半导体专业名词缩写表
A/D analog to digital
AA atomic absorption
AAS atomic absorption spectroscopy
ABC activity‐based costing
ABM activity‐based management
AC alternating current; activated carbon
ACF anisotropic conductive film
ACI after‐clean inspection
ACP anisotropic conductive paste
ACT alternative control techniques; actual cycle time
ADC analog‐to‐digital converter
ADE advanced development environment
ADI after‐develop inspection
ADT applied diagnostic technique
ADTSEM Apply/Develop Track Specific Equipment Model
AE atomic emission; acousticemission; absolute ellipsometry AEC advanced equipment controller
AECS Advanced Equipment ControlSystem; Automated Equipment Control System
AEI after‐etch inspection; automated equipment interface AEM analytical electron microscopy
AES Auger emission/electron spectroscopy
AFM atomic force microscopy
AFP abrasive‐free polish
Ag silver
A‐GEMTF Advanced GEM Task Force
AGV automated guided vehicle
AHF anhydrous hydrogen fluoride
AHU air handling unit
AIR automated image retrieval
Al aluminum
ALD atomic layer deposition
ALE atomic layer epitaxy; application logic element
ALS advanced light source; advanced low‐power Schottky AMC airborne molecular contamination
AMHS automated material handling system
AMT advanced manufacturing technology
AMU atomic mass unit
ANN artificial neural network
ANOVA analysis of variance
AOV air‐operated valve
AP adhesion promoter
APA advanced performance algorithm
APC advanced process control
APCD add‐on pollution control device
APCFI Advanced Process Control Framework Initiative APCVD atmospheric pressure chemical vapor deposition APEC advanced process equipment control
API application programming interface; atmospheric pressure ionization
APM atmospheric passivation module; acoustic plate mode APRDL Advanced Products Research and Development Laboratory aPSM attenuating phase‐shift mask
AQI ACCESS query interface
AQL acceptable quality level
Ar argon
AR aspect ratio
ARAMS Automated Reliability
ARC antireflective coating
ARDE aspect ratio‐dependent etching
ARPA Advanced Research Projects Agency (see DARPA)
ARS angle‐resolved scattering
As arsenic
AS/RS automated storage and retrieval system
ASAP Advanced Stepper Application Program
ASIC application‐specific integrated circuit
ASO automatic shutoff
ASP advanced strip and passivation; advanced strip processor ASR automated send receive
ATDF Advanced ToolDevelopment Facility
ATE automatic test equipment
ATG automatic test generation
ATLAS abbreviated test language for all systems
atm atmosphere
ATP advanced technology program; adenosine triphosphate; acceptance and tool performance
ATR attenuated total reflectance
Att attenuated
Au gold
AVP advanced vertical processor
AVS advanced visualization system
AWE asymptotic waveform evaluation AWISPM above wafer in situ particle monitoring AWS advanced wet station
B billion; boron
Ba barium
BARC bottom antireflective coating
BASE Boston Area Semiconductor Education (Council)
BAW bulk acoustic wave
BC bias contrast
BDEV behavior‐level deviation
BDS Brownian Dynamics Simulation
Be beryllium
BEOL back end of line
BESOI bonded and etchback silicon on insulator
BF brightfield
BFGS Broyden‐Fletcher‐ Goldfarb‐Shanno optimization algorithm BFL buffered field‐effect transistor logic
BGA ball grid array
BHT Brinell hardness test
Bi bismuth
BiCMOS bipolar complementary metal‐oxide semiconductor BIFET bipolar field‐effect transistor
BIM binary intensity mask
BiMOS bipolar metal‐oxide semiconductor
BIST built‐in self‐test
BIT bulk ion temperature
BITE built‐in test equipment
BMC bubble memory controller
BMD bulk micro defect
BOE buffered oxide etchant
BOR bottom of range
BOSS Book of SEMI Standards; binary object storage system BOX buried oxide
BPR beam profile reflectometry; business process reengineering BPSG boron phosphosilicate glass
BPTEOS BPSG from a TEOS source
Br bromine
BSE backscattered electron detection
BTAB bumped tape automated bonding
BV breakdown voltage
C carbon
Ca calcium
CA CIM architecture
CAA CIM applications architecture
CAB Competitive Analysis Benchmarking
CAD computer‐aided design
CADT control application development tool
CAE computer‐aided engineering
CAI computer‐assisted instruction
CAM computer‐aided manufacturing
CAPS computer‐assisted problem solving
CAR chemically amplified resist
CARRI Computerized Assessment of Relative Risk Impacts
CASE computer‐aided softwareengineering; computer‐aided systems engineering
CAT computer‐aided testing
CAW Construction Analysis Workgroup CAWC cryogenic aerosol wafer cleaning CBGA ceramic ball grid array
CBS chemical bottle storage area
CBT computer‐based training
CC chip carrier; cluster controller CCC ceramic chip carrier
CCD charge‐coupled device
CCSL compatible current‐sinking logic CCW counterclockwise
Cd cadmium
CD critical dimension
CD/OL critical dimension overlay
CDA clean dry air
CDE chemical downstream etch
CDEM Customer Delivery Enterprise Model CDI collector‐diffusion isolation
CDM Common Device Model for SAB CDO controlled decomposition/oxidation CDR chemical distribution room
CDS chemical distribution system
Ce cerium
CE capillary electrophoresis
CEC cell evaluation chip
CEE control execution environment CEM continuous emissions monitoring CER‐DIP ceramic dual in‐line package
CFA component failure analysis
CFC chlorofluorocarbon
CFD computational fluid dynamics
CFM contamination‐free manufacturing CIC cleanroom interface chamber
CID charge‐injection device
CIE computer‐integrated engineering CIM computer‐integrated manufacturing
CIM‐OSA computer‐integrated manufacturing‐open systems architecture (ESPRIT program)
CIP Continuous Improvement Program
CIS Center for Integrated Systems
CISC complex instruction set computer
Cl chlorine
CLCC ceramic leaded chip carrier
CLIC closed‐loop intensity control
CM configuration management; cassette module
CMC cassette module controller
CML current mode logic
CMM capability maturity model
CMOS complementary metal‐oxide semiconductor
CMP chemical mechanical planarization
CMR common‐mode rejection ratio; cancel move request
CNC computer numerical control; condensation nucleus counter CNT carbon nanotube
Co cobalt
COB chip‐on‐board
COC cost of consumables
CODEC coder‐decoder
COED computer‐optimized experimental design
COGS cost of goods sold
CoO cost of ownership
CORBA common object request broker architecture
CORE composite object reference
COSS common object services specification
COT customer‐owned tooling
CoV coefficient of variance
Cp process capability
CPD concurrent product development
CPE Communications
CPGA ceramic pin grid array
Cpk process capability index
CQFP ceramic quad flat pack
CQN closed‐queuing network
Cr chromium
CRC cyclic redundancy check CRM Cost/Resource Model
Cs cesium
CSA CIM systems architecture CSE control systems engineering CSF critical success factor
CSL current‐steering logic CSMA/CD carrier‐sense
CSP chip‐scale package
CSPED concurrent semiconductor production and equipment development
CST CIM systems technology
CSTR continuously stirred tank reactor
CSV comma‐separated variable
CTC cluster tool controller
CTE coefficient of thermal expansion
CTI cycle time improvement
CTMC cluster tool modular communications
Cu copper
CUB central utility building
CUBES capacity utilization bottleneck efficiency system
CUI common user interface
CUSUM cumulative sum
CV capacitance‐to‐voltage
CVCM collected volatile condensable materials
CVD chemical vapor deposition
CW continuous wave
Cz Czochralski process
D/A digital to analog
D/B die bonding
DAC digital‐to‐analog converter
DAS direct absorption spectroscopy
DASSL differential algebraic system solver
DBMS database management system
DC direct current
DCA direct chip attachment
DCATS double‐contained acid transfer system
DCE distributed computer environment
DCL digital command language; display communication log DCS dichlorosilane
DDL device description language
DDMS defect data management system
DEDS discrete‐event dynamic simulation
DES data encryption standard; display equipment status
DF darkfield
DFC densified fluid clean
DFE dual‐frequency etch
DFM design for manufacturing
DFR design for reliability
DFT design for test
DFY design for yield
DHF dilute hydrofluoric acid
DI deionized; dielectric isolation
DIBL drain‐induced barrier leakage
DIC differential interference contrast
DIL dual in‐line
DIP dual in‐line package
DLBI device‐level burn‐in
DLOC developed source lines of code
DLS display lot status
DLT device‐level test
DLTS deep‐level transient spectroscopy
DMA direct memory access; dynamic mechanical analysis
DMH display message helps
DML data manipulation language; display message log
DMM digital multimeter
DMOS diffused metal‐oxide semiconductor
DMR display move requests
DO dynamic optimization
DOA dead‐on alignment
DOAS differential optical absorption spectroscopy
DOE design of experiments
DOF depth of focus
DOP dioctylphthalate
DPA destructive physical analysis
DPM digital panel meter
DPP discharge‐produced plasma
DPSRAM dual‐port static random access memory
DRAM dynamic random access memory
DRAPAC Design Rule and Process Architecture Council
DRC design rule check
DRE destruction removal efficiency
DRIFTS diffuse reflectance infrared Fourier transform spectroscopy
DRT defect review tool
DSA display system activity; dimensionally stable anode DSC differential scanning calorimetry
DSMC direct simulation Monte Carlo
DSQ downstream quartz
DSS display stocker status
DSW direct step‐on‐wafer
DT dynamic test
DTA differential thermal analysis
DTC direct thermocouple control
DTL diode transistor logic
DTM defect test monitor; delay time multiplier; device test module; digital terrain map
DTMPN defect test monitor phase number
DUT device under test
DUV deep ultraviolet
DV design verification
DVER design rule verification
DVM digital voltmeter
DVS display vehicle status
DWG domain work group
EAPSM embedded attenuated phase‐shift mask EAROM electrically alterable read‐only memory EASE equipment and software emulator
e‐beam electron beam
EBHT electron‐beam high‐throughput lithography EBIC electron beam‐induced current
EBR edge bead removal
EC engineering change; equipment controller ECA engineering capability assessment
ECAD electronic computer‐aided design; engineering computer‐aided design
ECAE electronic computer‐aided engineering ECL emitter coupled logic
ECN engineering change notice
ECO engineering change order
ECQB electrochemical quartz crystal balance ECR electron cyclotron resonance
EDA electronic design automation
EDS energy‐dispersive spectroscopy
EDU equipment‐dependent uptime
EDX energy‐dispersive X‐ray
EDXA energy‐dispersive X‐ray analysis
EEDF electron energy distribution function
EELS electron energy‐loss spectroscopy
EEPROM electrically erasable programmable read‐only memory EFEM equipment front‐end module
EFOCS evanescent fiber‐optic chemical sensor
EFTIR emission Fourier transform infrared spectroscopy EFV excess flow valve
EGE ethylene glycol ethers
EHS extremely hazardous substance
EI equipment integration
EID Equipment InterfaceDevelopment
EIP Equipment Improvement Program; Equipment Improvement Project
EIS electrochemical impedance spectroscopy
EKF extended Kalman filter
ELF extremely low frequency
EM enterprise model; electromagnetic; electromigration EMA equipment maturity assessment
EMC electromagnetic capability; electromagnetic compatability EMF electromagnetic field
EMG electromigration
EMI electromagnetic interference
EMMA electron microscopy and microanalysis
EMP electromagnetic pulse
EMR enter move request
EMU electromagnetic unit
EOS electrical overstress
EOT end of transfer; equivalent oxide thickness
EP extreme pressure; electropolish
EPL electron projection lithography
EPR electron paramagnetic resonance
EPROM electrically programmable read‐only memory
EPSS electronic performance support system
EPT equipment performance tracking
EQUIP C/I equipment control and integration
EQUIP RTC equipment real‐time control
ERAM equipment reliability
ERM enterprise reference model
ERN external recurrent neural network
ERP extended range pyrometer
ERS event reporting standard
ERT emergency response time
ES engineering specification; expert system
ESC electrostatic chuck
ESCA electron spectroscopy for chemical analysis
ESD electrostatic discharge
ESH environment
ESM electronic service manual
ETAB Executive Technical Advisory Board
ETQR External Total Quality and Reliability
EUV extreme ultraviolet
eV electron volt
EWMA exponentially weighted moving average
F fluorine
F/I final inspection
FA failure analysis
FAB fast atom bombardment
FAMOS floating‐gate avalanche‐injection metal‐oxide semiconductor FBGA fine‐pitch ball grid array
FC flip chip
FCM facilities cost model
FCS factory control system
FDC fault detection and classification
FDE frequency domain experiments
FDSOI fully depleted silicon on insulator
Fe iron
FEC fabrication evaluation chip
FEM finite element model
FEOL front end of line
FESEM field emission scanning electron microscopy
FET field‐effect transistor
FFT fast Fourier transform
FFU filter fan unit
FI filterability index; factory integration
FIB focused ion beam
FID flame ionization detector
FIFO first‐in
FIMS front‐opening interface mechanical standard
FL fuzzy logic
FLOPC floating point operations needed per cycle
FLOTOX floating gate tunnel oxide
FLRT factory layout/relayout tool
FM foreign material
FMEA failure mode and effects analysis
FMMC factory material movement component
FMVP Framework Member Validation Project
FNN feed‐forward neural network
FOCS fiber‐optic chemical sensor
FOSB front opening shipping box
FOUP front opening unified pod
FOV field of view
FOX field oxide
FP flash point
FPD focal plane deviation; flat panel display
FPGA field‐programmable gate array
FPLA field‐programmable logic array
FPLF field‐programmable logic family
FPLS field‐programmable logic switch
FPMS Factory Performance Modeling Software FPROM field‐programmable read‐only memory FRACAS Failure Reporting
FRAME Failure Rate Analysis and Modeling
FRMB fast ramp mini batch
FSG fused silica glass
FSM finite state machine
FT final test; Fourier transform
FTA fault tree analysis
FTAB Focus Technical Advisory Board
FTIR Fourier transform infrared
FW full wave
FWHM full‐width half‐maximum
FZ float zone
Ga gallium
GAC granular activated carbon
GC gas chromatography; gravimetric calibrator
GCC generic cell controller
GCD gas chromatography distillation
GCMS gas chromatography mass spectroscopy
GDPP gas drive plasma pinch
GDS graphical design system; graphical design software Ge germanium
GEM Generic EquipmentModel
GEMVS GEM verification system
GES generic equipment simulator
GFC gas filter correlation
GFCI ground fault circuit interrupter
GIDL gate‐induced drain leakage
GILD gas immersion laser doping
GLC gas liquid chromatography
GOI gate oxide integrity
GPIB general‐purpose interface bus
GSCE gas source control equipment
GTS GEM Test System
H hydrogen
HAP hazardous air pollutant
HARI high aspect ratio inspection
HAST highly accelerated stress testing HAZCOM Hazard Communication Standard
HB horizontal Bridgeman crystal
HCI hot carrier injection
HCM hollow cathode magnetron
HCMOS high‐density CMOS
HCS hot‐carrier suppressed
HD high density
HDL hardware description language
HDP high‐density plasma
HDPE high‐density polyethylene
He helium
HEM high‐efficiency matching
HEPA high‐efficiency particulate air
Hf hafnium
HF hydrofluoric acid
Hg mercury
HIBS heavy ion backscattering spectrometry HiPOx high‐pressure oxygen
HLF horizontal laminar flow
HMDS hexamethyldisilizane
HMIS hazardous materials inventory statement HMMP hazardous materials management plan HMOS high‐performance MOS; high‐density MOS HOMER hazardous organic mass emission rate HOPG highly oriented pyrolitic graphite
HP high purity
HPEM Hybrid Plasma Equipment Model
HPI high pressure isolation
HPL high‐performance logic
HPLC high‐performance liquid chromatography
HPM hazardous production materials; high‐purity metal
HPV high‐pressure vent
HRA human reliability analysis
HRR high ramp rate
HRTEM high‐resolution transmission electron microscopy
HSQ hydrogen silsesquioxane
HTO high‐temperature oxidation
HTRB high‐temperature reverse bias
HUPW hot ultrapure water
HVAC heating
I iodine
I/O input/output
I2L integrated injector logic
I300I International 300 mm Initiative
IC integrated circuit; Investment Council; ion chromatography ICAP inductively coupled argon‐plasma spectrometry
ICMS integrated circuit measurement system
ICP inductively coupled plasma
ICP‐AES inductively coupled plasma atomic emission spectroscopy ICP‐MS inductively coupled plasma mass spectrometry
ICT ideal cycle time
IDDQ direct drain quiescent current
IDEAL initiating
IDL interface definition language
IDLH immediately dangerous to life or health
IDS interactive diagnostic system
IEA ion energy analysis
IEC infused emitter coupling
IEDF ion energy distribution function
IERN internal‐external recurrent neural network
IF interface
IGFET insulated‐gate field‐effect transistor
ILB inner lead bond
ILD interlevel dielectric; interlayer dielectric
ILS intracavity laser spectroscopy
IM integrated model; integrated metrology
IMD intermetal dielectric
IMMA ion microphobe mass analysis
IMS ion mobility spectroscopy
In indium
INCAMS individual cassette manufacturing system
IPA isopropyl alcohol
IPL ion projection lithography
IPT ideal process time
Ir iridium
IR infrared
IRAS infrared reflection‐absorption spectroscopy IRIS imaging of radicals interacting with surfaces IRN internal recurrent neural network IRONMAN Improving Reliability of New Machines at Night IRTC‐1interconnect reliability test chip‐1
IS information systems; interface specifications; integrated systems
ISC Industry Steering Council
ISEM inspection/review specific equipment model ISM inductor super magnetron
ISMT International SEMATECH
ISPM in situ particle monitor
ISR in situ rinse
ISS ion scattering spectroscopy
ITRI Interconnection Technology
ITRS International Technology
IVH interstitial via hole
IVP integrated vacuum processing
JDP Joint Development Program
JEDEC Joint Electron Device Engineering Council JESSI Joint European Submicron Silicon Initiative
JIC Joint Industrial Council
JIT just‐in‐time
JJT Josephson junction transistor
JVD jet vapor deposition
K potassium; thousand
keV kilo electron volt
KPA key process area
Kr krypton
kV kilovolt
La lanthanum
LAMMA laser micro‐mass analysis
LAMMS laser micro‐mass spectroscopy
LC inductance‐capacitance; liquid chromatography
LCA lifecycle analysis
LCC leaded chip carrier
LCL lower confidence limit
LDD lightly doped drain
LDL lower detection limit
LDP low‐density plasma
LDPE low‐density polyethylene
LEC liquid encapsulated Czochralski crystal LEL lower explosive limit
LER line edge roughness
LF laminar flow
LFL lower flammable limit
LGQ linear Gaussian quadratic
Li lithium
LI laser interferometry
LIC linear integrated circuit
LID leadless inverted device
LIFO last in
LIMA laser‐induced mass analysis
LIMS laser‐induced mass spectrometry LLCC leadless chip carrier
LLD lower limit of detection
LLNQ least lots next queue
LM light microscope
LMMA laser microprobe mass analysis LOCOS local oxidation of silicon
LOS loss of selectivity
LPC linear predictive coding; laser particle counter; low particle concentration; liquid‐borne particle counter
LPCVD low‐pressure chemical vapor deposition LPD light point defect
LPE liquid phase epitaxy
LPI low‐pressure isolation
LPP laser‐produced plasma
LRS laser Raman spectroscopy
LSE latex sphere equivalent
LSHI large‐scale hybrid integration
LSI large‐scale integration
LSM laser scanning microscope
LTA laser thermal anneal
LTCVD low‐temperature chemical vapor deposition LTO low‐temperature oxidation/oxide
LTPD lot tolerance percent defective
LTV local thickness variation
LV latent variable
LVDT linear voltage differential transducer
LVI low‐voltage inverter
LVS layout verification of schematic
LWR linewidth reduction
LWS large wafer study
M million; mega
MACT maximum achievable control technology
MALDI matrix‐assisted laser desorption and ionization MAN metropolitan area network
Management Standard
Manufacturing and Science
MAP manufacturing automation protocol
Master Deliverables List
MAWP maximum allowable working pressure
MB machine batch
MBC machine bath collection
MBE molecular beam epitaxy
MBPC model‐based process control
MBTC model‐based temperature control
MCBA mean cycles between assists
MCBF mean cycles between failures
MCBI mean cycles between interrupts
MCM multichip module; manufacturing cycle management MCP master control processor;multichip package
MCS material control system
MCU microprocessor control unit; mobile calibration unit MCVD metal chemical vapor deposition
MDL minimum detection limit;
MD‐MOS multi‐drain metal‐oxide semiconductor
MDQ market‐driven quality
MEBS medium energy backscattering spectrometry MEEF mask error enhancement factor
MEMS microelectromechanical system
MERIE magnetically enhanced reactive ion etching
MES manufacturing execution systems
MESFET metal‐semiconductor field‐effect transistor
METS Materials and Equipment Trading Service
MeV mega electron volt
MFC mass flow controller
MFM mass flow meter
Mg magnesium
MG manufactured goods
MHI material hazard index
MHz megahertz
MIC monolithic integrated circuit
MID material ID
MIE magnetron ion etching
MIM metal‐insulator‐metal
MIS metal insulator silicon
MLCC multilayer ceramic capacitor
MLL modify lot location
MLM multilevel metal
MLR message log report
MMC Manufacturing Methods Council
MMD Microlithographic Mask Development program
MMIC monolithic microwave integrated circuit
MMM material movement management
MMMS Material Movement
MMO multimodel optimization
MMOS modified MOS
MMST Microelectronics Manufacturing Science and Technology Mn manganese
MNOS metal‐nitride‐oxide semiconductor
MNS metal‐nitride semiconductor
Mo molybdenum
MO metal‐organic
MOCVD metal‐organic chemical vapor deposition
MOP modify operating procedures
MOS metal‐oxide semiconductor
MOS‐C metal‐oxide semiconductor capacitor
MOSFET metal‐oxide semiconductor field‐effect transistor mp melting point
MP massively parallel
MP‐OES multipoint optical emission spectroscopy MPRES modular plasma reactor simulator MPU microprocessor unit
MRP materials requirements planning
MRP‐II manufacturing resource planning
MS mass spectrometry; mass spectroscopy MSDS Material Safety Data Sheet
MSEM Metrology Specific Equipment Model
MSG Management Steering Group
MSHA Mine Safety and Health Administration
MSI medium‐scale integration; manufacturing support item MSID mass spectrometer lead detector
MSLD mass spectrometer leak detector
MSTAB Manufacturing Systems Technical Advisory Board
MTBA mean time between assists
MTBF mean time between failures
MTBFp mean (productive) time between failures
MTBI mean time between interrupt; mean time between incident MTOL mean time off line; mean time on line
MTS Material Tracking Standard
MTTA mean time to assist
MTTF mean time to failure
MTTR mean time to repair
MV megavolt
MVTR moisture vapor transmission rate
MW molecular weight
MWBC mean wafers between cleans
MWT monitor wafer turner
N nitrogen
Na sodium
NA numerical aperture
NCMS National Center for
NCS Network Communication Standard
NDA nondisclosure agreement
NDE nondestructive evaluation
NDIR nondispersive infrared spectroscopy
NDP neutron depth profiling
NDT nondestructive testing
NDUV nondispersive ultraviolet spectroscopy
NEC National Electric Code
NESHAP National Emissions Standards for Hazardous Air Pollutants NFOM near‐field optical microscopy
NGL next‐generation lithography
Ni nickel
NIL nanoimprint lithography
NIRA near‐infrared reflection analysis
NMOS negative channel metal‐oxidesemiconductor
NMR nuclear magnetic resonance
NN neural network
NRE nonrecurring engineering
NTRS National Technology Roadmap for Semiconductors NTU nephelometric turbidity unit
NVR non‐volatile residue
O oxygen
OBA object behavior analysis
OBEM Object‐Based Equipment Model
OBIC optical beam‐induced current
OBL object‐based language
OC open cassette
OCR optical character recognition
OD outside diameter
ODS ozone‐depleting substances
OEE overall equipment effectiveness
OEM original equipment manufacturer
OES optical emission spectroscopy
OHT overhead transport; overhead hoist transport OHV overhead vehicle
OL overlay
OLB outer lead bond
OLE object linking and embedding
OM operational modeling; optical microscopy
OMA object management architecture
OMS optical mass spectroscopy
OMT object modeling technique
OO object‐oriented
OOA object‐oriented analysis
OOD object‐oriented design
OODB object‐oriented database
OODBMS object‐oriented database management system OOP object‐oriented programming
OPC optical particle counter; optical proximity correction OS operating system
OSD organic spin‐on dielectric
OSF Open Systems Foundation
OSG organosilicate glass
OSI open system interconnection
OSRM Office of Standard Reference Materials
OSS Object Services Standard
Ox oxide
P phosphorous
P/T precision‐tolerance
PAB post‐apply bake
PAC photoactive compound
PACVD plasma‐assisted chemical vapor deposition
PA‐FTIR photoacousticFourier transform infrared spectroscopy PAG photoacid generator
PAL process automation language; programmable array logic; process asset library
PAM process application module
PAS photoacoustic spectroscopy
PAWS portable acoustic wave sensor
Pb lead
PBET Performance‐Based Equipment Training PBGA plastic ball grid array
PBL poly‐buffered LOCOS
PBS photon backscattering
PC personal computer; programmable controller; process control
PCAD packaging computer‐aided design
PCB printed circuit board
PCMP post‐chemical mechanical polishing
PCMS plasma chemistry Monte‐Carlo simulation PCO photocatalytic oxidation
PCR principle component regression
PCT process change team
Pd palladium
PDC passive data collection
PDF portable document format
PDSOI partially depleted silicon on insulator
PDU protocol data unit
PDVC phase‐dependent voltage contrast
PEB post‐exposure bake
PECVD plasma‐enhanced chemical vapor deposition PED post‐exposure delay
PEDS plasma‐enhanced deposition system PEELS parallel electron energy loss spectrometry PEL permissible exposure level
PES photoelectron spectroscopy
PET post‐etch treatment
PETEOS plasma‐enhancedtetraethylorthosilicate PFA perfluoroalkoxy
阿里系各个概念英文缩写名词解释大全
阿里系各个概念英文缩写名词解释大全！！！ GMV成交笔数：拍下的订单笔数，包括未付款的。 GMV成交金额：拍下的订单总金额，包括未付款的。支付宝成交笔数：通过支付宝付款的订单笔数。 支付宝成交金额：通过支付宝付款的订单总金额（不是指确认收货完成了交易，仅指买家完成了付款的动作，因此可能会因为退款，这个数值比商家实际收到的款项高）。支付宝使用率：支付宝成交金额/GMV成交金额（珠宝66%，饰品82%） 支付宝使用率的辅助参数：支付宝笔数/GMV笔数（当支付宝使用率很低时，可用此参数看是否正常(80%以上)。因为采用限时折扣相关促销工具时，支付宝收到的款项是折扣价，销售记录中显示的是原价，会导致二者比率过低。）IPV：itemPageView，商品详情页面打开数。 IPV_UV：商品详情页面访客数。在线商品数：在线的商品数量（SKU）。
购买UV：通过支付宝付款的访客数。 店铺UV：到达店铺任何页面的独立访客数。 店铺PV：PageView，店铺所有页面的总打开数。 佣金：根据扣点百分比，和当日商家支付宝实际收到的金额实时划扣的佣金金额（确认收货后，卖家支付宝账户实际收到的款项为准）转化率1： IPV_UV/ 店铺UV（到达店铺的访客，有多少进入了商品详情页面。） 体现店铺首页、自定义页、分类页是否具备足够的导购能力。转化率2： 购买UV/ IPV_UV（到达商品详情页面的独立访客，有多少付款购买。）体现店铺单品页面图片、描述等是否能刺激购买。 店铺转化率：购买UV/店铺UV（转化率1*转化率2：到达店铺任意页面的访客，有多少付款购买。目前珠宝平均1.39%；饰品平均3.18%。）客单价：
英语缩写词汇大全
英语缩写词汇大全 星期 星期一：MONDAY=MON 星期二：TUESDAY=TUS 星期三：WENSEDAY=WEN 星期四：THURSDAY=THUR 星期五：FRIDAY=FRI 星期六：SATURDAY=SAT 星期天：SUNDAY=SUN 月份 一月份＝JAN 二月份＝FEB 三月份＝MAR 四月份＝APR 五月份＝MAY 六月份＝JUN 七月份＝JUL 八月份＝AUG 九月份＝SEP 十月份＝OCT 十一月份＝NOV 十二月份＝DEC 常用词 4＝FOR 到永远＝FOREVER 2＝TO RTN＝RETURN(送回) BT＝BLOOD TYPE(血型) PLS＝PLEASE(请) BD＝BIRTHDAY(生日) REWARD＝酬谢 REWARD 4 RETURN＝送回有酬谢ALLRG＝过敏 军事术语 USMC＝海军陆战队NAVY＝海军 AF＝AIR FORCE(空军) ARMY＝陆军 宗教类 C＝CHRISTIANISM(基督教) J＝JUDAISM(犹太教)
C＝CATHOLICISM(天主教) B＝BUDDHISM(佛教) I＝ISLAM（伊斯兰教）NR＝NO REFERENCE(没有宗教信仰) 星座 水瓶座：AQUARIUS（1月21日- 2月19日） 双鱼座：PISCES（2月20日- 3月20日） 白羊座：ARIES （3月21日- 4月20日） 金牛座：TAURUS（4月21日- 5月21日） 双子座：GEMINI（5月22日- 6月21日） 巨蟹座：CANCER（6月22日- 7月23日） 狮子座：LEO（7月24日- 8月23日） 处女座：VIRGO（8月24日- 9月23日） 天秤座：LIBRA （9月24日- 10月23日） 天蝎座：SCORPIUS（10月24日- 11月22日） 人马座：SAGITTARIUS（11月23日- 12月21日） 山羊座：CAPRICORNUS （12月22日- 1月20日） 1. 国际性或全美性： UNESCO (United Nations Educational, Scientific and Cultural organization）联合国教育科学文化组织（也叫国际文教组织） 例如：(The）UNESCO has made some contributions to the world.（UNESCO 对世界做出一些贡献） NATO（North Atlantic Treaty organization）北大西洋公约组织。 例如：Could（the）NATO members stick to their commitments？（NATO 的成员能坚守承担义务吗？) SALT（Strategic Arms Limitation Treaty）战略武器限制公约 例如：Should every nation join（the）SALT？（每个国家都要加入SALT？）
石油行业英文缩写汇总
3DLO 3D long offset seismic survey三维长偏移距野外资料采集 3DHR-HR 3D High resolution –high ???seismic survey 三维高分辨－高密野外资料采集。AAC = adjusted AC; ABI inclination at the drill bit AC acoustic 声波时差 ACN =adjusted CN; ADN Azimuthal neotron density AIT* Array Induction Imager Tool A&S admistration&service AHC Ascendant Hierarchical Clustering ARC Induction Resistivity GR annulus pressure ingrated tool ARI Azimuth resistivity imager方位电阻率成像测井仪 APD Elevation of Depth Reference (LMF) above Permanent Datum APWD apparatus whle drilling ASI Array seismic imager阵列地震成像仪 A VG: Average A VO Amplitude Versus Offset(Amplitude variation with offset calibration)振幅-炮检距 关系 AZI: Azimuth (deg) BBC Buy Back Contract BGG: Background Gas (%) BGP 物探局 BHFP bottomhole flowing pressure BHS :Borehole Status BHT :Bottom Hole Temperature BHTA 声波幅度 BHTT 声波返回时间 BLWH Blue White BML below mud line BOP Blow out preventer BOP stack 防喷器组 BS Bit Size BSW basic?? saturation water(综合含水) CAL borehole diameter 井径 CAST 声波扫描成像测井仪 CBI Central Bank of Iran CBIL 井周声波成像 CBL Cement Bond Log CC correlation coefficient CCAL common core analysis常规岩心分析 CCL Casing Collar Locator CCM Contractors Committee Meeting CDF cumulative density function CDF Calibrated Downhole Force
机械行业专业名词缩写对照
缩写词拼写中文分类/关联度 AAR Audit Action Request审核措施要求质量 AD Advanced Development前期开发项目 ADD Average Daily Demand平均日需求物流 AE Automotive Experience汽车业务单元定义 AHTO Accelerated Humidity Test Operating加速适度测试Varitorinx APQP Advanced Product Quality Planning产品前期质量策划QS五大核心工具 AQE Advanced Quality Ensure前期质量保证质量 ASL Approved Supplier List合格供应商清单采购 AT Accumulation Time (delivery frequency)发货交付频率物流 BCU Body control units车身控制单元 BMG/产品工程性能检验认可大众汽车集团通用缩略语 BMP Bitmap位图文件的扩展名图片文件扩展名 BOM Bill of Material物料清单物流 BOS Business Operating System业务运作体系江森自控汽车系统集团综合管理体系BSf Buffer Stock for Forecast to Actual variation物料现况预测调节物流 BSp Buffer Stock for part level Usage Variation to ADD物料安全库存调节物流 BU Business Unit业务单位/业务单元定义 CA Change Authorization更改授权工程 CBS Continental Business System大陆业务系统大陆管理体系 CC Critical Characteristic关键特性工程 CI Commercial Invoice CEP Corporate Entry Program项目 CmK Machine capability index CN Change Notification更改通知工程 CP Control Plan控制计划工程 Cpk Process capability index过程能力指数质量 CR Change Request更改申请工程 CSC-team/大众采购审查团队-VW大众汽车集团通用缩略语 CW Clockwise顺时针方向 CCW Counter clockwise逆时针方向 CQR Continental Quality Requirements大陆质量需求质量 CV&AM Commercial vehicle & after market商务车售后部门 DCC Document Control Center文控中心质量 DCC Display Competence Centre部门 DFM Design for Manufacturing制造性设计工程 DMR发货错误索赔登记表采购 DOE Design of Experiment试验设计工程 DV Design Verification设计确认/设计验证工程
计算机所有专业术语和英文缩略语并解释完整
计算机所有专业术语和英文缩略语并解释完整 悬赏分：10 - 解决时间：2006-6-5 17:34 请大家指点详细一点啊！！！ 提问者：Newall - 童生一级 最佳答案 英文术语完全介绍 1、CPU 3DNow!（3D no waiting） ALU（Arithmetic Logic Unit，算术逻辑单元） AGU（Address Generation Units，地址产成单元） BGA（Ball Grid Array，球状矩阵排列） BHT（branch prediction table，分支预测表） BPU（Branch Processing Unit，分支处理单元） Brach Pediction（分支预测） CMOS（Complementary Metal Oxide Semiconductor，互补金属氧化物半导体）CISC（Complex Instruction Set Computing，复杂指令集计算机） CLK（Clock Cycle，时钟周期） COB（Cache on board，板上集成缓存） COD（Cache on Die，芯片内集成缓存） CPGA（Ceramic Pin Grid Array，陶瓷针型栅格阵列） CPU（Center Processing Unit，中央处理器） Data Forwarding（数据前送） Decode（指令解码） DIB（Dual Independent Bus，双独立总线） EC（Embedded Controller，嵌入式控制器） Embedded Chips（嵌入式处理器） EPIC（explicitly parallel instruction code，并行指令代码） FADD（Floationg Point Addition，浮点加） FCPGA（Flip Chip Pin Grid Array，反转芯片针脚栅格阵列） FDIV（Floationg Point Divide，浮点除） FEMMS（Fast Entry/Exit Multimedia State，快速进入/退出多媒体状态） FFT（fast Fourier transform，快速热欧姆转换） FID（FID：Frequency identify，频率鉴别号码） FIFO（First Input First Output，先入先出队列） flip-chip（芯片反转） FLOP（Floating Point Operations Per Second，浮点操作/秒） FMUL（Floationg Point Multiplication，浮点乘） FPU（Float Point Unit，浮点运算单元） FSUB（Floationg Point Subtraction，浮点减） HL-PBGA（表面黏著，高耐热、轻薄型塑胶球状矩阵封装） IA（Intel Architecture，英特尔架构） ICU（Instruction Control Unit，指令控制单元） ID（identify，鉴别号码） IDF（Intel Developer Forum，英特尔开发者论坛）
2021年外贸常见词汇缩写大全
外贸常见词汇缩写大全 欧阳光明（2021.03.07） A A.R 一一 All Risks 一切险 ANER 一一Asia NorthAmerica EastboundRate 亚洲北美东行运费协定 AWB 一一 airway bill 空运提单 ATTN 一一 attention 注意 a/c 一一 account no. 账户 ASAP 一一 As soon as possible 越快越好 B.D.I 一一 Both Days Inclusive 包括头尾两天 BAF 一一 Bunker Adjustment Factor 燃油附加费 B/L 一一 Bill of Lading 海运提单 B/ldg.一一 B/L Bill of Lading 提单 Bs/L 一一 Bills of Lading 提单 (复数) B/R 一一买价 Buying Rate Bal. 一一 Balance 差额 bar. or brl. 一一 barrel 桶; 琵琶桶 B.B. clause 一一 Both to blame collision clause 船舶互撞条款 B/C 一一 Bills for collection 托收单据 B.C. 一一 before Christ 公元前 b.d. 一一 brought down 转下 B.D. 一一 Bank draft 银行汇票 Bill Discounted 一一贴现票据 bdle. ; bdl. 一一 bundle 把; 捆 b.e. ; B/E ; B. EX. 一一 Bill of Exchange 汇票 B.f. 一一 Brought forward 接下页 B/G 一一 Bonded goods 保税货物 bg. ; b/s 一一 bag(s) 袋 bkg. 一一 backing 银行业务 bkt. 一一 basket 篮; 筐 bl.; bls. 一一 bale(s) 包 bldg. 一一 building 大厦 bls. 一一 Bales 包 , barrels 桶 bot. ; bott. ; btl 一一 bottle 瓶
制造业工厂常用英文与缩写词汇大全
一:常用術語 Hon Hai 鴻海 CMM Component module move 機動元件整合 CEM Contract Manu faction service 合約委托代工 IBSC Internet Business Solution Center 國際互聯網應用中心 PCEG Personal Computer Enclosure group 個人電腦外設事業群（FOXTEQ）CCBG Connector& cable business group CPBG Competition business group ESBG Enterprise system business group 鴻富錦事業群 SABG system assembly business group 系統組裝事業群 NWE Net Work Enclosure NSE Network system enclosure NSG Network system group NFE Network flexible enclosure Foxcavity = HZ = Hong Zhun 鴻準 Stamping tool shop I 沖模一廠 Stamping tool shop II 沖模二廠 Prototype workshop 樣品中心 Steel factory 裁剪廠 PCE molding tooling workshop PCE塑模廠 Hua Nan test and measurement center 華南檢測中心 MPE mobile phone enclosure MPE MBE mobile phone and notebook enclosure 明塑厂 MGE Alloy magnesium alloy enclosure 鎂合金 Engineer standard 工標 Document center (database center)資料中心 Design Center 設計中心 Painting 烤漆(廠) Assembly組裝(廠) Stamping 沖壓(廠) Education and Training教育訓練 proposal improvement/creative suggestion提案改善 Technological exchange and study 技術交流研習會 Technology and Development Committee 技術發展委員會 BS Brain Storming 腦力激蕩 QCC Quality Control Circle 品質圈 PDCA Plan Do Check Action 計劃執行檢查總結 DCC delivery control center 交貨管制中心 3C Computer 電腦類產品 Consumer electronics 消費性電子產品 Communication 通訊類產品 Core value（核心价值） Love 愛心
石油化工英语常用缩写
石油化工英语常用缩写(第一版) 序号缩写英文中文 1 AC Air Conditioning 空气调节装置 2 AGO Atmospheric gas oil 常压瓦斯油 3 AML Approved Manufacturers' List 批准的厂商名单 4 APE Area Project Engineer 区域项目工程师 5 AR Atmospheric residue 常压渣油 6 ARDS Atmospheric residue desulfurization 常压渣油加氢脱硫 7 ASME American Society of Mechanical Engineers 美国机械工程师协会 8 BD Business Director 商务主任 9 BD Business Development 市场部 10 BEDP Basic Design Engineering Package 基础设计包 11 BFW Boiler feed water 锅炉给水 12 BL Battery limits 界区 13 BEDD Basic Engineering Design Data 基础工程设计数据 14 BM Bill of Material 材料表 15 BOD Basis of Design 设计基础 16 BOD Biological Oxygen Demand 化学需氧量 17 BP Boiling point 沸点 18 BS Bright stock 光亮油 19 BSI British Standards Institute 英国标准协会 20 BTEX Benzene, toluene, ethyl benzene, xylene 苯,甲苯,乙苯,二甲苯 21 BTU British thermal unit 英热单位 22 BTX Benzene, toluene, xylene 苯,甲苯,二甲苯 23 C Construction 施工 24 CAD Computer Aided Design 计算机辅助设计 25 CADD Computer Aided Design and Drafting 计算机辅助设计和绘图 26 CCR Conradson carbon residue 康氏残炭 27 CCR Continuous Catalyst Regeneration 催化剂连续再生 28 CDU Crude distillation unit 原油蒸馏装置 29 CGO Coker gas oil 焦化瓦斯油 30 CI Cetane index 十六烷指数 31 CL Center line 中心线 32 CM Construction Manager 施工经理 33 CN Conference Note 会议纪要 34 COD Chemical oxygen demand 化学需氧量 35 CPDP Chinese Preliminary Design Package 中国初步设计包 36 CPM Critical Path Method 关键路径法 37 CR Catalytic Reforming 催化重整 38 CS Carbon Steel 碳钢 39 CW Cooling Water 冷却水 40 FEED Front End Engineering Design 前期工程设计 41 GB GUO BIAO 国标 42 GCD Guaranteed Completion Date 保证完成日期 43 GG Gauge glass 玻璃液面计 44 GHSV Gaseous hourly space velocity 气体体积空速 45 GPH Gas phase hydrogenation 气相加氢 46 GSN Global Supply Network 全球供应网络 47 GTG Gas Turbine Generator 燃气涡轮发电机 48 GW Gross weight 毛重 49 HAZID Hazard Identification Review 危险识别审查 50 HAZOP Hazard and Operability Study 危险与可操作性研究
临床试验与实验室中常见的中英文名词与缩写
中国创新药咨询与服务先锋CRO 临床试验以及实验室中常见的英文缩写
药物临床试验英文缩写 缩略语英文全称中文全称 ADE Adverse Drug Event 药物不良事件 ADR Adverse Drug Reaction 药物不良反应 AE Adverse Event 不良事件 AI Assistant Investigator 助理研究者 BMI Body Mass Index 体质指数 CI Co-investigator 合作研究者 COI Coordinating Investigator 协调研究者 CRC Clinical Research Coordinator 临床研究协调者 CRF Case Report Form 病历报告表 CRO Contract Research Organization 合同研究组织 CSA Clinical Study Application 临床研究申请 CTA Clinical Trial Application 临床试验申请 CTX Clinical Trial Exemption 临床试验免责 CTP Clinical Trial Protocol 临床试验方案 CTR Clinical Trial Report 临床试验报告 DSMB Data Safety and monitoring Board 数据安全及监控委员会 EDC Electronic Data Capture 电子数据采集系统 EDP Electronic Data Processing 电子数据处理系统 FDA Food and Drug Administration 美国食品与药品管理局 FR Final Report 总结报告 GCP Good Clinical Practice 药物临床试验质量管理规范GCP Good Laboratory Practice 药物非临床试验质量管理规范GMP Good Manufacturing Practice 药品生产质量管理规范 IB Investigator’s Brochure 研究者手册 IC Informed Consent 知情同意 ICF Informed Consent Form 知情同意书 ICH International Conference on Harmonization 国际协调会议 IDM Independent Data Monitoring 独立数据监察 IDMC Independent Data Monitoring Committee 独立数据监察委员会 IEC Independent Ethics Committee 独立伦理委员会 IND Investigational New Drug 新药临床研究 IRB Institutional Review Board 机构审查委员会 IVD In Vitro Diagnostic 体外诊断 IVRS Interactive Voice Response System 互动语音应答系统 MA Marketing A pproval/Authorization 上市许可证 MCA Medicines Control Agency 英国药品监督局 MHW Ministry of Health and Welfare 日本卫生福利部 NDA New Drug Application 新药申请 NEC New Drug Entity 新化学实体 NIH National Institutes of Health 国家卫生研究所（美国）
宏观经济学所有的专业词汇英文缩写及其翻译
宏观经济学所有的专业词汇英文缩写及其翻译accounting 会计 accounting cost 会计成本 accounting profit 会计利润 adverse selection 逆向选择 allocation 配置 allocation of resources 资源配置 allocative efficiency 配置效率 antitrust legislation 反托拉斯法 arc elasticity 弧弹性 Arrow's impossibility theorem 阿罗不可能定理Assumption 假设 asymetric information 非对称性信息 average 平均 average cost 平均成本 average cost pricing 平均成本定价法 average fixed cost 平均固定成本 average product of capital 资本平均产量average product of labour 劳动平均产量average revenue 平均收益 average total cost 平均总成本 average variable cost 平均可变成本
B barriers to entry 进入壁垒 base year 基年 bilateral monopoly 双边垄断 benefit 收益 black market 黑市 bliss point 极乐点 boundary point 边界点 break even point 收支相抵点 budget 预算 budget constraint 预算约束 budget line 预算线 budget set 预算集 C capital 资本 capital stock 资本存量 capital output ratio 资本产出比率 capitalism 资本主义 cardinal utility theory 基数效用论 cartel 卡特尔 ceteris puribus assumption “其他条件不变”的假设
英语单词缩写大全简写带翻译
英语单词缩写大全简写带翻译 在英语的学习中，我们可以发现，很多英语单词都有它的缩写形式，下面是小编为大家整理的一些关于英语单词的缩写，希望能帮到大家。 公司内部门英文单词缩写Co.,Ltd.: Company Limited 的缩写 部门：Department/Division 简写为Dept. 人事部：HR Department(human resource) 行政部：Administration Department(比较常用)。也可以用Executive Department(有些公司也用这个)或者用Executive Branch(多用在银行) 市场部：Marketing Department 客服部：CUS Department 销售部：SALES Department 质量技术部：quality and Technology Division 研发部：R Administration 会计部：A/C Accountant Dept 资料中心：DC Document Center 质量管理部: Division of Quality Management. 质量总监Quality Administration
制造总部办公室Office of Manufacturing Headquarter 设计部：Design DPT. 注册公司常用英文单词缩写WTO----world trade organization 世贸 CEO----chief executive officer 总裁 RF cost Http---超文本传输协议(Hypertext transfer protocol); FTP----文件传输协议(File Transfer Protocol); TCP----传输控制协议(Transmission Control Protocol); IP-----网际协议(Internet Protocol); ISP----网络服务提供商(Internet Service Provider); DNS----域名服务器(Domain Name Server); IE-----网络浏览器(Internet Explorer); OE-----邮件收发软件(Outlook Express); BBS----电子布告栏系统; OICQ---网上聊天工具; LAN----局域网(Local Area Network); MAN----城域网(Metropolitan Area Network); WAN----广域网(Wide Area Network) ABS─防抱死制动系统 ABS英文全称是Anti-Lock Brake System。 EBD/EBV─制动力分配装置
常用石油(英文)缩写
石油化工英语常用缩写(第一版)(https://www.wendangku.net/doc/6b13289255.html,石油软件下载) 序号缩写英文中文 1 AC Air Conditioning 空气调节装置 2 AGO Atmospheric gas oil 常压瓦斯油 3 AML Approved Manufacturers' List 批准的厂商名单 4 APE Area Project Engineer 区域项目工程师 5 AR Atmospheric residue 常压渣油 6 ARDS Atmospheric residue desulfurization 常压渣油加氢脱硫 7 ASME American Society of Mechanical Engineers 美国机械工程师协会 8 BD Business Director 商务主任 9 BD Business Development 市场部 10 BEDP Basic Design Engineering Package 基础设计包 11 BFW Boiler feed water 锅炉给水 12 BL Battery limits 界区 13 BEDD Basic Engineering Design Data 基础工程设计数据 14 BM Bill of Material 材料表 15 BOD Basis of Design 设计基础 16 BOD Biological Oxygen Demand 化学需氧量 17 BP Boiling point 沸点 18 BS Bright stock 光亮油 19 BSI British Standards Institute 英国标准协会 20 BTEX Benzene, toluene, ethyl benzene, xylene 苯,甲苯,乙苯,二甲苯 21 BTU British thermal unit 英热单位 22 BTX Benzene, toluene, xylene 苯,甲苯,二甲苯 23 C Construction 施工 24 CAD Computer Aided Design 计算机辅助设计 25 CADD Computer Aided Design and Drafting 计算机辅助设计和绘图 26 CCR Conradson carbon residue 康氏残炭 27 CCR Continuous Catalyst Regeneration 催化剂连续再生 28 CDU Crude distillation unit 原油蒸馏装置 29 CGO Coker gas oil 焦化瓦斯油 30 CI Cetane index 十六烷指数 31 CL Center line 中心线 32 CM Construction Manager 施工经理 33 CN Conference Note 会议纪要 34 COD Chemical oxygen demand 化学需氧量 35 CPDP Chinese Preliminary Design Package 中国初步设计包 36 CPM Critical Path Method 关键路径法 37 CR Catalytic Reforming 催化重整 38 CS Carbon Steel 碳钢 39 CW Cooling Water 冷却水 40 FEED Front End Engineering Design 前期工程设计 41 GB GUO BIAO 国标 42 GCD Guaranteed Completion Date 保证完成日期
物流名词的缩写全称中英文对照
物流名词的缩写全称中英文对照 3G 3rd Generation Networks 第三代网络 3PL 3rd Party Logistics 第三方物流 4PL 4th Party Logistics 第四方物流 5-S Seiri, Seiton, Seiso, Seiketsu, Shitsuke 常组织、常整顿、常规范、常自律 A AMPS Administrative Monetary Penalty System 行政罚款制度 API Application Programming Interface 程序设定接口 ARENA Asia North America Eastbound Rate Agreement 亚洲北美东向运输协会 ASME American Society of Mechanical Engineers 机械工程师美洲协 ASP Active Sever Page 动态伺服端网页 AS/RS Automated Storage and Retrieval System 自动化存储和修复系统操作 AWB Air Waybill 空运提单 B B2B Business to Business 企业与企业之间的交易 B2C Business to Customer 企业与客户之间的交易 BAF Bunker Adjustment Factor 燃油附加费 B/B Break Bulk 散件杂货 BCC Blind Carbon Copy 密件抄送 BCO Beneficial Cargo Owner 货物拥有者权益 BIMCO The Baltic and International Maritime Council 波罗的海国际海运公会 B/L Bill of Lading 海运提单 BPO Business Process Outsourcing 企业外判程序 BSP British Standard Pipe Tread 英国标准的管子踩踏 C CAF Currency Adjustment Factor 币值附加费 CBM Cubic Metre 立方米 C&F Cost and Freight 成本和运费 CC Carbon Copy 抄送 CDMA Code Division Multiple Address 分发(部门)若干地址编码CEPA Closer Economic Partnership Arrangement 更紧密经贸关系的安排 CFM Cubic Feet per Minute 每分钟的立方尺 CFR Cost and Freight 成本和运费 CFS Container Freight Station 集装箱货物集散站 CGI Common Gateway Interface CGI 界面 CIF Cost, Insurance and Freight 成本和运费兼付保险费 CILT The Chartered Institute of Logistics and Transport 英国特许物流运输学会 CIM The Chartered Institute of Marketing 英国特许市务学会 CIS Commonwealth of Independent States 独立国家联合体 CLM The Council of Logistics Management 物流管理学会 CIP Carriage and Insurance Paid To 兼付指定运费及保险费 CLP Container Load Plan 集装箱/装载计划表 CNOOC China National Offshore Oil Corp. 中国海洋石油总公司 C/O Certificate of Origin 产地来源证 C.O.C. Carrier's Own Container 船东提供集装箱 C.D. Cash On Delivery 交货付现 COFC Container-on-flatcar 集装箱输送 COSCO China Ocean Shipping Company 中国远洋运输公司COSL China Oilfield Services Limited 中海油田服务股份有限公司CPFR Collaborative Planning Forecasting and Replenishment 预报和补充合作计划 CPT Carriage Paid To 兼付指定运费 CRM Customer Relationship Management 客户关系管理
计算机网络名词 英文缩写解释大全
计算机网络名词 英文缩写解释大全 计算机网络名词 英文缩写解释大全 AAL ATM适配层ATM Adaptation Layer ABR 可用比特率Available Bit Rate ACR 衰减串扰比 ADPCM 自适应差分PCM ADSL 非对称数字环路Asymmetric Digital Subscriber Line AMI ATM Management Interface AMPS 先进型移动电话系统Advanced Mobile Phone System ANS 高级网络与服务Advanced Networks and Services ANSI 美国国家标准协会American National Standard Institute APON 无源光纤网络 ARP 地址解析协议Address Resolution Protocol ARQ 自动重发请求Automatic Repeat Request AS 自制系统Autonomous System ASIC Application Specific Integrated Circuit(Chip)
ASN.1 Abstract Syntax Notation One ATD 异步时分复用Asynchronous Time Division ATM 异步传输模式Asynchronous Transfer Mode BBS 电子公告板Bulletin Board System BER 误比特率bit error rate BGP 边界网关协议Border Gateway Protocol BICMOS 双极型CMOS BIP-8 Bit Interleaved Parity-8 B-ISDN 宽带综合业务数字网Broadband Integrated Services Digital Network BMI Bus-Memory Interface BOOTP 引导协议BOOTstrapping Protocol BRI 单一ISDN基本速率 BUS 广播和未知服务器Broadcast/Unknown Server CAC 连接接纳控制Connection Admission Control CATV 公用天线电视 CBDS 无连接宽带数据服务 CBR 连续比特率Continuous Bit Rate CCITT 国际电话电报咨询委员会 CD Carrier Detect
术语和缩写词汇表
术语和缩写词汇表 ADH——自动文件处理。 CD-ROM——只读光盘存储器，计算机数据存储在光盘上。存储在光盘上的信息能读出，但不能改变或擦除。一张光盘能保存550兆位数据或9千万文字。 CD-WORM——一次性写入多次阅读光盘，这些光盘允许计算机数据写到光盘上，之后不能更改或擦除，这些数据能被访问。 COM——计算机输出到微缩胶片，这些是综合了微缩胶片技术的计算机系统。计算机数据以微缩胶片的形式直接输出。 CPU——中英处理器。 DOS——磁盘操作系统。 dpi分辨率。 DTP——桌面出版。 E-mail——电子邮件，信息能使用计算机系统发出电子邮件。该系统的成员可以分配“邮箱”。消息发送到邮箱内，收件人从邮箱内阅读或打印邮件。 EDI——电子数据交换，结构化信息在计算机之间自动交换和处理，例如货物订单能通过EDI 从一台计算机发送到另一台，然后接收公司的计算机能通过自动通过仓库和会计系统处理订单。 EDIFACT——EDI在管理，商业和运输上的应用。 EDMS——电子文件管理系统，信息和文件处理的计算机化管理。所有信息和数据存储在 CD-WORMS上。纸面文件被扫描进计算机，并存储在CD-WORMS上。 Fax_——传真机把图像转换成信号，信号通过电信网络发送到另一台传真机，然后信号再转换成图像。可用于快递从一处传递到另外地方。两个地方都需要有传真机和适合的电信连接。 预付款——是最常用的另用现金系统。流动资金在一定的时间内固定一定的数量，例如一个月保持50美元。到期后，要求偿付全部花销偿付来恢复流动资金额。 因特网——是世界范围计算机网络。它能用计算机、电话线和适当的软件访问。它能用于发送电子邮件或对万维网和用户组的访问。 ISDN——综合业务数字网。 ISO——国际标准化组织。 IVR——交互式语音问答。