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MPXA4250A中文资料

MPX4250A Rev 6, 12/2006

Freescale Semiconductor Technical Data

? Freescale Semiconductor, Inc., 2006. All rights reserved.

Integrated Silicon Pressure Sensor Manifold Absolute Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated

The MPX4250A/MPXA4250A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder.

The MPX4250A/MPXA4250A series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of

applications, particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining

techniques, thin-film metallization and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. The small form factor and high reliability of on-chip integration make the Freescale sensor a logical and economical choice for the automotive system engineer.Features ? 1.5% Maximum Error Over 0° to 85°C

?Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems

?Patented Silicon Shear Stress Strain Gauge

?Temperature Compensated Over -40° to +125°C

?Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules

?Durable Epoxy Unibody Element or Thermoplastic Small Outline, Surface Mount Package

?Ideal for Non-Automotive Applications

Typical Applications

?Turbo Boost Engine Control

?

Ideally Suited for Microprocessor or Microcontroller-Based Systems

ORDERING INFORMATION

Device Type

Options

Case No.

MPX Series Order Number

Packing Options

Device Marking

SMALL OUTLINE PACKAGE (1) (MPXA4250A SERIES)

1.The MPXA4250A series pressure sensors are available in the basic element package or with pressure port fitting. Two packing options are offered for each type. Basic Elements

Absolute, Element Only 482MPXA4250A6U Rails MPXA4250A 482MPXA4250A6T1Tape & Reel

MPXA4250A Ported Elements

Absolute, Axial Port 482A MPXA4250AC6U Rails MPXA4250A 482A

MPXA4250AC6T1

Tape & Reel

MPXA4250A

UNIBODY PACKAGE (2) (MPX4250A SERIES)

2.The MPX4250A series pressure sensors are available in the basic element package or with pressure port fittings providing mounting ease and barbed hose connections.

Basic Element

Absolute, Element Only 867MPX4250A —MPX4250A Ported Elements

Absolute, Ported 867B

MPX4250AP

MPX4250AP

MPX4250A MPXA4250A SERIES

INTEGRATED PRESSURE SENSOR

20 TO 250 kPA (2.9 TO 36.3 psi)

0.2 TO 4.9 V OUTPUT SMALL OUTLINE PACKAGE

PIN NUMBERS

1N/C (1), (2)

1.Pin 1 in noted by the notch in the lead.

2.Pins 1, 5, 6, and 7 are internal device connections. Do not connect to external circuitry or ground.

5(2)N/C 2V S 6(2)N/C 3GND 7(2)

N/C 4

V OUT

8

N/C

UNIBODY PACKAGE PIN NUMBERS

1V OUT (1)1.Pin 1 in noted by the notch in the lead.4N/C (2)2. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground.

2GND 5N/C (2)3

V S

6

N/C (2)

MPX4250A Sensors

Figure 1. Fully Integrated Pressure Sensor Schematic

Table 1. Maximum Ratings (1)

1. TC = 25°C unless otherwise noted.

Rating

Symbol Value Unit Maximum Pressure (2) (P1 > P2)2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

P MAX 1000kPa Storage Temperature T STG -40 to +125°C Operating Temperature

T A

-40 to +125

°C

Thin Film Temperature Compensation

and Gain Stage #1

V S

Sensing Element

V OUT

GND

Gain Stage #2

and Ground Reference Shift Circuitry

Pins 4, 5, and 6 are NO CONNECTS for unibody Device

Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device.

MPX4250A

Sensors

Table 2. Operating Characteristics (V S = 5.1 V DC , T A = 25°C unless otherwise noted, P1 > P2, Decoupling circuit shown in Figure 3 required to meet electrical specifications.)

Characteristic

Symbol Min Typ Max Units Differential Pressure Range (1)1. 1.0 kPa (kiloPascal) equals 0.145 psi.

P OP 20—250kPa Supply Voltage (2)2. Device is ratiometric within this specified excitation range.

V S 4.85 5.1 5.35V DC Supply Current

I O —7.010mAdc Minimum Pressure Offset (3)(0 to 85°C)

@ V S = 5.1 Volts 3. Offset (V OFF ) is defined as the output voltage at the minimum rated pressure.

V OFF

0.133

0.204

0.264

V DC

Full Scale Output (4)(0 to 85°C)

@ V S = 5.1 Volts 4. Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.

V FSO

4.826 4.896 4.966

V DC

Full Scale Span (5)(0 to 85°C)

@ V S = 5.1 Volts 5. Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. V FSS

— 4.692—

V DC

Accuracy (6)(0 to 85°C)

6. Accuracy (error budget) consists of the following:

?Linearity:

Output deviation at any temperature from a straight line relationship with pressure over the specified pressure range.

?Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to

and from the minimum or maximum operating temperature points, with zero differential pressure applied.

?Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the

minimum or maximum rated pressure, at 25°C.

?TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. ?TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.?Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.

———±1.5%V FSS Sensitivity ?V/?Ρ—20—mV/kPa Response Time (7)

7. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. t R — 1.0—msec Output Source Current at Full Scale Output I O +—0.1—mAdc Warm-Up Time (8)8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.——20—msec Offset Stability (9)

9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. —

±0.5

%V FSS

Table 3. Mechanical Characteristics

Characteristics

Typ Unit Weight, Basic Element (Case 867)

4.0Grams Weight, Small Outline Package (Case 482)

1.5

Grams

MPX4250A Sensors

Figure 2. Cross Sectional Diagram (Not to Scale) Figure 2 illustrates the absolute pressure sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.

The MPX4250A/MPXA4250A series pressure sensor operating characteristics and internal reliability and

qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability.

Figure 3. Recommended Power Supply Decoupling and

Output Filtering

(For additional output filtering, please refer to Application

Note AN1646.Contact the factory for information regarding media compatibility in your application.

Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller.

Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over temperature range of 0° to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.

Figure 4. Output vs. Absolute Pressure

FloroSilicone Die Coat

Wire Bond

RTV Die Bond

Die

P1

P2

Epoxy Case

Lead Frame

Sealed Vacuum Reference

Stainless Steel Metal Cover

1.0 μF 470 pF

Vs

+5 V

0.01 μF GND Vout

IPS

OUTPUT

O u t p u t (V o l t s )

5.04.54.03.53.0MAX

2.52.01.51.00.50

0102030405060708090100110120130140150160170180190200210220230240250260

MIN

TYP

Pressure (ref: to sealed vacuum) in kPa

Transfer Function:

V OUT = V s * (0.004 x P-0.04) ± Error V S = 5.1 Vdc

TEMP = 0 to 85°C

MPX4250A

Sensors

Transfer Function

Nominal Transfer Value: V OUT = V S (P × 0.004 - 0.04)

± (Pressure Error × Temp. Factor × 0.004 × V S )V S = 5.1 V ± 0.25 V DC

Temperature Error Band

Temp Multiplier - 4030 to 851+125

3

4.03.0

2.00.0

1.0-40

-20

20

40

60

140

120

100

80

Temperature Error Factor

Temperature in C°

NOTE: The Temperature Multiplier is a linear response from 0× to -40°C and from 85° to 125°C.

Pressure Error (Max)20 to 250 kPa ±3.45 (kPa)

Pressure (kPa)

751001251501752002252550250

4.03.02.01.00-1.0-2.0-3.0-4.0-

5.0

5.00Pressure Error (kPa)

Pressure Error Band

MPX4250A Sensors

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct

Footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.Figure 5. SOP Footprint (Case 482)

0.66016.76

0.060 TYP 8X 1.52

0.100 TYP 8X 2.54

0.100 TYP 8X 2.54

0.3007.62

inch mm

SCALE 2:1

PACKAGE DIMENSIONS

CASE 482-01

ISSUE O

SMALL OUTLINE PACKAGE

CASE 482A-01

ISSUE A

SMALL OUTLINE PACKAGE

MPX4250A Sensors

PACKAGE DIMENSIONS

CASE 867-08

ISSUE N

UNIBODY PACKAGE

MPX4250A

Sensors

PACKAGE DIMENSIONS

MPX4250A Sensors

PACKAGE DIMENSIONS

MPX4250A

Sensors

NOTES

MPX4250A Sensors

MPX4250A Rev. 6

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Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale? and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners.

? Freescale Semiconductor, Inc. 2006. All rights reserved.

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