MPX4250A Rev 6, 12/2006
Freescale Semiconductor Technical Data
? Freescale Semiconductor, Inc., 2006. All rights reserved.
Integrated Silicon Pressure Sensor Manifold Absolute Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated
The MPX4250A/MPXA4250A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder.
The MPX4250A/MPXA4250A series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of
applications, particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining
techniques, thin-film metallization and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. The small form factor and high reliability of on-chip integration make the Freescale sensor a logical and economical choice for the automotive system engineer.Features ? 1.5% Maximum Error Over 0° to 85°C
?Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems
?Patented Silicon Shear Stress Strain Gauge
?Temperature Compensated Over -40° to +125°C
?Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules
?Durable Epoxy Unibody Element or Thermoplastic Small Outline, Surface Mount Package
?Ideal for Non-Automotive Applications
Typical Applications
?Turbo Boost Engine Control
?
Ideally Suited for Microprocessor or Microcontroller-Based Systems
ORDERING INFORMATION
Device Type
Options
Case No.
MPX Series Order Number
Packing Options
Device Marking
SMALL OUTLINE PACKAGE (1) (MPXA4250A SERIES)
1.The MPXA4250A series pressure sensors are available in the basic element package or with pressure port fitting. Two packing options are offered for each type. Basic Elements
Absolute, Element Only 482MPXA4250A6U Rails MPXA4250A 482MPXA4250A6T1Tape & Reel
MPXA4250A Ported Elements
Absolute, Axial Port 482A MPXA4250AC6U Rails MPXA4250A 482A
MPXA4250AC6T1
Tape & Reel
MPXA4250A
UNIBODY PACKAGE (2) (MPX4250A SERIES)
2.The MPX4250A series pressure sensors are available in the basic element package or with pressure port fittings providing mounting ease and barbed hose connections.
Basic Element
Absolute, Element Only 867MPX4250A —MPX4250A Ported Elements
Absolute, Ported 867B
MPX4250AP
—
MPX4250AP
MPX4250A MPXA4250A SERIES
INTEGRATED PRESSURE SENSOR
20 TO 250 kPA (2.9 TO 36.3 psi)
0.2 TO 4.9 V OUTPUT SMALL OUTLINE PACKAGE
PIN NUMBERS
1N/C (1), (2)
1.Pin 1 in noted by the notch in the lead.
2.Pins 1, 5, 6, and 7 are internal device connections. Do not connect to external circuitry or ground.
5(2)N/C 2V S 6(2)N/C 3GND 7(2)
N/C 4
V OUT
8
N/C
UNIBODY PACKAGE PIN NUMBERS
1V OUT (1)1.Pin 1 in noted by the notch in the lead.4N/C (2)2. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground.
2GND 5N/C (2)3
V S
6
N/C (2)
MPX4250A Sensors
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings (1)
1. TC = 25°C unless otherwise noted.
Rating
Symbol Value Unit Maximum Pressure (2) (P1 > P2)2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
P MAX 1000kPa Storage Temperature T STG -40 to +125°C Operating Temperature
T A
-40 to +125
°C
Thin Film Temperature Compensation
and Gain Stage #1
V S
Sensing Element
V OUT
GND
Gain Stage #2
and Ground Reference Shift Circuitry
Pins 4, 5, and 6 are NO CONNECTS for unibody Device
Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device.
MPX4250A
Sensors
Table 2. Operating Characteristics (V S = 5.1 V DC , T A = 25°C unless otherwise noted, P1 > P2, Decoupling circuit shown in Figure 3 required to meet electrical specifications.)
Characteristic
Symbol Min Typ Max Units Differential Pressure Range (1)1. 1.0 kPa (kiloPascal) equals 0.145 psi.
P OP 20—250kPa Supply Voltage (2)2. Device is ratiometric within this specified excitation range.
V S 4.85 5.1 5.35V DC Supply Current
I O —7.010mAdc Minimum Pressure Offset (3)(0 to 85°C)
@ V S = 5.1 Volts 3. Offset (V OFF ) is defined as the output voltage at the minimum rated pressure.
V OFF
0.133
0.204
0.264
V DC
Full Scale Output (4)(0 to 85°C)
@ V S = 5.1 Volts 4. Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.
V FSO
4.826 4.896 4.966
V DC
Full Scale Span (5)(0 to 85°C)
@ V S = 5.1 Volts 5. Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. V FSS
— 4.692—
V DC
Accuracy (6)(0 to 85°C)
6. Accuracy (error budget) consists of the following:
?Linearity:
Output deviation at any temperature from a straight line relationship with pressure over the specified pressure range.
?Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
?Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
?TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. ?TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.?Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
———±1.5%V FSS Sensitivity ?V/?Ρ—20—mV/kPa Response Time (7)
7. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. t R — 1.0—msec Output Source Current at Full Scale Output I O +—0.1—mAdc Warm-Up Time (8)8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.——20—msec Offset Stability (9)
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. —
—
±0.5
—
%V FSS
Table 3. Mechanical Characteristics
Characteristics
Typ Unit Weight, Basic Element (Case 867)
4.0Grams Weight, Small Outline Package (Case 482)
1.5
Grams
MPX4250A Sensors
Figure 2. Cross Sectional Diagram (Not to Scale) Figure 2 illustrates the absolute pressure sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.
The MPX4250A/MPXA4250A series pressure sensor operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability.
Figure 3. Recommended Power Supply Decoupling and
Output Filtering
(For additional output filtering, please refer to Application
Note AN1646.Contact the factory for information regarding media compatibility in your application.
Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller.
Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over temperature range of 0° to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.
Figure 4. Output vs. Absolute Pressure
FloroSilicone Die Coat
Wire Bond
RTV Die Bond
Die
P1
P2
Epoxy Case
Lead Frame
Sealed Vacuum Reference
Stainless Steel Metal Cover
1.0 μF 470 pF
Vs
+5 V
0.01 μF GND Vout
IPS
OUTPUT
O u t p u t (V o l t s )
5.04.54.03.53.0MAX
2.52.01.51.00.50
0102030405060708090100110120130140150160170180190200210220230240250260
MIN
TYP
Pressure (ref: to sealed vacuum) in kPa
Transfer Function:
V OUT = V s * (0.004 x P-0.04) ± Error V S = 5.1 Vdc
TEMP = 0 to 85°C
MPX4250A
Sensors
Transfer Function
Nominal Transfer Value: V OUT = V S (P × 0.004 - 0.04)
± (Pressure Error × Temp. Factor × 0.004 × V S )V S = 5.1 V ± 0.25 V DC
Temperature Error Band
Temp Multiplier - 4030 to 851+125
3
4.03.0
2.00.0
1.0-40
-20
20
40
60
140
120
100
80
Temperature Error Factor
Temperature in C°
NOTE: The Temperature Multiplier is a linear response from 0× to -40°C and from 85° to 125°C.
Pressure Error (Max)20 to 250 kPa ±3.45 (kPa)
Pressure (kPa)
751001251501752002252550250
4.03.02.01.00-1.0-2.0-3.0-4.0-
5.0
5.00Pressure Error (kPa)
Pressure Error Band
MPX4250A Sensors
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct
Footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.Figure 5. SOP Footprint (Case 482)
0.66016.76
0.060 TYP 8X 1.52
0.100 TYP 8X 2.54
0.100 TYP 8X 2.54
0.3007.62
inch mm
SCALE 2:1
PACKAGE DIMENSIONS
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX4250A Sensors
PACKAGE DIMENSIONS
CASE 867-08
ISSUE N
UNIBODY PACKAGE
MPX4250A
Sensors
PACKAGE DIMENSIONS
MPX4250A Sensors
PACKAGE DIMENSIONS
MPX4250A
Sensors
NOTES
MPX4250A Sensors
MPX4250A Rev. 6
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? Freescale Semiconductor, Inc. 2006. All rights reserved.