sony ACF CP8830IH4 technical data

CP8830IH4 Technical Data

1.

CP8830IH4 COG CP8830IH ACF

2.

PET 12 m

25 m

4 m Ni/Au+ 23

5 /mm 3

PET 38 m

3

ACF 40 80 1 2kgf/cm 2

180 10sec 40 80Mpa/ ACF

4.

1

ppm/ 52TMA at30 Gpa 1.7DMA at150 Gpa 0.08DMA

Tg 138

DMA tan peek

wt% 1.8

85 85%RH

5.

IC 2X20 mm, 0.55mm

IC

Bump 50 m 150, Plating Au-plated bump 20 m

Bump Pitch80 m, number of bump : 522

Pattern ITO 10

CP8830IH4 Array

FT-IR

6.

7. IC IC 1.8 mm 1.8 mm 20 , 0.5mm t

Bump

30 m 45 , Plating Au-plated bump 18 m t TYPE S 30 m 85 , Plating Au-plated bump 18 m t TYPE M

Bump Pitch 50 m, number of bump : 964 Pattern

ITO 10 t 0.7 glass

85 /RH85%

Fig.1 85/85 190 5sec bunp type M

Fig.2 85/85 190 5sec bump type S

Fig.3 85/85 190 5sec bump type S CP8830IH

Fig.4 100

190 5sec bump type S Array Fig.5 40

190 5sec bump type S

Fig.6 40 100

190 5sec bump type S