INPAQ ESD Guard TEA10402V15A0 Specification_A2

INPAQ

Global RF/Component Solutions

Specification

TEA10402V15A0

Product Name ESD Guard TM

Series TEA Series (Thin Film Air Gap) Part No TEA10402V15A0

Size EIA 0402

Global RF/Component Solutions Array TEA10402V15A0 Engineering Specification

1. Scope

This specification is applied to electrostatic discharge (ESD) protection. It is designed to protect the high-speed data lines against ESD transients. It has very low capacitance and fast turn on times makes it ideal for data and transmission lines with high data rates. It can apply to HDMI, USB3.0, Display port, Thunderbolt, etc.

For RoHS Compliance.

Feature

z Protection against ESD voltages and currents (IEC61000-4-2 Level 4)

z Extremely quick response time (<1ns) present ideal ESD protection

z Extremely low capacitance (0.05pF typical)

z Bi-directional device

z SMD (Surface Mount Device)

z Zero signal distortion

2. Explanation of Part Number

1：Thin Film ESD gauard(air gap type)

2：Single element

3：Chip size, EIA 0402

4：Max rated Voltage , VDC

5：”A0”：Model Code

3. Circuit symbol

4. Construction & Dimensions

4.1. Substrate : Ceramic (Alumina)

4.2. End termination: Ni/Sn

4.3. Construction & Dimension :

Unit: mm L W H B

1.0±0.1 0.5±0.1 0.38±0.1 0.25±0.15

5. Performance Characteristics

Symbol Unit Min. Typical Max.

Trigger voltage Vt V 300

Clamping voltage Vc V 20

Capacitance, @1MHz Cp pF 0.05

Response time ns 1

ESD voltage capability,

kV 8 Contact discharge mode

ESD voltage capability, Air

kV 15 discharge mode

ESD pulse withstand pulses 1,000

Vt – measurement by using Transmission Line Pulse (TLP)

Vc –measurement by using Transmission Line Pulse (TLP)

Cp – Device capacitance measured with 0Vrms

6. General specifications

6.1. Temperature Specifications

Operating Temperature range : -40℃ to +85℃

6.2. Environmental Specifications

Item Specifications Test

condition Reference

Thermal Shock

I L≦ 10 μA -40℃ to 85℃, 30

min. cycle, 5 cycles

JIS C 0025

(1998)Test Na

High Temperature load voltage I L≦ 10 μA

Rated voltage, 85℃,

1000 hrs

MIL-STD-202G

Method 108

Solder leach resistance I L≦ 10 μA 260℃, 10s MIL-STD-202G

Method 210F

I L – Leakage current at rated voltage, the maximum leakage current was measured after reliability test.

7. Taping Package and Label Marking

7.1. Carrier tape dimensions

0402

A 8.00±0.30

B 3.50±0.05

C 1.75±0.10

D 2.00±0.05

E 4.00±0.10

F 1.50±0.10

L 1.19±0.05

W 0.69±0.05

T 0.40±0.03

7.2. Taping reel dimensions

7.3. Taping specifications

There shall be the portion having no product in both the head

and the end of taping, and there shall be the cover tape in the

head of taping.

7.4. Label Marking

The label specified as follows shall be put on the side of reel.

(1) Part No.

(2) Quantity

(3) Lot No.

* Part No. And Quantity shall be marked on outer packaging.

7.5. Quantity of products in the taping package

(1) Standard quantity：10000pcs/Reel

(2) Shipping quantity is a multiple of standard quantity.

8. Precautions for Handling

8.1. Solder cream in reflow soldering

Refer to the recommendable land pattern as printing mask pattern for solder cream. (1) Print solder in a thickness of 0.15 to 0.2 mm.

Unit : mm(inch)

8.2. Precaution for handling of substrate

Do not exceed to bend the board after soldering this product extremely. (reference examples)

? Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board.

? Do not bend extremely the board, in mounting another components.

If necessary, use back-up pin (support pin) to prevent from bending extremely. ? Do not break the board by hand. We recommend to use the machine or the jig to break it.

8.3. Precaution for soldering

Note that this product will be easily damaged by rapid heating, rapid cooling or local heating.

Do not give heat shock over 100°C in the process of soldering. We recommend to take preheating and gradual cooling.

8.4.

Recommendable reflow soldering

Reference IPC-020c-5-1

Profile Feature Pb free Assembly Average Ramp Rate (Ts max to Tp)

3 ℃/second max Preheat

- Temperature Min (Ts min ) - Temperature Min (Ts max ) - Time(ts min to ts min )

150℃ 200℃

60-180 seconds Time maintained above: - Temperature (T L ) - Time (t L )

217℃

60-150 seconds Peak Temperature (T p )

260 +0/℃-5 ℃

Time within 5 of actual Peak ℃Temperature (T p ) 20-40 seconds Ramp-Down Rate

6 /second max.℃ Time 25 to Peak Temperature ℃

8 minutes max

8.5. Soldering gun procedure

Note the follows, in case of using solder gun for replacement.

(1) The tip temperature must be less than 280°C for the period within 3 seconds by using

soldering gun under 30 W.

(2) The soldering gun tip shall not touch this product directly.

8.6. Soldering volume

Note that excess of soldering volume will easily get crack the body of this product.

8.7. Taping Package Storage Condition

Storage Temperature : 5 to 40 ℃

Relative Humidity: < 65%RH

Storage Time : 12 months max