to temperature extremes

? Low stray capacitance ensures high conformity with nominal values, thereby simplifying the circuit design process

? Low residual inductance assures superior frequency characteristics

? Owing to their low ESR and excellent frequency characteristics, these products are optimally suited for high frequency and high

-density type power supplies

Applications

?Electronics equipment

?Mobile communications equipment ?LTE/WiMAX base stations ?High frequency RF modules

?Test and measurement equipment ?Matching/Coupling circuits ?Tuning circuits

Features

Shape &

Dimensions

Dimensions in mm

F Capacitance Tolerance

Packaging Style

Internal Codes Part Number Construction

The capacitance is expressed in three digit codes and in units of pico Farads (pF). The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier. R designates a decimal point.

Capacitance Code Capacitance 0R50.5pF 0101pF

1021,000pF (1nF)105

1,000,000pF (1μF)

Packaging Code Style

T

Tape & Reel Tolerance Code Tolerance F ±1%G

±2%

C1005C0G1H220G C0G 50V 22 ±2%0.50 ±0.05C1005C0G1H330F C0G 50V 33 ±1%0.50 ±0.05C1005C0G1H330G C0G 50V 33 ±2%0.50 ±0.05C1005C0G1H470F C0G 50V 47 ±1%0.50 ±0.05C1005C0G1H470G C0G 50V 47 ±2%0.50 ±0.05C1005C0G1H680F C0G 50V 68 ±1%0.50 ±0.05C1005C0G1H680G C0G 50V 68 ±2%0.50 ±0.05C1005C0G1H101F C0G 50V 100 ±1%0.50 ±0.05C1005C0G1H101G C0G 50V 100 ±2%0.50 ±0.05C1005C0G1H151F C0G 50V 150 ±1%0.50 ±0.05C1005C0G1H151G C0G 50V 150 ±2%0.50 ±0.05C1005C0G1H221F C0G 50V 220 ±1%0.50 ±0.05C1005C0G1H221G C0G 50V 220 ±2%0.50 ±0.05C1005C0G1H331F C0G 50V 330 ±1%0.50 ±0.05C1005C0G1H331G C0G 50V 330 ±2%0.50 ±0.05C1005C0G1H471F C0G 50V 470 ±1%0.50 ±0.05C1005C0G1H471G C0G 50V 470 ±2%0.50 ±0.05C1005C0G1H681F C0G 50V 680 ±1%0.50 ±0.05C1005C0G1H681G C0G 50V 680 ±2%0.50 ±0.05C1005C0G1H102F C0G 50V 1,000 ±1%0.50 ±0.05C1005C0G1H102G

C0G

50V

1,000

±2%

0.50 ±0.05

Capacitance Range Chart

Temperature Characteristics: C0G (0 ±Rated Voltage: 50V(1H)

Capacitance Range Chart

Temperature Characteristics: C0G (0 ±Rated Voltage: 100V (2A), 50V(1H)

TDK Part Number (Ordering Code)Temperature Characteristics

Rated Voltage Capacitance

(pF)

Capacitance Tolerance

Thickness (mm)C1608C0G1H150F C0G 50V 15 ±1%0.80 ±0.10C1608C0G1H150G C0G 50V 15 ±2%0.80 ±0.10C1608C0G1H220F C0G 50V 22 ±1%0.80 ±0.10C1608C0G1H220G C0G 50V 22 ±2%0.80 ±0.10C1608C0G1H330F C0G 50V 33 ±1%0.80 ±0.10C1608C0G1H330G C0G 50V 33 ±2%0.80 ±0.10C1608C0G1H470F C0G 50V 47 ±1%0.80 ±0.10C1608C0G1H470G C0G 50V 47 ±2%0.80 ±0.10C1608C0G1H680F C0G 50V 68 ±1%0.80 ±0.10C1608C0G1H680G C0G 50V 68 ±2%0.80 ±0.10C1608C0G1H101F C0G 50V 100 ±1%0.80 ±0.10C1608C0G1H101G C0G 50V 100 ±2%0.80 ±0.10C1608C0G1H151F C0G 50V 150 ±1%0.80 ±0.10C1608C0G1H151G C0G 50V 150 ±2%0.80 ±0.10C1608C0G1H221F C0G 50V 220 ±1%0.80 ±0.10C1608C0G1H221G C0G 50V 220 ±2%0.80 ±0.10C1608C0G1H331F C0G 50V 330 ±1%0.80 ±0.10C1608C0G1H331G C0G 50V 330 ±2%0.80 ±0.10C1608C0G1H471F C0G 50V 470 ±1%0.80 ±0.10C1608C0G1H471G C0G 50V 470 ±2%0.80 ±0.10C1608C0G1H681F C0G 50V 680 ±1%0.80 ±0.10C1608C0G1H681G C0G 50V 680 ±2%0.80 ±0.10C1608C0G1H102F C0G 50V 1,000 ±1%0.80 ±0.10C1608C0G1H102G C0G 50V 1,000 ±2%0.80 ±0.10C1608C0G2A101F C0G 100V 100 ±1%0.80 ±0.10C1608C0G2A101G C0G 100V 100 ±2%0.80 ±0.10C1608C0G2A102F C0G 100V 1,000 ±1%0.80 ±0.10C1608C0G2A102G

C0G

100V

1,000

±2%

0.80 ±0.10

Class 1 (Temperature Compensating)

Temperature Characteristics: C0G (-55 to 125oC, 0±30 ppm/oC)

No.

Item

Performance

Test or Inspection Method

1External Appearance No defects which may affect performance.Inspect with magnifying glass (3×).2Insulation Resistance 10,000M Ωmin.

Apply rated voltage for 60s.

3

Voltage Proof

Withstand test voltage without

insulation breakdown or other damage.

Above DC voltage shall be applied for 1 to 5s. Charge / discharge current shall not exceed 50mA.

4

Capacitance

Within the specified tolerance.

5

Q

(Class 1)

C : Rated capacitance (pF)

See No.4 in this table for measuring condition.

6

Temperature Characteristics of Capacitance (Class 1)

Capacitance drift

Within ±0.2% or ±0.05pF, whichever larger.

Temperature coefficient shall be calculated based on values at 25oC and 85oC temperature.

Measuring temperature below 20oC shall be -10oC and -25oC.

7

Robustness of Terminations

No sign of termination coming off,

breakage of ceramic, or other abnormal signs.

Reflow solder the capacitor on P.C. board (shown in Appendix 1) and apply a pushing force of 2N (C1005) or 5N (C1608) for 10±1s.

8Bending No mechanical damage.

Reflow solder the capacitor on P.C. board (shown in Appendix 2a or Appendix 2b) and bend it for 1mm.

Class Apply voltage Class 1

3 ×rated voltage

Class

Rated Capacitance Measuring Frequency Measuring voltage

Class 1

1000pF and under 1MHz ±10%

0.5 -5 V rms

Over 1000pF

1kHz ±10%

Rated Capacitance Q C ≥ 30pF 1,000 min.C < 30pF

400+20×C min.

T.C.Temperature Coefficient

C0G 0 ±

30 ppm/oC

1

No.

Item

Performance

Test or Inspection Method

9

Solderability

New solder to cover over 75% of termination.

25% may have pinholes or rough spots but not concentrated in one spot.Ceramic surface of A sections shall not be exposed due to melting or shifting of termination material.

Completely soak both terminations in solder at 235±5oC for 2±0.5s.Solder: H63A (JIS Z 3282)

Flux: Isopropyl alcohol (JIS K 8839)

Rosin (JIS K 5902) 25% solid solution.

10Resistance to solder heat Completely soak both terminations in solder at 260±5oC for 5±1s.Preheating condition

Temp.: 150±10oC Time : 1 to 2min.

Flux: Isopropyl alcohol (JIS K 8839)

Rosin (JIS K 5902) 25% solid solution.Solder: H63A (JIS Z 3282)

Leave the capacitor in ambient conditions for 6 to 24h before measurement.

External appearance No cracks are allowed and terminations shall be covered at least 60% with new solder.

Capacitance

Q (Class 1)

C : Rated capacitance (pF)

Insulation Resistance Meet the initial spec.Voltage Proof

No insulation breakdown or other damage.

11

Vibration Reflow solder the capacitor on P.C. board (shown in Appendix 1) before testing.

Vibrate the capacitor with amplitude of 1.5mm P-P

sweeping the frequencies from 10Hz to 55Hz and back to 10Hz after 1min.

Repeat this for 2h each in 3 perpendicular directions.

External appearance No mechanical damage.

Capacitance

Q (Class 1)

C : Rated capacitance (pF)

Characteristics Change from the value before test Class 1

C0G

Capacitance drift within ±2.5% or ±0.25pF, whichever larger.

Rated Capacitance Q C ≥ 30pF 1,000 min.C < 30pF

400 + 20×C min.

Characteristics Change from the value before test Class 1

C0G

Capacitance drift within ±2.5% or ±0.25pF, whichever larger.

Rated Capacitance Q C ≥ 30pF 1,000 min.C < 30pF

400+20×C min.

No.

Item

Performance

Test or Inspection Method

12

Temperature cycle Reflow solder the capacitors on a P.C. board (shown in Appendix 1) before testing.

Expose the capacitor in the conditions in step 1 through step 4, and repeat 5 times consecutively.Leave the capacitor in ambient conditions for 6 to 24h before measurement.

External appearance No mechanical damage.

Capacitance

Q (Class 1)

C : Rated capacitance (pF)

Insulation Resistance Meet the initial spec.

Voltage Proof

No insulation breakdown or other damage.

13

Moisture Resistance (Steady State)Reflow solder the capacitor on P.C. board (shown in Appendix 1) before testing.

Leave at temperature 40±2oC, 90 to 95%RH for 500 +24,0h.

Leave the capacitor in ambient condition for 6 to 24h before measurement.

External appearance No mechanical damage.

Capacitance

Q (Class 1)

C : Rated capacitance (pF)

Insulation Resistance

1,000M Ωmin.

Characteristics Change from the value before test Class 1

C0G

Capacitance drift within ±2.5% or ±0.25pF, whichever larger.

Rated Capacitance Q C ≥ 30pF 1,000 min.C < 30pF

400 + 20×C min.

Step Temperature (oC)Time (min.)1

Min. operating temp. ±330 ±32Reference Temp. 2 –53Max. operating temp. ±230 ±24

Reference Temp.

2 -5

Characteristics Change from the value before test Class 1

C0G

Capacitance drift within ±5% or ±0.5pF, whichever larger.Rated Capacitance Q C ≥ 30pF 350 min.

10pF ≤ C < 30pF 275 + 5/2×C min.C < 10pF

200 + 10×C min.

No.

Item

Performance

Test or Inspection Method

14

Moisture Resistance Reflow solder the capacitors on P.C. board (shown in Appendix 1) before testing.

Apply the rated voltage at temperature 40±2oC and 90 to 95%RH for 500 +24,0h.

Charge/discharge current shall not exceed 50mA.Leave the capacitor in ambient conditions for 6 to 24h before measurement.

Use this measurement for initial value.

External appearance No mechanical damage.

Capacitance

Q (Class 1)

C : Rated capacitance (pF)

Insulation Resistance

500M Ωmin.

15

Life Reflow solder the capacitor on P.C. board (shown in Appendix 1) before testing.

Apply 2x rated voltage at 125±2oC for 1,000 +48, 0h.Charge/discharge current shall not exceed 50mA.Leave the capacitors in ambient condition for 6 to 24h before measurement.

Use this measurement for initial value.

External appearance No mechanical damage.

Capacitance

Q (Class 1)

C : Rated capacitance (pF)

Insulation Resistance

1,000M Ωmin.

Characteristics Change from the value before test Class 1

C0G

Capacitance drift within ±7.5% or ±0.75pF, whichever larger.

Rated Capacitance Q C ≥ 30pF 200 min.

C < 30pF

100 + 10/3×C min.

Characteristics Change from the value before test Class 1

C0G

Capacitance drift within ±3% or ±0.3pF, whichever larger.

Rated Capacitance Q C ≥ 30pF 350 min.

10pF ≤ C < 30pF 275 + 5/2×C min.C < 10pF

200 + 10×C min.

Material : Glass Epoxy ( As per JIS C6484 GE4 )

P.C. Board thickness : Appendix-2a 0.8mm

Appendix-1, 2b 1.6mm

Copper ( thickness 0.035mm )

Solder resist

Case Code Dimensions (mm)

JIS EIA a b c C1005CC04020.4 1.50.5 C1608CC0603 1.0 3.0 1.2

Wave Soldering

Unit: mm

Type

Symbol

C1608[CC0603]A 0.7 -1.0B 0.8 -1.0C

0.6 -0.8

? Recommended Soldering Land Pattern

? Recommended Soldering Profile

Chip capacitor

Reflow Soldering

Unit: mm

Type

Symbol

C1005[CC0402]C1608[CC0603]A 0.3 -0.50.6 -0.8B 0.35 -0.450.6 -0.8C

0.4 -0.6

0.6 -0.8

solder

Higher tensile force on the chip capacitor may cause cracking.Adequate solder

solder

Small solder fillet may cause

contact failure or failure to hold the chip capacitor to the P.C. board.

? Recommended Solder Amount

Recommended soldering duration

Temp./Dura.

Solder

Wave Soldering Reflow Soldering Peak temp (°C)Duration (sec.)Peak temp (°C)Duration (sec.)Sn-Pb Solder 250 max. 3 max.230 max.20 max.Lead-Free Solder

260 max.

5 max.

260 max.

10 max.

Recommended solder compositions Sn-37Pb (Sn-Pb solder)

Sn-3.0Ag-0.5Cu (Lead Free Solder)Preheating Condition Soldering Case Size -JIS (EIA)Temp. (oC)Wave soldering

C1608(CC0603)

?T ≤ 150Reflow soldering C1005(CC0402), C1608(CC0603)?T ≤ 150Manual soldering

C1005(CC0402), C1608(CC0603)

?T ≤ 150

Reflow Soldering

Manual soldering (Solder iron)

Wave Soldering

Peak

Soldering

Natural T e m p . (oC )

Natural

? Carrier Tape Configuration

? Chip Quantity Per Reel and Structure of Reel

? Peel Back Force (Top Tape)

? Carrier tape shall be flexible enough to be wound around a minimum radius of 30mm with components in tape.

? The missing of components shall be less than 0.1%

? Components shall not stick to the cover tape.? The cover tape shall not protrude beyond the edges of the carrier tape and shall not cover the sprocket holes.

Bottom cover tape

Paper Carrier Tape & Reel

Case Code Chip Thickness (mm)Taping Material Chip quantity (pcs.)

JIS EIA φ178mm (7”) reel φ330mm (13”)

reel C1005CC04020.50Paper

10,00050,000C1608

CC0603

0.80

4,00010,000

Direction of pull force

Drawing direction

? Shape & Dimensions

TDK Corporation established internal product environmental assurance standards that include the six hazardous

substances banned by the EU RoHS Directive 1enforced on July 1, 2006 along with additional substances independently banned by TDK and has successfully completed making general purpose electronic components conform to the RoHS Directive 2.

https://www.wendangku.net/doc/5f11941585.html, MATERIAL Class 1(1)Ceramic Dielectric CaZrO 3(2)Internal Electrode

Nickel (Ni)(3)Termination Copper (Cu)(4)Nickel (Ni)(5)

Tin (Sn)

? Inside Structure & Material System

Case Code Dimensions (mm)

JIS EIA L

W T B G C1005CC0402 1.000.500.500.250.35 min.C1608CC0603

1.60

0.800.800.20 min.0.50 min.

? Environmental Information

1.

Abbreviation for Restriction on Hazardous Substances, which refers to the regulation EU

Directive 2002/95/EC on hazardous substances by the European Union (EU) effective from July 1, 2006. The Directive bans the use of six specific hazardous substances in electric and electronic devices and products handled within the EU. The six substances are lead, mercury, cadmium, hexavalent chromium, PBB (polybrominated biphenyls), and PBDE (polybrominated diphenyl ethers).

2.

This means that, in conformity with the EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

For REACH (SVHC : 15 substances according to ECHA /

October 2008) : All TDK MLCC do not contain these 15 substances.

For European Directive 2000/53/CE and 2005/673/CE :

Cadmium, Hexavalent Chromium, Mercury, Lead are not contained in all TDK MLCC.

For European Directive 2003/11/CE : Pentabromodiphenyl-ether, Octabromodiphenyl-ether are not contained in all TDK MLCC.