半导体工业常用英文缩写
(来源于互联网)
A/D analog to digital
AA atomic absorption
AAS atomic absorption spectroscopy
ABC activity-based costing
ABM activity-based management
AC alternating current; activated carbon
ACF anisotropic conductive film
ACI after-clean inspection
ACP anisotropic conductive paste
ACT alternative control techniques; actual cycle time
ADC analog-to-digital converter
ADE advanced development environment
ADI after-develop inspection
ADT applied diagnostic technique
ADTSEM Apply/Develop Track Specific Equipment Model
AE atomic emission; acousticemission; absolute ellipsometry AEC advanced equipment controller
AECS Advanced Equipment ControlSystem; Automated Equipm ent Control System
AEI after-etch inspection; automated equipment interface
AEM analytical electron microscopy
AES Auger emission/electron spectroscopy
AFM atomic force microscopy
AFP abrasive-free polish
Ag silver
A-GEMTF Advanced GEM Task Force
AGV automated guided vehicle
AHF anhydrous hydrogen fluoride
AHU air handling unit
AIR automated image retrieval
ALD atomic layer deposition
ALE atomic layer epitaxy; application logic element
ALS advanced light source; advanced low-power Schottky
AMC airborne molecular contamination
AMHS automated material handling system
AMT advanced manufacturing technology
AMU atomic mass unit
ANN artificial neural network
ANOVA analysis of variance
AOV air-operated valve
AP adhesion promoter
APA advanced performance algorithm
APC advanced process control
APCD add-on pollution control device
APCFI Advanced Process Control Framework Initiative
APCVD atmospheric pressure chemical vapor deposition
APEC advanced process equipment control
API application programming interface; atmospheric pressure io nization
APM atmospheric passivation module; acoustic plate mode
APRDL Advanced Products Research and Development Labora tory
aPSM attenuating phase-shift mask
AQI ACCESS query interface
AQL acceptable quality level
Ar argon
AR aspect ratio
ARAMS Automated Reliability
ARC antireflective coating
ARDE aspect ratio-dependent etching
ARPA Advanced Research Projects Agency (see DARPA)
ARS angle-resolved scattering
AS/RS automated storage and retrieval system
ASAP Advanced Stepper Application Program
ASIC application-specific integrated circuit
ASO automatic shutoff
ASP advanced strip and passivation; advanced strip processor ASR automated send receive
ATDF Advanced ToolDevelopment Facility
ATE automatic test equipment
ATG automatic test generation
ATLAS abbreviated test language for all systems
atm atmosphere
ATP advanced technology program; adenosine triphosphate; ac ceptance and tool performance
ATR attenuated total reflectance
Att attenuated
Au gold
AVP advanced vertical processor
AVS advanced visualization system
AWE asymptotic waveform evaluation
AWISPM above wafer in situ particle monitoring
AWS advanced wet station
B billion; boron
Ba barium
BARC bottom antireflective coating
BASE Boston Area Semiconductor Education (Council)
BAW bulk acoustic wave
BC bias contrast
BDEV behavior-level deviation
BDS Brownian Dynamics Simulation
Be beryllium
BEOL back end of line
BESOI bonded and etchback silicon on insulator
BF brightfield
BFGS Broyden-Fletcher- Goldfarb-Shanno optimization algorithm
BFL buffered field-effect transistor logic
BGA ball grid array
BHT Brinell hardness test
Bi bismuth
BiCMOS bipolar complementary metal-oxide semiconductor BIFET bipolar field-effect transistor
BIM binary intensity mask
BiMOS bipolar metal-oxide semiconductor
BIST built-in self-test
BIT bulk ion temperature
BITE built-in test equipment
BMC bubble memory controller
BMD bulk micro defect
BOE buffered oxide etchant
BOR bottom of range
BOSS Book of SEMI Standards; binary object storage system BOX buried oxide
BPR beam profile reflectometry; business process reengineering
BPSG boron phosphosilicate glass
BPTEOS BPSG from a TEOS source
Br bromine
BSE backscattered electron detection
BTAB bumped tape automated bonding
BV breakdown voltage
C carbon
Ca calcium
CA CIM architecture
CAA CIM applications architecture
CAB Competitive Analysis Benchmarking
CAD computer-aided design
CADT control application development tool
CAE computer-aided engineering
CAI computer-assisted instruction
CAM computer-aided manufacturing
CAPS computer-assisted problem solving
CAR chemically amplified resist
CARRI Computerized Assessment of Relative Risk Impacts
CASE computer-aided softwareengineering; computer-aided syst ems engineering
CAT computer-aided testing
CAW Construction Analysis Workgroup
CAWC cryogenic aerosol wafer cleaning
CBGA ceramic ball grid array
CBS chemical bottle storage area
CBT computer-based training
CC chip carrier; cluster controller
CCC ceramic chip carrier
CCD charge-coupled device
CCSL compatible current-sinking logic
CCW counterclockwise
Cd cadmium
CD critical dimension
CD/OL critical dimension overlay
CDA clean dry air
CDE chemical downstream etch
CDEM Customer Delivery Enterprise Model
CDI collector-diffusion isolation
CDM Common Device Model for SAB
CDO controlled decomposition/oxidation
CDR chemical distribution room
CDS chemical distribution system
Ce cerium
CE capillary electrophoresis
CEC cell evaluation chip
CEE control execution environment
CEM continuous emissions monitoring
CER-DIP ceramic dual in-line package
CFA component failure analysis
CFC chlorofluorocarbon
CFD computational fluid dynamics
CFM contamination-free manufacturing
CIC cleanroom interface chamber
CID charge-injection device
CIE computer-integrated engineering
CIM computer-integrated manufacturing
CIM-OSA computer-integrated manufacturing-open systems arch itecture (ESPRIT program)
CIP Continuous Improvement Program
CIS Center for Integrated Systems
CISC complex instruction set computer
Cl chlorine
CLCC ceramic leaded chip carrier
CLIC closed-loop intensity control
CM configuration management; cassette module
CMC cassette module controller
CML current mode logic
CMM capability maturity model
CMOS complementary metal-oxide semiconductor
CMP chemical mechanical planarization
CMR common-mode rejection ratio; cancel move request
CNC computer numerical control; condensation nucleus counter
CNT carbon nanotube
Co cobalt
COB chip-on-board
COC cost of consumables
CODEC coder-decoder
COED computer-optimized experimental design
COGS cost of goods sold
CoO cost of ownership
CORBA common object request broker architecture
CORE composite object reference
COSS common object services specification
COT customer-owned tooling
CoV coefficient of variance
Cp process capability
CPD concurrent product development
CPE Communications
CPGA ceramic pin grid array
Cpk process capability index
CQFP ceramic quad flat pack
CQN closed-queuing network
Cr chromium
CRC cyclic redundancy check
CRM Cost/Resource Model
Cs cesium
CSA CIM systems architecture
CSE control systems engineering
CSF critical success factor
CSL current-steering logic
CSMA/CD carrier-sense
CSP chip-scale package
CSPED concurrent semiconductor production and equipment de velopment
CST CIM systems technology
CSTR continuously stirred tank reactor
CSV comma-separated variable
CTC cluster tool controller
CTE coefficient of thermal expansion
CTI cycle time improvement
CTMC cluster tool modular communications
Cu copper
CUB central utility building
CUBES capacity utilization bottleneck efficiency system CUI common user interface
CUSUM cumulative sum
CV capacitance-to-voltage
CVCM collected volatile condensable materials
CVD chemical vapor deposition
CW continuous wave
Cz Czochralski process
D/A digital to analog
D/B die bonding
DAC digital-to-analog converter
DAS direct absorption spectroscopy
DASSL differential algebraic system solver
DBMS database management system
DC direct current
DCA direct chip attachment
DCATS double-contained acid transfer system
DCE distributed computer environment
DCL digital command language; display communication log DCS dichlorosilane
DDL device description language
DDMS defect data management system
DEDS discrete-event dynamic simulation
DES data encryption standard; display equipment status DF darkfield
DFC densified fluid clean
DFE dual-frequency etch
DFM design for manufacturing
DFR design for reliability
DFT design for test
DFY design for yield
DHF dilute hydrofluoric acid
DI deionized; dielectric isolation
DIBL drain-induced barrier leakage
DIC differential interference contrast
DIL dual in-line
DIP dual in-line package
DLBI device-level burn-in
DLOC developed source lines of code
DLS display lot status
DLT device-level test
DLTS deep-level transient spectroscopy
DMA direct memory access; dynamic mechanical analysis DMH display message helps
DML data manipulation language; display message log DMM digital multimeter
DMOS diffused metal-oxide semiconductor
DMR display move requests
DO dynamic optimization
DOA dead-on alignment
DOAS differential optical absorption spectroscopy
DOE design of experiments
DOF depth of focus
DOP dioctylphthalate
DPA destructive physical analysis
DPM digital panel meter
DPP discharge-produced plasma
DPSRAM dual-port static random access memory
DRAM dynamic random access memory
DRAPAC Design Rule and Process Architecture Council DRC design rule check
DRE destruction removal efficiency
DRIFTS diffuse reflectance infrared Fourier transform spectrosc opy
DRT defect review tool
DSA display system activity; dimensionally stable anode
DSC differential scanning calorimetry
DSMC direct simulation Monte Carlo
DSQ downstream quartz
DSS display stocker status
DSW direct step-on-wafer
DT dynamic test
DTA differential thermal analysis
DTC direct thermocouple control
DTL diode transistor logic
DTM defect test monitor; delay time multiplier; device test mod ule; digital terrain map
DTMPN defect test monitor phase number
DUT device under test
DUV deep ultraviolet
DV design verification
DVER design rule verification
DVM digital voltmeter
DVS display vehicle status
DWG domain work group
EAPSM embedded attenuated phase-shift mask
EAROM electrically alterable read-only memory
EASE equipment and software emulator
e-beam electron beam
EBHT electron-beam high-throughput lithography
EBIC electron beam-induced current
EBR edge bead removal
EC engineering change; equipment controller
ECA engineering capability assessment
ECAD electronic computer-aided design; engineering computer-aided design
ECAE electronic computer-aided engineering
ECL emitter coupled logic
ECN engineering change notice
ECO engineering change order
ECQB electrochemical quartz crystal balance
ECR electron cyclotron resonance
EDA electronic design automation
EDS energy-dispersive spectroscopy
EDU equipment-dependent uptime
EDX energy-dispersive X-ray
EDXA energy-dispersive X-ray analysis
EEDF electron energy distribution function
EELS electron energy-loss spectroscopy
EEPROM electrically erasable programmable read-only memory
EFEM equipment front-end module
EFOCS evanescent fiber-optic chemical sensor
EFTIR emission Fourier transform infrared spectroscopy
EFV excess flow valve
EGE ethylene glycol ethers
EHS extremely hazardous substance
EI equipment integration
EID Equipment InterfaceDevelopment
EIP Equipment Improvement Program; Equipment Improvement Project
EIS electrochemical impedance spectroscopy
EKF extended Kalman filter
ELF extremely low frequency
EM enterprise model; electromagnetic; electromigration
EMA equipment maturity assessment
EMC electromagnetic capability; electromagnetic compatability
EMF electromagnetic field
EMG electromigration
EMI electromagnetic interference
EMMA electron microscopy and microanalysis
EMP electromagnetic pulse
EMR enter move request
EMU electromagnetic unit
EOS electrical overstress
EOT end of transfer; equivalent oxide thickness
EP extreme pressure; electropolish
EPI epitaxial
EPL electron projection lithography
EPR electron paramagnetic resonance
EPROM electrically programmable read-only memory EPSS electronic performance support system
EPT equipment performance tracking
EQUIP C/I equipment control and integration
EQUIP RTC equipment real-time control
ERAM equipment reliability
ERM enterprise reference model
ERN external recurrent neural network
ERP extended range pyrometer
ERS event reporting standard
ERT emergency response time
ES engineering specification; expert system
ESC electrostatic chuck
ESCA electron spectroscopy for chemical analysis
ESD electrostatic discharge
ESH environment
ESM electronic service manual
ETAB Executive Technical Advisory Board
ETQR External Total Quality and Reliability
EUV extreme ultraviolet
eV electron volt
EWMA exponentially weighted moving average
F fluorine
F/I final inspection
FA failure analysis
FAB fast atom bombardment
FAMOS floating-gate avalanche-injection metal-oxide semicondu ctor
FBGA fine-pitch ball grid array
FC flip chip
FCM facilities cost model
FCS factory control system
FDC fault detection and classification
FDE frequency domain experiments
FDSOI fully depleted silicon on insulator
Fe iron
FEC fabrication evaluation chip
FEM finite element model
FEOL front end of line
FESEM field emission scanning electron microscopy
FET field-effect transistor
FFT fast Fourier transform
FFU filter fan unit
FI filterability index; factory integration
FIB focused ion beam
FID flame ionization detector
FIFO first-in
FIMS front-opening interface mechanical standard
FL fuzzy logic
FLOPC floating point operations needed per cycle
FLOTOX floating gate tunnel oxide
FLRT factory layout/relayout tool
FM foreign material
FMEA failure mode and effects analysis FMMC factory material movement component FMVP Framework Member Validation Project FNN feed-forward neural network
FOCS fiber-optic chemical sensor
FOSB front opening shipping box
FOUP front opening unified pod
FOV field of view
FOX field oxide
FP flash point
FPD focal plane deviation; flat panel display FPGA field-programmable gate array
FPLA field-programmable logic array
FPLF field-programmable logic family
FPLS field-programmable logic switch
FPMS Factory Performance Modeling Software FPROM field-programmable read-only memory FRACAS Failure Reporting
FRAME Failure Rate Analysis and Modeling FRMB fast ramp mini batch
FSG fused silica glass
FSM finite state machine
FT final test; Fourier transform
FTA fault tree analysis
FTAB Focus Technical Advisory Board
FTIR Fourier transform infrared
FW full wave
FWHM full-width half-maximum
FZ float zone
Ga gallium
GAC granular activated carbon
GC gas chromatography; gravimetric calibrator GCC generic cell controller
GCD gas chromatography distillation
GCMS gas chromatography mass spectroscopy
GDPP gas drive plasma pinch
GDS graphical design system; graphical design software Ge germanium
GEM Generic EquipmentModel
GEMVS GEM verification system
GES generic equipment simulator
GFC gas filter correlation
GFCI ground fault circuit interrupter
GIDL gate-induced drain leakage
GILD gas immersion laser doping
GLC gas liquid chromatography
GOI gate oxide integrity
GPIB general-purpose interface bus
GSCE gas source control equipment
GTS GEM Test System
H hydrogen
HAP hazardous air pollutant
HARI high aspect ratio inspection
HAST highly accelerated stress testing
HAZCOM Hazard Communication Standard
HB horizontal Bridgeman crystal
HCI hot carrier injection
HCM hollow cathode magnetron
HCMOS high-density CMOS
HCS hot-carrier suppressed
HD high density
HDL hardware description language
HDP high-density plasma
HDPE high-density polyethylene
He helium
HEM high-efficiency matching
HEPA high-efficiency particulate air
Hf hafnium
HF hydrofluoric acid
Hg mercury
HIBS heavy ion backscattering spectrometry
HiPOx high-pressure oxygen
HLF horizontal laminar flow
HMDS hexamethyldisilizane
HMIS hazardous materials inventory statement
HMMP hazardous materials management plan
HMOS high-performance MOS; high-density MOS
HOMER hazardous organic mass emission rate
HOPG highly oriented pyrolitic graphite
HP high purity
HPEM Hybrid Plasma Equipment Model
HPI high pressure isolation
HPL high-performance logic
HPLC high-performance liquid chromatography
HPM hazardous production materials; high-purity metal
HPV high-pressure vent
HRA human reliability analysis
HRR high ramp rate
HRTEM high-resolution transmission electron microscopy HSQ hydrogen silsesquioxane
HTO high-temperature oxidation
HTRB high-temperature reverse bias
HUPW hot ultrapure water
HVAC heating
I iodine
I/O input/output
I2L integrated injector logic
I300I International 300 mm Initiative
IC integrated circuit; Investment Council; ion chromatography
ICAP inductively coupled argon-plasma spectrometry
ICMS integrated circuit measurement system
ICP inductively coupled plasma
ICP-AES inductively coupled plasma atomic emission spectrosc opy
ICP-MS inductively coupled plasma mass spectrometry
ICT ideal cycle time
IDDQ direct drain quiescent current
IDEAL initiating
IDL interface definition language
IDLH immediately dangerous to life or health
IDS interactive diagnostic system
IEA ion energy analysis
IEC infused emitter coupling
IEDF ion energy distribution function
IERN internal-external recurrent neural network
IF interface
IGFET insulated-gate field-effect transistor
ILB inner lead bond
ILD interlevel dielectric; interlayer dielectric
ILS intracavity laser spectroscopy
IM integrated model; integrated metrology
IMD intermetal dielectric
IMMA ion microphobe mass analysis
IMS ion mobility spectroscopy
In indium
INCAMS individual cassette manufacturing system
IPA isopropyl alcohol
IPL ion projection lithography
IPT ideal process time
Ir iridium
IR infrared
IRAS infrared reflection-absorption spectroscopy
IRIS imaging of radicals interacting with surfaces
IRN internal recurrent neural network
IRONMAN Improving Reliability of New Machines at Night
IRTC-1 interconnect reliability test chip-1
IS information systems; interface specifications; integrated syste ms
ISC Industry Steering Council
ISEM inspection/review specific equipment model
ISM inductor super magnetron
ISMT International SEMATECH
ISPM in situ particle monitor
ISR in situ rinse
ISS ion scattering spectroscopy
ITRI Interconnection Technology
ITRS International Technology
IVH interstitial via hole
IVP integrated vacuum processing
JDP Joint Development Program
JEDEC Joint Electron Device Engineering Council
JESSI Joint European Submicron Silicon Initiative
JIC Joint Industrial Council
JIT just-in-time
JJT Josephson junction transistor
JVD jet vapor deposition
K potassium; thousand
keV kilo electron volt
KPA key process area
Kr krypton
kV kilovolt
La lanthanum
LAMMA laser micro-mass analysis
LAMMS laser micro-mass spectroscopy
LC inductance-capacitance; liquid chromatography
LCA lifecycle analysis
LCC leaded chip carrier
LCL lower confidence limit
LDD lightly doped drain
LDL lower detection limit
LDP low-density plasma
LDPE low-density polyethylene
LEC liquid encapsulated Czochralski crystal
LEL lower explosive limit
LER line edge roughness
LF laminar flow
LFL lower flammable limit
LGQ linear Gaussian quadratic
Li lithium
LI laser interferometry
LIC linear integrated circuit
LID leadless inverted device
LIFO last in
LIMA laser-induced mass analysis
LIMS laser-induced mass spectrometry
LLCC leadless chip carrier
LLD lower limit of detection
LLNQ least lots next queue
LM light microscope
LMMA laser microprobe mass analysis
LOCOS local oxidation of silicon
LOS loss of selectivity
LPC linear predictive coding; laser particle counter; low particle concentration; liquid-borne particle counter
LPCVD low-pressure chemical vapor deposition
LPD light point defect
LPE liquid phase epitaxy
LPI low-pressure isolation
LPP laser-produced plasma
LRS laser Raman spectroscopy
LSE latex sphere equivalent
LSHI large-scale hybrid integration
LSI large-scale integration
LSM laser scanning microscope
LTA laser thermal anneal
LTCVD low-temperature chemical vapor deposition LTO low-temperature oxidation/oxide
LTPD lot tolerance percent defective
LTV local thickness variation
LV latent variable
LVDT linear voltage differential transducer
LVI low-voltage inverter
LVS layout verification of schematic
LWR linewidth reduction
LWS large wafer study
M million; mega
MACT maximum achievable control technology MALDI matrix-assisted laser desorption and ionization MAN metropolitan area network
Management Standard
Manufacturing and Science
MAP manufacturing automation protocol
Master Deliverables List
MAWP maximum allowable working pressure
MB machine batch
MBC machine bath collection
MBE molecular beam epitaxy
MBPC model-based process control
MBTC model-based temperature control
MCBA mean cycles between assists
MCBF mean cycles between failures
制造业中常用的英文缩写 工业常用的英文缩写 品质人员名称类 QC quality control 品质管理人员 FQC final quality control 终点质量管理人员 IPQC in process quality control 制程中的质量管理人员 OQC output quality control 最终出货质量管理人员 IQC incoming quality control 进料质量管理人员 TQC total quality control 全面质量管理 POC passage quality control 段检人员 QA quality assurance 质量保证人员 OQA output quality assurance 出货质量保证人员 QE quality engineering 品质工程人员 品质保证类 FAI first article inspection 新品首件检查 FAA first article assurance 首件确认 CP capability index 能力指数媵 CPK capability process index 模具制程能力参数 SSQA standardized supplier quality audit 合格供货商品质评估 FMEA failure model effectiveness analysis 失效模式分析 FQC运作类 AQL Acceptable Quality Level 运作类允收品质水准 S/S Sample size 抽样检验样本大小 ACC Accept 允收 REE Reject 拒收 CR Critical 极严重的 MAJ Major 主要的 MIN Minor 轻微的 Q/R/S Quality/Reliability/Service 品质/可靠度/服务 P/N Part Number 料号藊 L/N Lot Number 批号 AOD Accept On Deviation 特采 UAI Use As It 特采 FPIR First Piece Inspection Report 首件检查报告 PPM Percent Per Million 百万分之一 制程统计品管专类 SPC Statistical Process Control 统计制程管制 SQC Statistical Quality Control 统计质量管理 GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸 DIA Diameter 直径 N Number 样品数
工程圖檔資料中常見的英文縮寫匯總 ?AOI : Automatic Optical Inspection 自動光學檢測 ?SMD : Surface Mount Devices 表面安裝設備 ?SMB : Surface Mount Board 表面安裝板 ?SMT : Surface Mount Technology 表面安裝技術 ?MIL : Military Standard 美國軍用標准 ?LPI : Liquid Photo Imageable Solder Mask 液態感光阻焊油 ?SMOBC : Solder Mask On Bare Copper 裸銅覆蓋阻焊工藝 ?OSP : Organic Solderability Preservative 焊錫性有機保護劑 ?PTI : Proof Tracking Index 耐電壓起痕指數 ?CTI : Comparative Tracking Index 相對漏電起痕指數 ?HASL : Hot Air Solder Leveling 噴錫HAL : Hot Air Leveling 噴錫?PCB : Printed Circuit Board 印制電路板 ?PWB : Printed Wiring Board 印制線路板 ?CCL : Copper-clud laminat 覆銅箔層壓板 ?FPC: Flexible printed board 柔性线路板简称,又称软板 ?CAD : Computer Aided Design 計算機輔助設計 ?CAM : Computer Aided Manufacturing 計算機輔助制造 ?CAT : Computer Aided Testing 計算機輔助測試 ?PTH : Plated Through Hole 鍍通孔 ?IC : Integrated Circuit 集成線路 ?UL : Under Writers Laboratories 美國保險商實驗室 ?CNS : Chinese National Standards 中國國家標准 ?BGA : Ball Grid Array 球柵陣列 ?BUM : Build-up Multilayer 積層法多層板 ?CFR : Code of Federal Regularations 聯邦法規全書 ?AQL : Acceptable Quality Level 允收品質水准 ?LDI : Laser Direct Imaging 鐳射直接成像 ?HDI : High Density Interconnection –-Build-up Multilayer 高密度互連積層多層板
常用化学药品英文缩写A 英文缩写全称 A/MMA 丙烯腈/甲基丙烯酸甲酯共聚物AA 丙烯酸 AAS 丙烯酸酯-丙烯酸酯-苯乙烯共聚物ABFN 偶氮(二)甲酰胺 ABN 偶氮(二)异丁腈 ABPS 壬基苯氧基丙烷磺酸钠 B 英文缩写全称 BAA 正丁醛苯胺缩合物 BAC 碱式氯化铝 BACN 新型阻燃剂 BAD 双水杨酸双酚A酯 BAL 2,3-巯(基)丙醇 BBP 邻苯二甲酸丁苄酯 BBS N-叔丁基-乙-苯并噻唑次磺酰胺BC 叶酸 BCD β-环糊精 BCG 苯顺二醇 BCNU 氯化亚硝脲 BD 丁二烯 BE 丙烯酸乳胶外墙涂料 BEE 苯偶姻乙醚 BFRM 硼纤维增强塑料 BG 丁二醇BGE 反应性稀释剂 BHA 特丁基-4羟基茴香醚 BHT 二丁基羟基甲苯 BL 丁内酯 BLE 丙酮-二苯胺高温缩合物 BLP 粉末涂料流平剂 BMA 甲基丙烯酸丁酯 BMC 团状模塑料 BMU 氨基树脂皮革鞣剂 BN 氮化硼 BNE 新型环氧树脂 BNS β-萘磺酸甲醛低缩合物 BOA 己二酸辛苄酯 BOP 邻苯二甲酰丁辛酯 BOPP 双轴向聚丙烯 BP 苯甲醇 BPA 双酚A BPBG 邻苯二甲酸丁(乙醇酸乙酯)酯 BPF 双酚F BPMC 2-仲丁基苯基-N-甲基氨基酸酯 BPO 过氧化苯甲酰 BPP 过氧化特戊酸特丁酯 BPPD 过氧化二碳酸二苯氧化酯 BPS 4,4’-硫代双(6-特丁基-3-甲基苯酚) BPTP 聚对苯二甲酸丁二醇酯
BR 丁二烯橡胶 BRN 青红光硫化黑 BROC 二溴(代)甲酚环氧丙基醚BS 丁二烯-苯乙烯共聚物 BS-1S 新型密封胶 BSH 苯磺酰肼 BSU N,N’-双(三甲基硅烷)脲BT 聚丁烯-1热塑性塑料 BTA 苯并三唑 BTX 苯-甲苯-二甲苯混合物BX 渗透剂 BXA 己二酸二丁基二甘酯 BZ 二正丁基二硫代氨基甲酸锌C 英文缩写全称 CA 醋酸纤维素 CAB 醋酸-丁酸纤维素 CAN 醋酸-硝酸纤维素 CAP 醋酸-丙酸纤维素 CBA 化学发泡剂 CDP 磷酸甲酚二苯酯 CF 甲醛-甲酚树脂,碳纤维CFE 氯氟乙烯 CFM 碳纤维密封填料 CFRP 碳纤维增强塑料 CLF 含氯纤维 CMC 羧甲基纤维素CMCNa 羧甲基纤维素钠 CMD 代尼尔纤维 CMS 羧甲基淀粉 D 英文缩写全称 DAF 富马酸二烯丙酯 DAIP 间苯二甲酸二烯丙酯DAM 马来酸二烯丙酯 DAP 间苯二甲酸二烯丙酯DATBP 四溴邻苯二甲酸二烯丙酯DBA 己二酸二丁酯 DBEP 邻苯二甲酸二丁氧乙酯DBP 邻苯二甲酸二丁酯 DBR 二苯甲酰间苯二酚 DBS 癸二酸二癸酯 DCCA 二氯异氰脲酸 DCCK 二氯异氰脲酸钾 DCCNa 二氯异氰脲酸钠 DCHP 邻苯二甲酸二环乙酯DCPD 过氧化二碳酸二环乙酯DDA 己二酸二癸酯 DDP 邻苯二甲酸二癸酯 DEAE 二乙胺基乙基纤维素 DEP 邻苯二甲酸二乙酯 DETA 二乙撑三胺 DFA 薄膜胶粘剂 DHA 己二酸二己酯
一:常用術語 Hon Hai 鴻海 CMM Component module move 機動元件整合 CEM Contract Manu faction service 合約委托代工 IBSC Internet Business Solution Center 國際互聯網應用中心 PCEG Personal Computer Enclosure group 個人電腦外設事業群(FOXTEQ)CCBG Connector& cable business group CPBG Competition business group ESBG Enterprise system business group 鴻富錦事業群 SABG system assembly business group 系統組裝事業群 NWE Net Work Enclosure NSE Network system enclosure NSG Network system group NFE Network flexible enclosure Foxcavity = HZ = Hong Zhun 鴻準 Stamping tool shop I 沖模一廠 Stamping tool shop II 沖模二廠 Prototype workshop 樣品中心 Steel factory 裁剪廠 PCE molding tooling workshop PCE塑模廠 Hua Nan test and measurement center 華南檢測中心 MPE mobile phone enclosure MPE MBE mobile phone and notebook enclosure 明塑厂 MGE Alloy magnesium alloy enclosure 鎂合金 Engineer standard 工標 Document center (database center)資料中心 Design Center 設計中心 Painting 烤漆(廠) Assembly組裝(廠) Stamping 沖壓(廠) Education and Training教育訓練 proposal improvement/creative suggestion提案改善 Technological exchange and study 技術交流研習會 Technology and Development Committee 技術發展委員會 BS Brain Storming 腦力激蕩 QCC Quality Control Circle 品質圈 PDCA Plan Do Check Action 計劃執行檢查總結 DCC delivery control center 交貨管制中心 3C Computer 電腦類產品 Consumer electronics 消費性電子產品 Communication 通訊類產品 Core value(核心价值) Love 愛心
电路中常用的英文缩写汇总 A/D:模数转换。 AC:交流。 ADDRESS:地址线。 AF:音频。 AFC:自动频率控制,控制基准频率时钟电路。在GSM电路中,只要看到AFC 字样,则马上可以断定该信号线所控制的是13MHz电路。该信号不正常则可能导致不能进入服务状态,严重的导致不开机。有些AFC标注为VCXOCONT。AGC:自动增益控制。该信号通常出现在接收机电路的低噪声放大器,被用来控制接收机前端放大器在不同强度信号时给后级电路提供一个比较稳定的信号。ALERT:告警。属于接收音频电路,被用来提示用户有电话进入或操作错误。ALRT:铃声电路。 AMP:放大器。 AMPS:先进的移动电话系统。 ANT:天线。用来将高频电磁波转化为高频电流或将高频信号电流转化为高频电磁波。在电路原理图中,找到ANT,就可以很方便地找到天线及天线电路。ANTSW:开线开关控制信号。 AOC:自动功率控制。通常出现在发射机的功率放大器部分。 AOC-DRIVE:自动功率控制参考电平。 ASIC:专用应用集成电路。在电路中,它通常包含多个功能电路,提供许多接口,主要完成各种控制。 AUC:鉴权中心。 :音频。AUDIO. AUX:辅助。 AVCC:音频供电。 BACKLIGHT;背光。 BALUN:平衡/不平衡转换。 BAND:频段。 BAND-SELECT:频段选择。只出现在双频或三频电路中。该信号控制频段切换。BASEBAND:基带信号。 B+:电源。 BATT:电池电压。 BAND:频段。 BCH:广播信道。 BDR:接收数据信号。 BDX:发射数据信号。 BKLT-EN:背景灯控制。 BIAS:偏压。被用来控制功率放大器或其他相应的电路。 BOOT:屏蔽罩。
您现在的位置:---------->化工常识------>近600种常用化工产品的英文缩写 本栏目详细列出了近600种常用化工产品的英文缩写,希望能为在科研生产中遇到困难的化工业同行 提供一些高效,有益的帮助!如果您还遇到什么难题,请及时与我们联系!! 请按字母顺序检索:A|B|C|D|E|F|G|H|I|J|K|L|M|N|O|P|Q|R|S|T|U|V|W|X|Y|Z 下面是起始字母为A的: A/MMA全称为:丙烯腈/甲基丙烯酸甲酯共聚物 AA全称为:丙烯酸 AAS全称为:丙烯酸酯-丙烯酸酯-苯乙烯共聚物 ABFN全称为:偶氮(二)甲酰胺 ABN全称为:偶氮(二)异丁腈 ABPS全称为:壬基苯氧基丙烷磺酸钠 ABR全称为:聚丙烯酸酯 ABS全称为:苯乙烯-丙烯腈-丁二烯共聚物 ABVN全称为:偶氮(二)异庚腈 AC全称为:偶氮(二)碳酰胺 ACB全称为:2-氨基-4-氯苯胺 ACNU全称为:嘧啶亚硝脲 ACP全称为:三氧化铝 ACR全称为:丙烯酸脂共聚物 ACS全称为:苯乙烯-丙烯腈-氯化聚乙烯共聚物 ACTA全称为:促皮质素 ADC全称为:偶氮甲酰胺 ADCA全称为:偶氮二甲酰胺 AE全称为:脂肪醇聚氧乙烯醚 AES全称为:脂肪醇聚氧乙烯醚硫酸酯钠盐 AI全称为:酰胺-酰亚胺(聚合物) AK全称为:醇酸树脂 AM全称为:丙烯酰胺 AN全称为:丙烯腈 AN-AE全称为:丙烯腈-丙烯酸酯共聚物 ANM全称为:丙烯腈-丙烯酸酯合成橡胶 AP全称为:多羟基胺基聚醚 APP全称为:无规聚丙烯 AR全称为:丙烯酸酯橡胶 AS全称为:丙烯腈-苯乙烯共聚物 ASA全称为:丙烯腈-苯乙烯-丙烯酸酯共聚物 ATT全称为:靛蓝
常用化工介质英文缩写英文缩写全称 A/MMA 丙烯腈/甲基丙烯酸甲酯共聚物 AA 丙烯酸 AAS 丙烯酸酯-丙烯酸酯-苯乙烯共聚物 ABFN 偶氮(二)甲酰胺 ABN 偶氮(二)异丁腈 ABPS 壬基苯氧基丙烷磺酸钠 ABR 聚丙烯酸酯 ABS 苯乙烯-丙烯腈-丁二烯共聚物 ABVN 偶氮(二)异庚腈 AC 偶氮(二)碳酰胺 ACB 2-氨基-4-氯苯胺 ACNU 嘧啶亚硝脲 ACP 三氧化铝 ACR 丙烯酸脂共聚物 ACS 苯乙烯-丙烯腈-氯化聚乙烯共聚物 ACTA 促皮质素 ADC 偶氮甲酰胺 ADCA 偶氮二甲酰胺 AE 脂肪醇聚氧乙烯醚 AES 脂肪醇聚氧乙烯醚硫酸酯钠盐 AI 酰胺-酰亚胺(聚合物) AK 醇酸树脂 AM 丙烯酰胺 AN 丙烯腈 AN-AE 丙烯腈-丙烯酸酯共聚物 ANM 丙烯腈-丙烯酸酯合成橡胶 AP 多羟基胺基聚醚 APP 无规聚丙烯 AR 丙烯酸酯橡胶 AS 丙烯腈-苯乙烯共聚物 ASA 丙烯腈-苯乙烯-丙烯酸酯共聚物 ATT 靛蓝 AU 聚酯型聚氨酯橡胶 AW 6-乙氧基-2,2,4-三甲基-1,2-二氢化喹啉 BAA 正丁醛苯胺缩合物 BAC 碱式氯化铝 BACN 新型阻燃剂 BAD 双水杨酸双酚A酯BAL 2,3-巯(基)丙醇 BBP 邻苯二甲酸丁苄酯 BBS N-叔丁基-乙-苯并噻唑次磺酰胺 BC 叶酸 BCD β-环糊精
BCG 苯顺二醇 BCNU 氯化亚硝脲 BD 丁二烯 BE 丙烯酸乳胶外墙涂料 BEE 苯偶姻乙醚 BFRM 硼纤维增强塑料 BG 丁二醇 BGE 反应性稀释剂 BHA 特丁基-4羟基茴香醚 BHT 二丁基羟基甲苯 BL 丁内酯 BLE 丙酮-二苯胺高温缩合物 BLP 粉末涂料流平剂 BMA 甲基丙烯酸丁酯 BMC 团状模塑料 BMU 氨基树脂皮革鞣剂 BN 氮化硼 BNE 新型环氧树脂 BNS β-萘磺酸甲醛低缩合物 BOA 己二酸辛苄酯 BOP 邻苯二甲酰丁辛酯 BOPP 双轴向聚丙烯 BP 苯甲醇 BPA 双酚A BPBG 邻苯二甲酸丁(乙醇酸乙酯)酯 BPF 双酚F BPMC 2-仲丁基苯基-N-甲基氨基酸酯 BPO 过氧化苯甲酰 BPP 过氧化特戊酸特丁酯 BPPD 过氧化二碳酸二苯氧化酯 BPS 4,4’-硫代双(6-特丁基-3-甲基苯酚) BPTP 聚对苯二甲酸丁二醇酯 BR 丁二烯橡胶 BRN 青红光硫化黑 BROC 二溴(代)甲酚环氧丙基醚 BS 丁二烯-苯乙烯共聚物 BS-1S 新型密封胶 BSH 苯磺酰肼 BSU N,N’-双(三甲基硅烷)脲 BT 聚丁烯-1热塑性塑料 BTA 苯并三唑 BTX 苯-甲苯-二甲苯混合物 BX 渗透剂 BXA 己二酸二丁基二甘酯
史上最全的英语缩写大全 任何语言都有它独特的缩写,熟练掌握一些常用、地道的英文缩写会让你对英文的识别力更敏锐,让你在听别人讲话或自己进行口头表达时更方便、更容易。 今天的内容分为两部分: 口语缩写+书面缩写 你在英文中能见到的比较常用且实用的缩写,基本都包括了。 【一】常见的口语缩写 在口语中我们经常碰到一些缩写,诸如wanna, gonna 之类,那么他们到底是怎么来的呢? 又是什么意思呢? 1.wanna (= want to) 【美国口语】 wanna 是"want to" 的缩写,意为“想要”“希望” eg: Wanna grab a drink tonight? 今晚喝一杯如何? wanna的使用范围极广,从日常口语到歌曲名称都有它的影子,有一首传唱度很高的歌想必大家都听过,歌名就是"B What U Wanna B" 2.gonna(= going to)
gonna 是"going to" 的缩写,用在将来时中,一般与be 动词连用成“be gonna”结构,但在口语中也有省略be 的情况出现。【美国口语】 eg: Who's gonna believe you? 谁会信你呢? 3.kinda (= kind of) kinda 是"kind of"的缩写,意为“有点”“有几分” eg: I'm kinda freaking out! 我快疯了! 4.sorta (=sort of)【美国口语】 sorta 是"sort of" 的缩写,意为“有几分”“可以说是” eg: I'm sorta excited. 我有点小兴奋! 5.gotta (=got to)【美国口语】 gotta是"got to"的缩写,意为“不得不”“必须”
英文缩写全称 A/MMA 丙烯腈/甲基丙烯酸甲酯共聚物 AA 丙烯酸 AAS 丙烯酸酯-丙烯酸酯-苯乙烯共聚物 ABFN 偶氮(二)甲酰胺 ABN 偶氮(二)异丁腈 ABPS 壬基苯氧基丙烷磺酸钠 ABR 聚丙烯酸酯 ABS 苯乙烯-丙烯腈-丁二烯共聚物 ABVN 偶氮(二)异庚腈 AC 偶氮(二)碳酰胺 ACB 2-氨基-4-氯苯胺 ACNU 嘧啶亚硝脲 ACP 三氧化铝 ACR 丙烯酸脂共聚物 ACS 苯乙烯-丙烯腈-氯化聚乙烯共聚物 ACTA 促皮质素 ADC 偶氮甲酰胺 ADCA 偶氮二甲酰胺 AE 脂肪醇聚氧乙烯醚 AES 脂肪醇聚氧乙烯醚硫酸酯钠盐 AI 酰胺-酰亚胺(聚合物) AK 醇酸树脂 AM 丙烯酰胺 AN 丙烯腈 AN-AE 丙烯腈-丙烯酸酯共聚物 ANM 丙烯腈-丙烯酸酯合成橡胶 AP 多羟基胺基聚醚 APP 无规聚丙烯 AR 丙烯酸酯橡胶 AS 丙烯腈-苯乙烯共聚物 ASA 丙烯腈-苯乙烯-丙烯酸酯共聚物 ATT 靛蓝 AU 聚酯型聚氨酯橡胶 AW 6-乙氧基-2,2,4-三甲基-1,2-二氢化喹啉BAA 正丁醛苯胺缩合物 BAC 碱式氯化铝 BACN 新型阻燃剂 BAD 双水杨酸双酚A酯 BAL 2,3-巯(基)丙醇 BBP 邻苯二甲酸丁苄酯 BBS N-叔丁基-乙-苯并噻唑次磺酰胺 BC 叶酸
BCD β-环糊精 BCG 苯顺二醇 BCNU 氯化亚硝脲 BD 丁二烯 BE 丙烯酸乳胶外墙涂料 BEE 苯偶姻乙醚 BFRM 硼纤维增强塑料 BG 丁二醇 BGE 反应性稀释剂 BHA 特丁基-4羟基茴香醚 BHT 二丁基羟基甲苯 BL 丁内酯 BLE 丙酮-二苯胺高温缩合物 BLP 粉末涂料流平剂 BMA 甲基丙烯酸丁酯 BMC 团状模塑料 BMU 氨基树脂皮革鞣剂 BN 氮化硼 BNE 新型环氧树脂 BNS β-萘磺酸甲醛低缩合物 BOA 己二酸辛苄酯 BOP 邻苯二甲酰丁辛酯 BOPP 双轴向聚丙烯 BP 苯甲醇 BPA 双酚A BPBG 邻苯二甲酸丁(乙醇酸乙酯)酯 BPF 双酚F BPMC 2-仲丁基苯基-N-甲基氨基酸酯BPO 过氧化苯甲酰 BPP 过氧化特戊酸特丁酯 BPPD 过氧化二碳酸二苯氧化酯 BPS 4,4’-硫代双(6-特丁基-3-甲基苯酚) BPTP 聚对苯二甲酸丁二醇酯 BR 丁二烯橡胶 BRN 青红光硫化黑 BROC 二溴(代)甲酚环氧丙基醚 BS 丁二烯-苯乙烯共聚物 BS-1S 新型密封胶 BSH 苯磺酰肼 BSU N,N’-双(三甲基硅烷)脲 BT 聚丁烯-1热塑性塑料 BTA 苯并三唑 BTX 苯-甲苯-二甲苯混合物 BX 渗透剂
MRP(material requirement planning)物料需求计划、MRPⅡ(manufacturing resource planning)制造企业资源计划和ERP(enterprise resource planning)企业资源计划,是企业管理信息系统发展的不同阶段。MPR主要对制造环节中的物流进行管理,使企业达到"既要保证生产又要控制库存"的目的;而MRPⅡ则集成了物流和资金流,将人、财、物,时间等各种资源进行周密计划,合理利用,以提高企业的竞争力;ERP它将供应链、企业业务流程和信息流程都囊括其中。由于ERP的概念流传最广,现在已经成为企业管理信息系统的代名词。 MIS(management information system)管理信息系统 PMC即Product material control 的缩写形式。是指对生产的计划与生产进度,以及物料的计划、跟踪、收发、存储、使用等各方面的监督与管理和废料的预防处理工作。PMC部主要有两方面的工作内容。即PC(生产计划、生产进度的管理)与MC(物料的计划、跟踪、收发、存储、使用等各方面的监督与管理,以及呆废料的预防与处理工作)。 R&D (Research & Development) 研发部 六标准差用来严格要求良率(Yield),一般而言相同的流程、程序,每重复一百万次只允许有三次或四次以下的错误,若达五次错误即是未达六标准差所设定的高良率水平 QC:Quality Control,品质控制,产品的质量检验,发现质量问题后的分析、改善和不合格品控制相关人员的总称.一般包括IQC(Incoming Quality Control来料检验),IPQC(In-Process Quality Control制程检验),FQC(Final Quality Control 成品检验),OQC(Out-going Quality Control出货检验),也有的公司不管三七
加拿大移民常用英文缩写汇总 加拿大移民常用英文缩写汇总 AEO = arranged employment opinion工作安排计划 AIP = approval in principle 原则批复 AR = Acknoledge Of Receiving 文档已接收 BBB = Better Business Bureau 商业改善局 BC=background check 背景调查: BM = Board Member (of the IRB) IRB 是难民局;难民局成员 CAIPS = Computer Assisted Immigration Processing System 调档 CBA = Canadian Bar Association 加拿大律师协会 CBSA = Canada Border Service Agency 加拿大边境服务局 CC = Canadian Citizen 加拿大公民 CEC = Canadian Experience Class 加拿大经验类移民 CIC = Citizenship and Immigration Canada 加拿大移民局 CIO = Centralized Intake Office 联邦技术移民申请集中处理中心CIO = Citizenship and Immigration Canada Office 加拿大公民和移民事务办公室 CID = Claimant Identification Number 申请人身份证号码CPC = Case Processing Centre 申请处理中心 CPO = Case Processing Officer 案件处理员 CSIC = Canadian Society of Immigration Consultants 加拿大移民顾问协会 CSQ = Certificate De Selection Du Quebec 魁北克甄选证明,即魁省移民甄选证书 DM = Decision made 材料申请完毕 EE = Express Entry 快速通道 FC = Federal Court of Canada 加拿大联邦法院 FN= File Number 档案号 FSW = Federal Skilled Worker 传统的联邦技术移民 HRSDC = human resources services and development of Canada 加拿大人力资源与发展 IAD = Immigration Appeal Division (of IRB) IRB 是什么还记得吗;移民上诉部门
起始字母为 O 英文缩写全称 OBP 邻苯二甲酸辛苄酯 ODA 己二酸异辛癸酯 ODPP 磷酸辛二苯酯 OIDD 邻苯二甲酸正辛异癸酯 OPP 定向聚丙烯 (薄膜 OPS 定向聚苯乙烯 (薄膜 OPVC 正向聚氯乙烯 OT 气熔胶 起始字母为 P 英文缩写全称 PA 聚酰胺 (尼龙 PA-1010 聚癸二酸癸二胺 (尼龙 1010 PA-11 聚十一酰胺 (尼龙 11 PA-12 聚十二酰胺 (尼龙 12 PA-6 聚己内酰胺 (尼龙 6 PA-610 聚癸二酰乙二胺 (尼龙 610 PA-612 聚十二烷二酰乙二胺 (尼龙 612 PA-66 聚己二酸己二胺 (尼龙 66 PA-8 聚辛酰胺 (尼龙 8 PA-9 聚 9-氨基壬酸 (尼龙 9
PAA 聚丙烯酸 PAAS 水质稳定剂 PABM 聚氨基双马来酰亚胺PAC 聚氯化铝 PAEK 聚芳基醚酮 PAI 聚酰胺 -酰亚胺 PAM 聚丙烯酰胺 PAMBA 抗血纤溶芳酸 PAMS 聚α-甲基苯乙烯 PAN 聚丙烯腈 PAP 对氨基苯酚 PAPA 聚壬二酐 PAPI 多亚甲基多苯基异氰酸酯PAR 聚芳酰胺 PAR 聚芳酯 (双酚 A 型 PAS 聚芳砜 (聚芳基硫醚 PB 聚丁二烯 -[1, 3] PBAN 聚 (丁二烯 -丙烯腈 PBI 聚苯并咪唑
PBMA 聚甲基丙烯酸正丁酯 PBN 聚萘二酸丁醇酯 PBR 丙烯 -丁二烯橡胶 PBS 聚 (丁二烯 -苯乙烯 PBT 聚对苯二甲酸丁二酯 PC 聚碳酸酯 PC/ABS 聚碳酸酯 /ABS树脂共混合金 PC/PBT 聚碳酸酯 /聚对苯二甲酸丁二醇酯弹性体共混合金 PCD 聚羰二酰亚胺PCDT 聚 (1, 4-环己烯二亚甲基对苯二甲酸酯 PCE 四氯乙烯 PCMX 对氯间二甲酚 PCT 聚对苯二甲酸环己烷对二甲醇酯 PCT 聚己内酰胺 PCTEE 聚三氟氯乙烯 PD 二羟基聚醚 PDAIP 聚间苯二甲酸二烯丙酯 PDAP 聚对苯二甲酸二烯丙酯 PDMS 聚二甲基硅氧烷 PE PEA 聚丙烯酸酯
企业各职位英文缩写: GM(General Manager)总经理 VP(Vice President)副总裁 FVP(First Vice President)第一副总裁 AVP(Assistant Vice President)副总裁助理 CEO(Chief Executive Officer)首席执行官,类似总经理、总裁,是企业的法人代表。 COO(Chief Operations Officer)首席运营官,类似常务总经理 CFO(Chief Financial Officer)首席财务官,类似财务总经理 CIO(Chief Information Officer)首席信息官,主管企业信息的收集和发布 CTO(Chief technology officer)首席技术官类似总工程师 HRD(Human Resource Director)人力资源总监 OD(Operations Director)运营总监 MD(Marketing Director)市场总监 OM(Operations Manager)运作经理 PM(Production Manager)生产经理 (Product Manager)产品经理 其他: CAO: Art 艺术总监 CBO: Business 商务总监 CCO: Content 内容总监 CDO: Development 开发总监 CGO: Gonverment 政府关系 CHO: Human resource 人事总监 CJO: Jet 把营运指标都加一个或多个零使公司市值像火箭般上升的人 CKO: Knowledge 知识总监 CLO: Labour 工会主席 CMO: Marketing 市场总监 CNO: Negotiation 首席谈判代表CPO: Public relation 公关总监 CQO: Quality control 质控总监 CRO: Research 研究总监 CSO: Sales 销售总监 CUO: User 客户总监 CVO: Valuation 评估总监 CWO: Women 妇联主席 CXO: 什么都可以管的不管部部长 CYO: Yes 什么都点头的老好人 CZO: 现在排最后,等待接班的太子 常用聊天英语缩写
化工产品英文缩写 (2009-12-19 10:52:20) 起始字母为 A 英文缩写全称 A/MMA 丙烯腈/甲基丙烯酸甲酯共聚物 AA 丙烯酸 AAS 丙烯酸酯-丙烯酸酯-苯乙烯共聚物 ABFN 偶氮(二)甲酰胺 ABN 偶氮(二)异丁腈 ABPS 壬基苯氧基丙烷磺酸钠 ABR 聚丙烯酸酯 ABS 苯乙烯-丙烯腈-丁二烯共聚物 ABVN 偶氮(二)异庚腈 AC 偶氮(二)碳酰胺 ACB 2-氨基-4-氯苯胺 ACNU 嘧啶亚硝脲 ACP 三氧化铝 ACR 丙烯酸脂共聚物 ACS 苯乙烯-丙烯腈-氯化聚乙烯共聚物 ACTA 促皮质素 ADC 偶氮甲酰胺 ADCA 偶氮二甲酰胺 AE 脂肪醇聚氧乙烯醚 AES 脂肪醇聚氧乙烯醚硫酸酯钠盐 AI 酰胺-酰亚胺(聚合物) AK 醇酸树脂 AM 丙烯酰胺 AN 丙烯腈 AN-AE 丙烯腈-丙烯酸酯共聚物 ANM 丙烯腈-丙烯酸酯合成橡胶 AP 多羟基胺基聚醚 APP 无规聚丙烯 AR 丙烯酸酯橡胶 AS 丙烯腈-苯乙烯共聚物 ASA 丙烯腈-苯乙烯-丙烯酸酯共聚物 ATT 靛蓝 AU 聚酯型聚氨酯橡胶 AW 6-乙氧基-2,2,4-三甲基-1,2-二氢化喹啉起始字母为 B 英文缩写全称
BAA 正丁醛苯胺缩合物 BAC 碱式氯化铝 BACN 新型阻燃剂 BAD 双水杨酸双酚A酯 BAL 2,3-巯(基)丙醇 BBP 邻苯二甲酸丁苄酯 BBS N-叔丁基-乙-苯并噻唑次磺酰胺 BC 叶酸 BCD β-环糊精 BCG 苯顺二醇 BCNU 氯化亚硝脲 BD 丁二烯 BE 丙烯酸乳胶外墙涂料 BEE 苯偶姻乙醚 BFRM 硼纤维增强塑料 BG 丁二醇 BGE 反应性稀释剂 BHA 特丁基-4羟基茴香醚 BHT 二丁基羟基甲苯 BL 丁内酯 BLE 丙酮-二苯胺高温缩合物 BLP 粉末涂料流平剂 BMA 甲基丙烯酸丁酯 BMC 团状模塑料 BMU 氨基树脂皮革鞣剂 BN 氮化硼 BNE 新型环氧树脂 BNS β-萘磺酸甲醛低缩合物 BOA 己二酸辛苄酯 BOP 邻苯二甲酰丁辛酯 BLP 粉末涂料流平剂 BMA 甲基丙烯酸丁酯 BMC 团状模塑料 BMU 氨基树脂皮革鞣剂 BN 氮化硼 BNE 新型环氧树脂 BNS β-萘磺酸甲醛低缩合物 BOA 己二酸辛苄酯 BOP 邻苯二甲酰丁辛酯 BPP 过氧化特戊酸特丁酯 BPPD 过氧化二碳酸二苯氧化酯 BPS 4,4’-硫代双(6-特丁基-3-甲基苯酚) BPTP 聚对苯二甲酸丁二醇酯 BR 丁二烯橡胶
工業常用的英文縮寫 品質人員名稱類 QC quality control 品質管理人員 FQC final quality control 終點品質管制人員 IPQC in process quality control 制程中的品質管制人員 OQC output quality control 最終出貨品質管制人員 IQC incoming quality control 進料品質管制人員 TQC total quality control 全面質量管理 POC passage quality control 段檢人員 QA quality assurance 質量保證人員 OQA output quality assurance 出貨質量保證人員 QE quality engineering 品質工程人員 新增: fool proof 防呆 screen printing 網印 品質保證類 FAI first article inspection 新品首件檢查 FAA first article assurance 首件確認 CP capability index 能力指數 CPK capability process index 模具製程能力參數 SSQA standardized supplier quality audit 合格供應商品質評估FMEA failure model effectiveness analysis 失效模式分析 FQC運作類 AQL Acceptable Quality Level 運作類允收品質水準 S/S Sample size 抽樣檢驗樣本大小 ACC Accept 允收 REE Reject 拒收 CR Critical 極嚴重的 MAJ Major 主要的 MIN Minor 輕微的 Q/R/S Quality/Reliability/Service 品質/可靠度/服務 P/N Part Number 料號 L/N Lot Number 批號 AOD Accept On Deviation 特采 UAI Use As It 特采 FPIR First Piece Inspection Report 首件檢查報告 PPM Percent Per Million 百萬分之一 制程統計品管專類
超实用英语缩写大全 无论口语表达还是书面表达,英语中也有很多缩写,如果你不能很好地理解和运用这些英语缩写,那就会大大影响你的英语日常交流水平,令你面临重重困难;反之,熟悉掌握这些英语缩写,能帮助你有效提高表达和沟通能力。 【一】常见的口语缩写 首先是非常简单和常见的,在口语中我们经常碰到一些缩写,诸如 wanna, gonna 之类,那么他们到底是怎么来的呢?又是什么意思呢? 1.wanna (= want to) 【美国口语】 wanna 是 "want to" 的缩写,意为“想要”“希望” eg: Wanna grab a drink tonight? 今晚喝一杯如何?
wanna的使用范围极广,从日常口语到 歌曲名称都有它的影子,有一首传唱度很高的歌想必大家都听过,歌名就是"Be What U Wanna Be " 2.gonna(= going to) gonna 是"going to" 的缩写,用在将 来时中,一般与 be 动词连用成“be gonna”结构,但在口语中也有省略be 的情况出现。【美国口语】 eg: Who's gonna believe you? 谁会信你呢? 3.kinda (= kind of) kinda 是"kind of"的缩写,意为“有点”“有几分” eg:
I'm kinda freaking out! 我快疯了! 4.sorta (=sort of)【美国口语】 sorta 是 "sort of" 的缩写,意为“有几分”“可以说是” eg: I'm sorta excited. 我有点小兴奋! 5.gotta (=got to)【美国口语】 gotta是"got to"的缩写,意为“不得不”“必须” eg: I gotta go now. 我现在得走了。 【二】常见的书面缩写
常用化工英文缩写与中文名对照 A/MMA:丙烯腈/甲基丙烯酸甲酯共聚物 AA:丙烯酸 AAS:丙烯酸酯-丙烯酸酯-苯乙烯共聚物 ABFN:偶氮(二)甲酰胺 ABN:偶氮(二)异丁腈 ABA:Acrylonitrile-butadiene-acrylate:丙烯腈/丁二烯/丙烯酸酯共聚物 ABS:Acrylonitrile-butadiene-styrene:丙烯腈/丁二烯/苯乙烯共聚物AES:Acrylonitrile-ethylene-styrene:丙烯腈/乙烯/苯乙烯共聚物AMMA:Acrylonitrile/methyl Methacrylate:丙烯腈/甲基丙烯酸甲酯共聚物 ARP:Aromatic polyester:聚芳香酯 AS:Acrylonitrile-styrene resin:丙烯腈-苯乙烯树脂 ASA:Acrylonitrile-styrene-acrylate:丙烯腈/苯乙烯/丙烯酸酯共聚物 BAA:正丁醛苯胺缩合物 BAD:双水杨酸双酚A酯 BCD:β-环糊精 BE:丙烯酸乳胶外墙涂料 BFRM:硼纤维增强塑料 BLE:丙酮-二苯胺高温缩合物
BMA:甲基丙烯酸丁酯 BN:氮化硼 BNE:新型环氧树脂 BNS:β-萘磺酸甲醛低缩合物 BOPP:双轴向聚丙烯 BPMC:2-仲丁基苯基-N-甲基氨基酸酯 BPTP:聚对苯二甲酸丁二醇酯 BR:丁二烯橡胶 BROC:二溴(代)甲酚环氧丙基醚 BS:丁二烯-苯乙烯共聚物 BT:聚丁烯-1热塑性塑料 BTX:苯-甲苯-二甲苯混合物 CA:Cellulose acetate:醋酸纤维塑料 CAB:Cellulose acetate butyrate:醋酸-丁酸纤维素塑料CAP:Cellulose acetate propionate:醋酸-丙酸纤维素CE:"Cellulose plastics, general":通用纤维素塑料CF:Cresol-formaldehyde:甲酚-甲醛树脂 CMC:Carboxymethyl cellulose:羧甲基纤维素 CN:Cellulose nitrate:硝酸纤维素 CP:Cellulose propionate:丙酸纤维素 CPE:Chlorinated polyethylene:氯化聚乙烯 CPVC:Chlorinated poly(vinyl chloride):氯化聚氯乙烯
制造业中常用的英文缩写 品质人员名称类 QC quality control 品质管理人员 FQC final quality control 终点质量管理人员 IPQC in process quality control 制程中的质量管理人员 OQC output quality control 最终出货质量管理人员 TQC total quality control 全面质量管理 POC passage quality control 段检人员 QA quality assurance 质量保证人员 OQA output quality assurance 出货质量保证人员 QE quality engineering 品质工程人员 品质保证类 FAI first article inspection 新品首件检查 FAA first article assurance 首件确认 CP capability index 能力指数媵 CPK capability process index 模具制程能力参数 SSQA standardized supplier quality audit 合格供货商品质评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类 AQL Acceptable Quality Level 运作类允收品质水准 S/S Sample size 抽样检验样本大小
ACC Accept 允收 REE Reject 拒收 CR Critical 极严重的 MAJ Major 主要的 MIN Minor 轻微的 Q/R/S Quality/Reliability/Service 品质/可靠度/服务 P/N Part Number 料号藊 L/N Lot Number 批号 AOD Accept On Deviation 特采 UAI Use As It 特采 FPIR First Piece Inspection Report 首件检查报告 PPM Percent Per Million 百万分之一 制程统计品管专类 SPC Statistical Process Control 统计制程管制 SQC Statistical Quality Control 统计质量管理 GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸 DIA Diameter 直径 N Number 样品数 其它品质术语类 QIT Quality Improvement Team 品质改善小组