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CD4510中文资料

Data sheet acquired from Harris Semiconductor

SCHS071B – Revised July 2003

The CD4510B and CD4516B types are supplied

in 16-lead dual-in-line plastic packages (E

suffix), 16-lead small-outline packages (NSR

suffix), and 16-lead thin shrink small-outline

packages (PW and PWR suffixes). The CD4516B

types also are supplied in 16-lead hermetic

dual-in-line ceramic packages (F3A suffix).

PACKAGING INFORMATION

Orderable Device

Status (1)Package Type Package Drawing

Pins Package Qty Eco Plan (2)

Lead/Ball Finish MSL Peak Temp (3)CD4510BE ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC CD4510BNSR ACTIVE SO NS 162000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM CD4510BPW ACTIVE TSSOP PW 1690Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM CD4510BPWR ACTIVE TSSOP PW 162000Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM CD4516BE ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC CD4516BF ACTIVE CDIP J 161None Call TI Level-NC-NC-NC CD4516BF3A ACTIVE CDIP J 161None Call TI Level-NC-NC-NC CD4516BNSR ACTIVE SO NS 162000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM CD4516BPW ACTIVE TSSOP PW 1690Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM CD4516BPWR

ACTIVE

TSSOP

2000

Pb-Free (RoHS)

CU NIPDAU

Level-1-250C-UNLIM

(1)

The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.

LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.

NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.

PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.

(2)

Eco Plan -May not be currently available -please check https://www.wendangku.net/doc/6414761167.html,/productcontent for the latest availability information and additional product content details.

None:Not yet available Lead (Pb-Free).

Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that

lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.

(3)

MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

https://www.wendangku.net/doc/6414761167.html,

28-Feb-2005

Addendum-Page 1

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