PCB专业术语中英文对照
1影響電性及外觀Affect upon electrical performance or appearance 2過度的Excessively
3異常Abnormal
4規格不符specification is below standard
5品質異常quality is below standard
6嚴格按照QC規定Strictly according to QC regulation
7定期研磨To make regularly re-sharpen
8設備device(另義:主動零件) \ machine \ equipment
9參數設置錯誤parameters setting error
10依保養計劃According to the maintaining plan
11壓力過小lack of pressure
12曝光不全\過度exposure-energy insufficient\excessive
13間距不足spacing nonenough
14線細width reduce
15光強度Light Intensity
16缺口nick\chipping
17氣泡Bubble\blister\air inclusion
18異物foreign particle \ foreign material（壓合異物）\dust(灰塵) 19被污染contaminated
20干膜附著力不足 Poor adhesion of dry film
21固定點開路fixed position open
22固定點短路fixed position short
23線路針孔trace pin-hole
24孔破void in PTH hole\Barrel Crack
25斷脖子Open near pad
26靜置時間Holding time
27識別方法identify method
28膜屑反粘Contrary to adhere of scum
29碎屑,殘材 Debris
30顯影不潔Developing uncleanness
31外觀不良Appearace defective
32傳動\傳送速度convey speed
33偏離deviation\shifted
34單軸single axis
35底片漲縮A/W expand or contract 36漏失率Loss Rate
37補償compensation\balancing 38零件孔\面component hole\side
39覆铜箔层压板\
銅箔基板
copper clad laminates (CCL)
40線路露銅copper exposure 41織紋顯露weave exposure
42光學點\基準標記fiducial mark
43環氧樹脂epoxy
44蝕刻速率etch rate
45網布fabric
46助焊劑不均勻flux coating uneven 47過濾filtration
48電測治具fixture
49鉆尖分離gap
50標準板golden board
1影響上件及外觀affect upon mounting or appearance
2銅厚測量儀Copper thickness Measuring Instrument
3佐證evidence
4微蝕量microetching quantity
5 濕度humidity
internal proofread cycle\calibration system cycle 6內部校正周期(校驗矯
正)
7板面刮傷Surface Scratch
8制定handling 標準Define standard of handling
9目視檢查\目檢visual inspection
10規定頻率defined frequency
11壓力計\表pressure gauge
12工程程式designed program
13超規格out of the tolerance
14毛頭\去毛頭burr\deburring
15影響下工序製作difficult to product in the following process
16化學銅electroless plating
17除膠速率desmearing rate
18電流current
19分層delamination\bulge
20濕潤Damped
21預浸Pre-dipped
22活化液activator
23速化accelerator
24漂錫solder float
25熱應力測試thermal stress test
26孔環(焊墊)Lifted land\annular ring
27熱水洗Hot water rinsing
28震動馬達vibrating motor
29銅渣copper residue (copper splash)\cosmetics island獨
立銅渣
30清潔濾網purifying filters
31定期換水replace water regularly
32回收槽recovery tank
33加強管控to strengthen the control of sth.
34酸洗\鹼洗acid\alkali rinse
35定期分析濃度Analyze Conc. regularly
36金屬雜質污染Contamination of metal impurities
37碳化物carbide
38碳處理carbon treatment
39整流器(電流矯正)Current rectifier
40銅厚測量儀Copper Thickness Measuring Instrument 41刷磨速度Brush Speed
42速度控制器velocity controller
43電流控制器current controller
44吸水滾輪破舊water-absorptive roller worn-out
45新水補充不足Insufficient for water replenishment
46濾芯Filter element
47化學藥液chemicals liquid
48孔塞(孔內異物)dirty hole
49多與\少與1mil厚
Less\More than 1 mil Thickness 度
50色差color variation
1板面粘油墨屑(顯影段)sticky ink debris
2擋水滾輪water apart roller
3網板高度Screen height
4網板張力不足Screen tension insufficient
5刮刀行程Squeegee distance
6刮刀刃鈍化Squeegee edge blunt
7油墨黏度過大viscosity of ink too thick
8張力應力tensile stress
9后烤Post cure
10印C面Printing Top(COMP) Side
11印S面Printing (SOLD)Bottom Side
12靜電噴涂Spray Coating
13印可剝膠Peelable Solder Mask
14風刀air knife
15隔離環clearance
16燒焦burning
17化鎳金immersion nickel and gold
18銅鎳層接著不良Poor combination the copper and nickel 19刷磨滾輪brush roller
20刷幅測試brush breadth\width test
21脫脂溫度Defatting Temp.
22流量計flowmeter
23執行\導電Conduct
24助焊劑\熔合液rosin(天然松香)\flux\fusing fluids
25錫粗Tin roughness
26焊料中銅離子含量過高The cu2+ content out of upper in solder 27機臺異常machine-motion error
28缺點標示卡nominal card of defects
29程序\程式錯誤Programbug
30人員疏忽operator's carelessness
31日保養daily maintainance
32人員技能不熟練Operator is not skilled
33口頭考核examine orally
34阻抗異常Impedance Abnormal
35阻抗測量儀impedance measuring instrument
36漏氣puncture
37受潮moisture absorption
38膜面污染film surface contaminated
39漏檢Leaking inspection
40二次元 2D(biaxial) dimension-measuring instrument 41工單run card\work order
42飛針Flying Probe
43目檢Visual Inspection
44專用治具測試Dedicated Tester
45特殊特性Critical Feature
46重要特性Important Feature
47銅箔厚度Copper foil Thickness
48板彎翹Bow and Twist(warp)
49尺寸(含對角)Size(Diagonal)\dimensions(成型)
50拉力計\張力計tensile meter
1棕化\黑化Brow\black oxide
2循環水洗circulating water rinsing
3PP膠片Prepreg
4物理性質\化學性質physical\chemical character
5暫存時間Temporary store time
6鉚釘組合Eyelet
7疊板結構stacking(lay up) structure
8鉚釘rivet
9熱熔機heat-melting machine
10有用壽命useful life
11印製電路板Printed Circuit Board(PCB)
12根本原因\真因Root Cause
13圍堵措施Containment Plan
14現狀Current Status
15原因分析Gap Analysis
16內部稽核\外部稽核Internal\outside Audit
17修改\變更Modify
18無鹵素Halogen Free
19更新\修訂Update/Revise
20改進措施ure Plan
21長期異常Chronic
22突發異常Excursion
23陶爾(壓力單位)Torr
24靶孔距Space between target holes
25層偏misalignment
26組合線Combined producing line
27鋼板\隔板steel plate\caul plate\separator
28板厚測量儀Board-thickness measuring instrument 29鋼印機 steel seal machine
30品質檢驗 quality examination
31介質厚度dielectric thickness
32吸水性moisture absorbability
33耐磨性wear resistance
34剝離強度stripping strength
35焊錫耐熱性heat-resistant of solder
36抗麻斑測試spot-resistant test
37信賴性測試reliability test
38介電常數測量儀dielectric constant measuring device 39包裝標籤packing tag
40電子天平electrical balances
41焊錫爐solder furnace
42孔徑規calliper gauge
43比色計color comparing meter
44密度計density meter
45蝕刻均勻性Etching uniformability
46化驗單 laboratory list
47出貨單manifest
48雙面板\多層板 Reversible Board\Multi layer board 49定位孔 Location Hole
50疊板數stack boards count
1硝基戊烷amylnitrite
2陽極泥anode slime (sludge)
3液態光阻aqueous photoresist
4縱橫比aspect ratio
5預留在製品banked work in process 6貝他射線照射法beta backscattering
7斜邊beveling
8吹孔blow hole
9黏結層bonding plies
10焊橋solder bridge
11接單生產Build To Order(BTO) 12金手指斜邊\倒角chamfering
13網框chase
14螯合劑chelator
15化學鍵chemical bond
16熱膨脹Thermal Expansion
17同心圓concentric circle
18密貼性conformance
19消費類產品consumer products
20庫倫定理coulombs law
21喇叭孔countersink
22試樣coupon\sample
23覆蓋力covering power
24挖空cut-outs
25交期縮短cycle-time reduction 26專用型dedicated
27縮錫dewetting
28介質常數dielectric constant
29孔黑\孔灰discolor hole
30停機\稼動時間downtime\uptime
31鉆針切削面drill facet
32鉆針研磨機drill pointer
33裸板(未鍍銅) blank board
34延展性ductility\Elongation
35留邊寬度edge spacing
36金手指edge-board contact ( gold finger )\tab 37電化學反應器electrochemical reactor
38脆性embrittlement
39植PIN法\外部插梢法external pin method
40織維突出fiber protrusion
41成品final board
42固著fixing
43燃燒等級flammability rating
44抗菌性\抗酶性fungus resistance
45膠化時間gel time
46一般阻焊油墨general resist ink
47玻璃態轉換溫度glass transition temperature (Tg)
48多孔\少孔Extra/Missing Hole
49硬化劑hardener
50空氣濾清器\過濾器hepa filter
1規範specification\standard
2銑靶spot face
3衝壓\鋼印stamping
4標準液壓法standard hydraulic lamination 5缺膠starvation
6應力\應度strain
7應力計stress meter
8板面突起surface convex\swelling
9板面檢查surface examination
10板面粗糙度surface roughness
11熱震蕩試驗thermal shock
12厚度不均uneven thickness distribution 13抗污抗氧化劑tarnish and oxide resist
14透光度transmittance
15裁切線trim line
16測試undercut
17萬用型universal
18有形庫存visible inventory
19倉庫warehouse
20濕化學制程wet chemistry process
21燈芯\滲銅wicking
22縱橫比width-to-thickness ratio
23良率yield
24點燈次數Times of Light switch
25真空延遲時間Vacuum delayed time
26+/-2 周The front or rear two weeks 27無塵室clean room
28上噴壓Upper spray pressure
29下噴壓Lower spray pressure
30顯影劑developer
31主軸轉速(RPM) Spindle Revolution Speed\Revolution Per Minute
RPM
32光電耦合器(Charge Couple Device) CCD
3390° 孔切破90 degree breakage
34缺點偵測\檢測defect detection
35聚焦focus
36光校正calibration
37極性Polarity
38正極\陽極Positive
39負極\陰極Negative
40下鉆點\下刀點entry
41量杯measuring cup
42微切片Microsection
43爆孔hole breakout(鑽孔)\hole overflow(防焊油墨) 44溫差temperature difference
45文字不清marking(symbol) blurred
46文字白點S/L white point
47補充顯影additional developing
48烘烤baking
49確認檢修系統Visual Repair System(VRS)
50圖表Diagram
1腐蝕Corrosive
2致癌物carcinogenic
3有機體突變的Mutagenic
4染色體錯位chromosome aberration
5畸形teratogenic
6有害氣體poisonous gas
7易燃性Inflammability
8爆炸性explosion
9吸入\吸入劑inhalation
10護目鏡goggle
11棉手套Cotton glove
12化學特性Chemical properties
13熔點Melting point
14抽樣檢查spot check
15沸水boiling water
16沖模Punching
17氫溴化物hydrochloride
18醇\酒精alcohol
19持續改進continual improvement
20糾正措施corrective action
21環境因素\影響\方針environment aspect\impact\policy 22環境管理體系environment management system 23污染預防prevention of pollution
24品質關鍵點critical to quality(CTQ)
25客戶需求分析Customer Needs Mapping(CNM) 26質量功能分布Quality Function Deployment(QFD)
27失效模式及後果分
析Failure Mode & Effects Analysis(FMEA)
28跨功能小組Cross-functional involvement 29傳感器sensor
30點陣圖tally chart
31全面品質管理Total Quality Management(TQM)如QC七大手法32柏拉圖Pareto Chart
33因果圖\魚骨圖Cause and Effect diagrams
34腦力激蕩Brainstorming
35散布圖Scatter diagrams
36全面設備保養Total Productive Maintenance(TPM)
37控製圖Conttrol Chart
38測定系統分析Gage Repeatability&Reproducibility(GRR)
39印製電路板協會Institute of printed circuit(IPC)
40有機保焊膜Organic Solderability Preservative(OSP)
41進刀Feed
42金鹽Potassium Gold Cyanide(金氰化鉀PGC)
43輻射式紅外線焊
Radiation(輻射) Infrared Rays(IR) Reflow(焊接)接
44錫膏熔焊Reflow Soldering
45縮錫Dewetting
46錫爐浮渣Dross
47錫尖Solder Icicle
48錫球Solder Ball
49電容器capacitor
50波峰焊Wave Soldering
1石油petroleum
2線圈\纏繞coil
3代理商agency
4自由基Free Radical
5鍍金Golden Plating
6防焊阻劑Polymer coating(solder resistent) 7內層(外層)孔環Internal(external) Annular ring 8隧道式烤箱transmission toaster
9直立式烤箱vertical toaster
10光面\霧面油墨glossy\matte ink
11晶片直接組裝Chip On Board(COB)
12組裝密度packaging density
13球狀陣列Ball Grid Array(BGA)
14焊膏solder paste\solder cream
15焊料粉末(焊粉)solder powder
16觸變性thixotropy(粘度變化特性)
17儲存壽命shelf life
18網版(脫網)高度snap off distance
19拉絲stringing
20平移偏差shifting deviation
21貼裝幾Placement equipment
22虛焊點(焊點不佳)colder solder connection
23焊盤起翹lifted land
24錫珠solder ball
25波峰焊wave soldering
26迴流焊reflow soldering
27離子清潔度ion cleaning
28印製電路元件printed circuit assembly(PCA) 29特采Accept on Deviation\Use As It 30首件检验报告First Piece Inspection Report
31工序变更通知Process Chang Notice（PCN）
32孔銅厚度Barrel Copper thickness\Hole Copper Thickness 33面銅厚度Surface Copper Thickness
34皺折wrinkle
35置信區間Confidence interval
36相關性Correlation
37相關矩陣Correlation Matrix
38任意抽樣法Haphazard Sampling
39不合格品Nonconforming units
40不合格Nonconformity
41正態分布Normal Distribution
42排列圖(柏拉圖)Pareto Chart
43預測區間Prediction Interval
Probability Based Chart
44基於概率的控制
圖
45制程能力Process Capability
46二次函數Quadratic
47隨機抽樣Random sampling
48極差Range
49合理子組Rational Subgroup
50回歸控製圖Regression control chart
1故障failure\breakdown
2夾頭grip holder
3解析度\解像度resolution
4可靠度reliability
5孔位錯誤(孔偏)mis hole location
6孔徑\鉆孔直徑錯誤Hole Diameter error
7離子污染度試驗ionic contamination testing
8線距line space
9線寬line width\trace width
10感光油墨liquid photoimageable solder resist ink 11批batch\lot
crazing\mealing(白點)\Haloing(白邊) 12 裂痕\白斑\白點\白
邊
13對位不准misregistration
14釘頭nail heading
15數位鉆孔機NC drill
16原稿底片original art work (A/W)
17鉆針重疊overlap
18氧化oxidation
19剝離\抗撕強度peel strength
20感光起始劑photo initiator
21凹陷dent
22塞孔plug hole\stuffing
23補線不良poor touch-up
24循環周期Periodically cycle
25初始資料protocal
26噴砂pumice scrub
27對位孔registration hole
28文字印刷silk screen printing\printing of legend 29膠渣resin smear
30孔壁粗糙度roughtness
31防焊文字S/L
32毛邊serrated edges 33跳印skip printing
34漂錫solder float
35噴涂spray coating
36刮刀Squeegee
37孔規taped hole gauge 38薄基板\內層板thin core
39工作片
工作母片
working gerber
working master gerber
40粗化abrade
41電流密度Current Density
42風刀Air Knife
43獲取資格的Qualify/qualified + n. or + to
44現場locality(PD)
45濃度偏低Conc. Lower
46濃度偏高Conc. Higher
47人員疏忽Operator careless
48經緯向錯誤longitude and latitude contrary
49上件不良failed componmt mounting
50防呆孔Poka-Yoke hole\ mistake proofing hole
1假性露銅unreal copper exposure
2積墨ink accumulation
3印偏ink printing deviated
4遵照現場作業規範comply with the handling standardization 5放置時間Holding time
6烘乾溫度不足Insufficient in dry temperature
7設備故障breakdown of machine
8壓膜滾輪 D/F laminated roller
9sth. 受損或污染Damaged or contaminated
10粘塵壓力sticky pressure
11曝光燈管exposure fluorescent tube
12光階 light step condition
13曝偏Exposure misregistration
14層間對準度alignment registration
15吸氣不良vacuum treatment abnormal
16曝光藏點Exposure shelter
17人員動作不當improper handling
18顯影Developing
19蝕刻Etching
20去膜stripping
21Mylar 未撕Mylar non tearing off
22教育訓練instruction and trainning
23進行顯破點測試conduct developing point broken test 24噴壓Spraying pressure
25蝕刻不潔Etching incompletely\underetch
26蝕刻液Etchants
27首件確認First article confirm
28電性不良Electrical performance defective
29去膜不凈Film stripping uncleanness
30幾臺漏測Equipment test leaking
31領班Foreman
32主管Chief
33穩定性Stability
34誤判Misjudgement
35混料Mixture
36鋁粉濃度(火山灰)Aluminum percentage
37超音波測試(錫箔
Tin foil perforating test 紙)
38水破測試water broken test
39油墨黏度ink viscosity
40黏度計viscosimeter
41數孔機hole counter
42振動馬達vibration motor
43網版調偏net screen misregistration 44試印膜trial printing film
45機臺未清潔worktable uncleaness
46萬用塞孔墊板universal plugging back-up 47預烤Precure
48上錫\焊錫性不良poor solderability
49溫度均勻性Temp. uniformability 5010倍放大鏡10X magnifier