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FUJI GLUE-PASTE SOLDER

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1Solder Paste LF-988锡Sn银Ag3.0铜Cu0.5500g/bottle SMTSKY 2Solder Paste LF-588锡SN42.0铋Bi58.0

500g/bottle SMTSKY 3Solder Paste LF-588-AG1锡SN49.0/银Ag0.5/铋Bi50.5500g/bottle SMTSKY 4Solder Paste LF-588-AG2锡SN64.0/银Ag1.0/铋Bi35.0500g/bottle SMTSKY 5Solder Paste TL-388锡Sn63-铅Pb37500g/bottle SMTSKY 6Solder Paste TL-388-Ag Sn62.5-Pb37-Ag0.5500g/bottle SMTSKY 7FUJI GLUE NE8800T Scraping+Dispsion 200g/tube FUJI 8FUJI GLUE NE8800K Dispension

200g/tube FUJI 9FUJI GLUE NE3000S Scraping/Printing 200g/tube FUJI 10

FUJI GLUE

NE8800T

Scraping+Dispsion

30g20g/tube FUJI

Quotation

Business Process

1.any need email to us: smt@https://www.wendangku.net/doc/7b14192445.html,

2.quotation to you by email

3.order to us

4.invoice to you

5.pay to SMTSKY company

6.delivery to you and tell you tracking number by FEDEX TNT UPS DHL

7.received package and confirm that's ok

8.sales after service and next order again

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Unit Price

Remark

Sample

FUJI GLUE Seal-glo

SMT Scraping Printing and Dispensing Adhesive

1. Products list

model NE8800T Packing

200g/tube Use Machine DEK,MPM,MINAMI,FUJI,PANASONIC,MATSUSHITA ,CITIZEN,SONY,YAMAHA ,HITACHI,TDK,SANYO,J

UKI KYUSHK

NE8800K NE3000S

NE8800T Scraping/Printing Scraping+Dispsion

FUJI GLUE NE8800T NE8800K NE300S Cure conditions curve(recommend)

Discription

Scraping+Dispsion

200g/tube 200g/tube 30g20g/tube

Dispension

packed 200g to 30g

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2. Cure conditions curve

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3. Cure conditions

1.8800K/8800T/NE3000S: recommend cure conditions is substrate surface temperature of 150 ℃ after 60 seconds, reach 150 ℃ after 100 seconds,

2.sclerosis higher temperatures and hardening the longer, more can gain altitude with strength

3.According to chip size, and mounted in different position, the actual temperatures will change, so need to find the most suitable cure conditions smt@https://www.wendangku.net/doc/7b14192445.html, https://www.wendangku.net/doc/7b14192445.html, smt@https://www.wendangku.net/doc/7b14192445.html,

4. Discription

This product is SMT dedicated of thermal curing epoxy resin adhesives,follow:

1.Storage stability, easy to use

2 the fast-curing and good strength

3.Thixotropy good, electrical insulation good performance

4.This product is mainly used for flake resistor, capacitor, IC chip pasted on craft, suitable for dispensing and scraping the glue

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1.to make the characteristics maximum effect, please be sure to place freezer (2℃ ~ 10 ℃) save

2.From the fridge removed when using, please wait until then temperature completely recovered to room temperature

3.From cylindrical tube filling hose, please use our company special automatic filling machine, in order to prevent the bubble penetration

4. Already through the authentication

No 123456789Ro11,Ro12

助焊剂类型-FLUX TYPE

JIS-Z-2382Use DSC Instrument IPC-TM-650,2.2.14217-219℃

Sn/Ag3.0/Cu0.5/Ni0.06/Ge0.01助焊剂含量-Flux Proportion 熔点-Melting Point J-STD-004

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11±1.0wt%

球型粉-Ball powder

粘度-Viscosity 锡粉粒型-Powder Shape JIS-Z-3197,6.1规范标准-Standards

项目-Item JIS-Z-3197-99JIS-Z32840.10±0.05wt%(in Flux)卤素含量-Halogen Proportion 锡粉粒径-Powder Size 700±200kcps(25±1℃)0.06±0.02外观-Appearance 呈灰色糊状,不含异物,不可有结块-Grayish paste, excluding foreign body, cannot have agglomerate 规格-Specification

成分-Composition(wt.%)More then45um 1%-20um less then 10%

REM

合金成分 Lead-Free Solder Paste Alloy Sorts

0.01M AX 铅-Pb 砷-As 铋-Bi 隔-Cd 铟-In 3±0.150.5±0.1

0.1MA

Smooth printing is available even after 4hours idle time

Good hot slump performance,better than the requirements in IPC J-STD-005

The passing rate of fist time ICT is over than 97%

0.02M AX 0.03M AX 0.10M AX Model: LF-988

免洗型无铅焊锡膏 Lead-Free Solder paste (No clean)

High quality printability,clear and stable outline

Comprehensive performance

Based upon US/JAPAN technologies ,totally self-developed and improving ability to meet the requirements of the developing SMT process

铁Fe 锡-Sn 银-Ag 铜-Cu 镍-Ni 锗Ge 锌-Zn 铝-Ai 锑-Sb 0.01

0.005

0.003MAX 0.005MAX 0.20M AX 免洗型无铅锡膏规格-Specification

0.1MA X

Temperature Profile

代理商标签

/Agent

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龙健标签

/SMTSKY

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无铅低温锡膏系列-Lead Free Low Temperature Solder Paste Serial Model:LF-588

殘渣黏性試驗Viscous residue test

138℃

熔融性試驗Fusion Test

擴散率試驗Diffusion rate of test

銅鏡腐蝕試驗Copper Mirror Corrosion Test LF-588(Bi58)无铅锡膏係採用特殊的助焊膏與氧化物含量極少的球形錫粉煉製而成。具卓越的連續印刷解像性；此外，本製品所含有之助焊膏，採用具有高信賴的低離子性鹵素之活化劑系統，使其在迴焊之後的殘渣，即使免洗也能擁有極高的絕緣電阻試驗Insulation resistance test 流移性試驗Flow shift test 1 ×1012Ω more then less then 0.2mm LF-588(Bi58)the various characteristics of lead-free solder paste,项目-ITEM

规格-Specification 成分-Composition(wt.%)锡SN42.0铋Bi58.0熔点-Melting Point 電遷移試驗-Electromigration test TEST RESULT

1.02×105Ω.㎝ more then

PH值-PH

5.0±0.5

稠度-Concentration

700±200kcps;(Brookfield DV-Ⅱ+TF Spindle 5rpm at 25 ℃,2min)

Table-2

粘度-Viscosity

180±20Mpas;(Brookfield DV-E Spindle 10rpm at 25℃,5min)

测试项目-ITEM TEST

助焊剂含量-Flux Proportion 11.0 + 1 wt %Table-1

卤素含量-Halogen Proportion <0.2wt%

锡粉粒径-Powder Size 25-45um/20-75um 锡粉粒型-Powder Shape Ball powder No tin ball 88% more then

No corrosion conditions

Qualified

LF-588(Bi58)lead-free solder paste adopts special solder

paste(oxide content rarely spherical tin powder)refining and into;With excellent continuous printing characteristics;this product contains flux; adopt the high reliability of low ionic halogen of activator system; to the residue after reflow,even without cleaning the high reliability can be obtained

Printing Performance

1.連續印刷時，其黏度極少隨時變化，可獲得非常穩定印刷性。

1.Continuous printing, the viscosity changes very little at any time, access to the printing of very stable

2.擁有極佳焊接性，可在不同部位表現出適當的沾濕性。

2.Has an excellent weldability, can be shown in different positions of the appropriate wetting

3.能准确控制焊粉20-75μm,特制焊剂确保良好连续性印刷

3.Can accurately control the solder powder 20-75μm, to ensure good continuity of printing a special flux

4.SnBi系是低融點焊料，可适用于耐熱性較低的零件與底板同时它又是一种无铅合4.SnBi is a low melting point solder paste,Applicable to low heat resistance SMD chip and PCB board;but it also is a lead-free SnAgCu

alloy the low cost, it can reduce the amount of the cost of lead-free solder paste.

5.於極高之尖峰溫度下，亦能獲得良好的焊接性。

5.The peak at high temperatures, can also obtain good weldability

品質保証期間-During the quality assurance

品質保証期限為製造後90天，但必須密封保存於0 – 10 ℃及75 % RH以下。Quality assurance, 90 days after the period of manufacture, but must be sealed and stored at 0 - 10 ℃ and 75% RH the following

使用時應注意事項-Precautions should be used

手工攪拌時-When hand-mixing

1. 從冰箱中取出的錫膏必先使之回昇至室溫(在25℃環境中擱置約4- 6小時)後,始可開封並用刮鏟等攪拌均勻。若在未回昇至室溫前開封,錫膏難免吸濕,以致造成錫球發生.

Remove the paste from the refrigerator must first be allowed to return

to room temperature (at 25 ℃ in the hold of about 4 - 6 hours), before it can be such as Kaifeng, and stir with a spatula. If not return to room temperature prior to Kaifeng, Paste inevitable moisture, resulting in a tin ball

2.使用自動攪拌裝置時從冰箱中取出的錫膏必先使之回昇至室溫(在25℃環境中擱置約4- 6小時)後,始可使用自動攪拌裝置對密封錫膏進行攪拌約2～5分鐘，使其攪拌

2.when the use of automatic mixing device to remove the paste from the refrigerator must first be allowed to return to room temperature (at 25℃ in the hold of about 4 - 6 hours), before it can be sealed using automatic mixing device to stir the solder paste about 2 to 5 minutes, stirring to evenly

印刷條件-Printing conditions

LF-588(Bi58)无铅锡膏為非親水性，對濕度並不敏感，可以在較高濕度(最高80%相對濕度)及室溫下工作。印刷條件可在如表-3所示的範圍內設定之

LF-588 (Bi58) lead-free solder paste for non-hydrophilic, not sensitive to humidity, can be at a higher humidity (up to 80% relative humidity) and room temperature work. Printing conditions as shown in Table -3

元件的粘裝時間-Components of the stick installation time

元件的粘裝應在錫膏印刷後3 至6小時以內進行之。印刷後如果擱置太久，錫膏表面將發乾而造成元件粘裝不順

Components of the stick should be within the printing equipment 3 to 6 hours for it. If you stay too long after the printing, solder paste will dry the surface caused by adhesive mounted device will not ring

true

迴流焊條件-Reflow Soldering Conditions

下圖表示迴流焊的溫度曲線,以茲參考。該溫度曲線可以有效減低錫膏的垂流性以及錫球的發生。

The following figure shows the reflow furnace temperature profile, hereby reference. The temperature profile can effectively reduce the vertical flow of solder paste and tin ball

安全衛生上應注意事項-Health and safety precautions

1.本製品不含受管制之特定化學物質

1.The products do not contain chemical substances subject to the control

2.也不含有機溶劑中毒預防規則中所規制的有機溶劑，但仍應注意避免熔融錫膏所散發氣體的吸入，以及錫膏沾染皮膚。若有錫膏沾染皮膚，應立即用含有乙醇的綿花擦拭，再用肥皂與水沖洗。

2.Not containing organic solvents poisoning prevention rules in the regulation of organic solvents, but should be taken to avoid the dissemination of molten solder inhaled gases and paste contaminated skin. If solder paste contaminated skin immediately with cotton wipe

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项目-ITEM

成分-Composition(wt.%)熔点-Melting Point 锡粉粒径-Powder Size 锡粉粒型-Powder Shape Model:LF-588-AG1

锡SN49.0/银Ag0.5/铋Bi50.5148-206℃25-45um 金属含量-Metallic Content 卤素含量-Halogen Proportion PH值-PH

Ball powder 90.0±1%<0.2wt%4.6±0.5710±200kcps 180±20Mpas

稠度-Concentration 粘度-Viscosity

规格-Specification

抗氧化/抗腐蚀添加剂-Antioxidant/Corrosion inhibitor: 2–3%

氢化松香-Hydrogenated Rosin: 45–48%

直链C9-C12醇-Straight Chain C9-C12 Aliphatic Alcohol: 20–22%苯环C12-C16醚-Cyclical C12-C16 Ester: 9–15%聚合脂肪油-Polymerized Fatty Oil: 4–6%

有机酸活性剂-Di-Carboxylic acid activator: 4–8%有机胺-Organic Amine C8-C10: C8-C10 2–3%

助焊膏之成份（Wt %）-Paste Flux Composition

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锡粉粒径-Powder Size 25-75um 锡粉粒型-Powder Shape Model:LF-588-AG2

90.0±1%卤素含量-Halogen Proportion <0.2wt%项目-ITEM

规格-Specification

成分-Composition(wt.%)锡SN64.0/银Ag1.0/铋Bi35.0熔点-Melting Point 138-187℃稠度-Concentration test

Brookfied DV-2TF Spiindle 5rpm at 25℃,2rpm

PH值-PH

4.6±0.5稠度-Concentration 730±200kcps

Ball powder 金属含量-Metallic Content

锡铅合金焊锡膏Tin-lead alloy solder paste

Model:TL-388

4。Applicable under the general atmosphere and nitrogen reflow oven 4。可适用于一般大气下与氮气回流焊炉

2。Distance of 0.4mm above the PCB, to be completed by fine print.

3。拥有极佳焊锡性，可在不同部位都会有较好的可焊性。。

3。Has excellent solderability can be in different positions will have better weldability.

5。在极高的峰值温度下，也能获得良好的焊接性

5。At very high peak temperatures, but also good weldability

TL-388-免清洗锡膏是采用特殊的助焊剂，与液氧化物含量极少的锡铅合金粉炼制成。具卓越的连续印刷解像性；此外，本制品所含有的助焊膏，采用具有高信懒的和低离子性卤素活化剂系统，使其在过焊之后的残渣，既使免洗也能拥有极高的可靠性。该产品所用之锡合金在国际上已广泛使用。

TL-388 No-clean solder paste flux is the use of special,Oxide content is extremely little

liquid, forming a ball of tin lead alloy powder refined into;Continuous printing with excellent shape;Flux contained in the product for high reliability and low ionic Halogen activator system，the residue after reflow oven,no-clean can also have extremely high reliability; The product is used in tin-lead alloy has been widely used internationally.

印刷特性-Printing characteristics

1。连续印刷时，其粘度极少因时间而变化，可获取非常好的印刷性。

1。Continuous printing, the viscosity changes very little over time, can get very good printability.

2。对0.4mm以上间距的电路，可完成精美的印刷。

金属含量-Metallic Content 熔点-Melting Point S.I.R 稠度-viscosity >1.0*1012Ω800±200kcps

Spread %≥90Sn63-Pb37

项目-ITEM 成分-Composition(wt.%)Ball powder 90.0±1%PH 锡粉粒径-Powder Size 锡粉粒型-Powder Shape 规格-Specification Sn63-Pb37183℃25-45um 4.8 + 0.2

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S.I.R

>1.0*1012Ω稠度-viscosity

800±200kcps

金属含量-Metallic Content 90.0±1%Spread %≥90

项目-ITEM

锡粉粒径-Powder Size 25-45um 锡粉粒型-Powder Shape Ball powder 成分-Composition(wt.%)Sn62.5-Pb37-Ag0.5熔点-Melting Point 179-183℃规格-Specification Sn/Pb 63/37 and Sn 62/Ag(1-2) /Pb recommended profile

Sn62.5-Pb37-Ag0.5

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Model:TL-388-Ag

4.8 + 0.2