?
SPECIFICATIONS
All specifications at +25°C, +V CC = +5V, f S = 44.1kHz, and 18-bit input data, SYSCLK = 384f S, unless otherwise noted.
NOTES: (1) Pins 1, 2, 3, 12, 13, 14: LRCIN, DIN, BCKIN, DM, FORMAT, SCKI. (2) Dynamic performance specs are tested with 20kHz low pass filter and THD+N specs are tested with 30kHz LPF, 400Hz HPF, Average-Mode.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
PIN ASSIGNMENTS
PIN NAME I/O FUNCTION
1(1)LRCIN IN Sample Rate Clock Input 2(1)DIN IN Audio Data Input
3(1)BCKIN IN Bit Clock Input for Audio Data.4
NC —No Connection
5CAP —Common Pin of Analog Output Amp 6V OUT R OUT Right-Channel Analog Output 7GND —Ground 8V CC —Power Supply
9V OUT L OUT Left-Channel Analog Output 10NC —No Connection 11NC —No Connection
12(2)
DM
IN
De-Emphasis Control
HIGH:De-emphasis ON LOW:De-emphasis OFF 13(2)TEST —Test Pin. Must be left open.14(1)
SCKI
IN
System Clock Input (256f S or 384f S )
NOTE: (1) Schmitt-Trigger input. (2) Schmitt-Trigger input with internal pull-up.
PIN CONFIGURATION
TOP VIEW
SOIC
ABSOLUTE MAXIMUM RATINGS
Power Supply Voltage ......................................................................+6.5V +V CC to +V DD Difference ...................................................................±0.1V Input Logic Voltage ..................................................–0.3V to (V DD + 0.3V)Power Dissipation ..........................................................................290mW Operating Temperature Range .........................................–25°C to +85°C Storage Temperature......................................................–55°C to +125°C Lead Temperature (soldering, 5s)..................................................+260°C Thermal Resistance, θJA ..............................................................+90°C/W
This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE SPECIFIED DRAWING TEMPERATURE
PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE NUMBER (1)
RANGE MARKING NUMBER (2)MEDIA PCM1744
SO-14235–25°C to +85°C
PCM1744U PCM1744U Rails
"
"
"
"
PCM1744U
PCM1744U/2K
Tape and Reel
NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book, or visit the Burr-Brown web site at https://www.wendangku.net/doc/7112666639.html,. (2) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering 2000 pieces of “PCM1744U/2K” will get a single 2500-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book.
PACKAGE/ORDERING INFORMATION
LRCIN DIN BCKIN
NC CAP V OUT R GND
SCKI TEST DM NC NC V OUT L V CC
1234567
141312111098
PCM1744
TYPICAL PERFORMANCE CURVES
At T A = +25°C, +V CC = +5V, f S = 44.1kHz, SYSCLK = 256f S , unless otherwise noted.
DYNAMIC PERFORMANCE
THD+N vs TEMPERATURE
Temperature (°C)
T H D +N a t 0d B (%)
0.0090.0080.007
0.0060.0050.0040.0030.0020.001
0–25
25
50
75
85
100
T H D +N a t –60d B (%)
3.23.1
3.0
2.92.82.72.62.52.42.3
SNR, DYNAMIC RANGE vs TEMPERATURE
Temperature (°C)
S N R (d B )
9998
97
9695949399989796959493
–25
25
50
75
85
100
D y n a m i c R a n g e (d B )
THD+N vs POWER SUPPLY
V CC (V)
T H D +N a t 0d B (%)
0.0090.0080.0070.0060.0050.0040.0030.0020.001
4.5
4.75
5.0 5.25
5.5
T H D +N a t –60d B (%)
3.23.1
3.0
2.92.82.72.62.52.42.3
SNR, DYNAMIC RANGE vs POWER SUPPLY
V CC (V)
S N R (d B )
999897
96959493
9998979695
9493
4.5
4.75
5.0 5.25
5.5
D y n a m i c R a n g e (d B )
THD+N vs SAMPLING RATE
Sampling Rate (kHz)
T H D +N a t 0d B (%)
0.0160.014
0.0120.010.0080.006
0.004
5.24.7
4.23.73.22.72.2
44.1
48
88.2
96
T H D +N A T –60d B (%)
SNR, DYNAMIC RANGE vs SAMPLING RATE
Sampling Rate (kHz)
S N R (d B )
9897
969594939291908988
98
9796959493
9291908988
44.1
48
88.2
96
D y n a m i c R a n g e (d B )
TYPICAL PERFORMANCE CURVES
At T A = +25°C, +V CC = +V DD = +5V, f S = 44.1kHz, and 18-bit input data, SYSCLK = 384f S , unless otherwise noted.
DIGITAL FILTER
00.4536f S
1.3605f S
2.2675f S
3.1745f S
4.0815f S
–20
–40
–60
–80
–100
d B
OVERALL FREQUENCY CHARACTERISTIC
Frequency (Hz)
PASSBAND RIPPLE CHARACTERISTIC
–0.2
–0.4–0.6
–0.8
–1
0.1134f S
0.2268f S 0.3402f S
0.4535f S
d B
Frequency (Hz)
DE-EMPHASIS FREQUENCY RESPONSE (44.1kHz)Frequency (kHz)
L e v e l (d B
)
0–2–4
–6–8–10–12
5
10
15
20
25
DE-EMPHASIS FREQUENCY ERROR (44.1kHz)
Frequency (kHz)
E
r r o r (d B )
0.60.40.20.0–0.2–0.4–0.6
4999.8375
9999.67514999.5125
19999.35
FIGURE 1. I 2S Data Input Timing.
FIGURE 2. Audio Data Input Timing.
SYSTEM CLOCK
The system clock for PCM1744 must be either 256f S or 384f S , where f S is the audio sampling frequency (LRCIN),typically 32kHz, 44.1kHz, 48kHz, 88.2kHz or 96kHz. The system clock is used to operate the digital filter and the noise shaper. The system clock input (SCKI) is at pin 14. Timing conditions for SCKI are shown in Figure 3.
PCM1744 has a system clock detection circuit which auto-matically detects the frequency, either 256f S or 384f S . The system clock should be synchronized with LRCIN (pin 1),but PCM1744 can compensate for phase differences. If the phase difference between LRCIN and system clock is greater
FIGURE 3. System Clock Timing Requirements.
than ±6 bit clocks (BCKIN), the synchronization is per-formed automatically. The analog outputs are forced to a bipolar zero state (V CC /2) during the synchronization func-tion. Table I shows the typical system clock frequency inputs for the PCM1744.
SYSTEM CLOCK FREQUENCY (MHz)256f S 384f S 32kHz 8.19212.28844.1kHz 11.289616.934048kHz 12.28818.43288.2kHz 22.579233.86896kHz
24.576
36.864
SAMPLING RATE (LRCIN)
TABLE I. System Clock Frequencies vs Sampling Rate.TYPICAL CONNECTION DIAGRAM
Figure 4 illustrates the typical connection diagram for PCM1744 used in a stand-alone application.INPUT DATA FORMAT
PCM1744 can accept input data a 24-bit I 2S format, as shown in Figure 1.
FIGURE 5. Internal Power-On Reset Timing.
RESET
PCM1744 has an internal power-on reset circuit. The internal power-on reset initializes (resets) when the supply voltage V CC > 2.2V (typ). The power-on reset has an initialization period equal to 1024 system clock periods after V CC > 2.2V.During the initialization period, the outputs of the DAC are invalid, and the analog outputs are forced to V CC /2. Figure 5illustrates the power-on reset and reset-pin reset timing.DE-EMPHASIS CONTROL
Pin 12 (DM) enables PCM1744’s de-emphasis function. De-emphasis operates only at 44.1kHz.
DM 0De-emphasis OFF
1
De-emphasis ON (44.1kHz)
TABLE II. De-emphasis Control Selection.
APPLICATION
CONSIDERATIONS
DELAY TIME
There is a finite delay time in delta-sigma converters. In A/D converters, this is commonly referred to as latency. For a delta-sigma D/A converter, delay time is determined by the order number of the FIR filter stage, and the chosen sampling rate. The following equation expresses the delay time of PCM1744:
T D = 11.125 x 1/f S
For f S = 44.1kHz, T D = 11.125/44.1kHz = 251.4μs Applications using data from a disc or tape source, such as CD audio, CD-Interactive, Video CD, DAT, Minidisc,etc., generally are not affected by delay time. For some professional applications such as broadcast audio for stu-dios, it is important for total delay time to be less than 2ms.OUTPUT FILTERING
For testing purposes all dynamic tests are done on the PCM1744 using a 20kHz low-pass filter. This filter limits the measured bandwidth for THD+N, etc. to 20kHz. Failure to use such a filter will result in higher THD+N and lower SNR and dynamic range readings than are found in the specifications. The low-pass filter removes out-of-band noise.Although it is not audible, it may affect dynamic specifica-tion numbers.
The performance of the internal low pass filter from DC to 24kHz is shown in Figure 6. The higher frequency roll-off of the filter is shown in Figure 7. If the user’s application has the PCM1744 driving a wideband amplifier, it is recom-mended to use an external low-pass filter. A simple 3rd-order filter is shown in Figure 8. For some applications, a passive RC filter or 2nd-order filter may be adequate.BYPASSING POWER SUPPLIES
The power supplies should be bypassed as close as possible to the unit. It is also recommended to include a 0.1μF ceramic capacitor in parallel with the 10μF tantalum bypass capacitor.
FIGURE 6. Low-Pass Filter Frequency Response.
FIGURE 7. Low-Pass Filter Wideband Frequency Response.
1050–5–10–15–20–25–30–35–40–45–50–5510
100
1k
10k
100k
1M
10M
Frequency (Hz)
d B
–60
INTERNAL ANALOG FILTER FREQUENCY RESPONSE
(10Hz~10MHz)
FIGURE 9. 5-Level ?Σ Modulator Block Diagram.
FIGURE 10. Quantization Noise Spectrum.
THEORY OF OPERATION
The delta-sigma section of PCM1744 is based on a 5-level amplitude quantizer and a 3rd-order noise shaper. This section converts the oversampled input data to 5-level delta-sigma format. A block diagram of the 5-level delta-sigma modulator is shown in Figure 9. This 5-level delta-sigma modulator has the advantage of stability and clock jitter over the typical one-bit (2-level) delta-sigma modulator.
The combined oversampling rate of the delta-sigma modu-lator and the internal 8x interpolation filter is 96f S for a 384f S system clock, and 64f S for a 256f S system clock. The theoretical quantization noise performance of the 5-level
delta-sigma modulator is shown in Figure 10.
5-LEVEL
DELTA SIGMA MODULATOR
Frequency (kHz)
G a i n (–d B )
200–20
–40–60–80–100–120–140–160
5
10
15
20
25
PACKAGING INFORMATION
Orderable Device
Status (1)Package Type Package Drawing
Pins Package Qty Eco Plan (2)
Lead/Ball Finish MSL Peak Temp (3)PCM1744U ACTIVE SOIC D 1450
Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM PCM1744U/2K ACTIVE SOIC D 142000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM PCM1744U/2KG4ACTIVE SOIC D 142000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM PCM1744UG4
ACTIVE
SOIC
D
14
50
Green (RoHS &no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.
LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.
NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.
PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.
(2)
Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check https://www.wendangku.net/doc/7112666639.html,/productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.
Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)
(3)
MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and
belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
https://www.wendangku.net/doc/7112666639.html,
6-May-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Type Package Drawing Pins SPQ
Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)
P1(mm)W (mm)Pin1Quadrant PCM1744U/2K SOIC
D
14
2000330.0
16.4
6.59.0 2.1
8.0
16.0
Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) PCM1744U/2K SOIC D142000346.0346.033.0
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are https://www.wendangku.net/doc/7112666639.html,rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement https://www.wendangku.net/doc/7112666639.html,e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered https://www.wendangku.net/doc/7112666639.html,rmation of third parties may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers Audio
Data Converters Automotive
DSP Broadband
Clocks and Timers Digital Control
Interface Medical
Logic Military
Power Mgmt Optical Networking
Microcontrollers Security
RFID Telephony
RF/IF and ZigBee?Solutions Video&Imaging
Wireless
Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265
Copyright?2008,Texas Instruments Incorporated