FEATURES
CIRCUIT TECHNOLOGY
https://www.wendangku.net/doc/945538478.html,
s 2 – 512K x 8 SRAMs & 2 – 512K x 8 Flash Die in
One MCM
s Access Times of 25ns (SRAM) and 60ns (Flash) or 35ns (SRAM) and 70 or 90ns (Flash)s 512K x 16 SRAM s 512K x 16 5V Flash
s Organized as 512K x 16 of SRAM and 512K x 16 of Flash Memory with Separate Data Buses
s Both Blocks of Memory are User Configurable as 1M x 8
s Low Power CMOS
s Input and Output TTL Compatible Design s MIL-PRF-38534 Compliant MCMs Available
s Decoupling Capacitors and Multiple Grounds for Low Noise
s Industrial and Military Temperature Ranges s Industry Standard Pinouts
s Packaging – Hermetic Ceramic
q 66 Pin, 1.08" x 1.08" x .160" PGA Type, No Shoulder,
Aeroflex code# "P3"
q 66 Pin, 1.08" x 1.08" x .185" PGA Type, With Shoulder, Aeroflex code# "P7"
q 68 Lead, .94" x .94" x .140" Single-Cavity Small Outline Gull Wing, Aeroflex code# "F18" (Drops into the 68 Lead JEDEC .99"SQ CQFJ footprint)s DESC SMD Pending – 5962-96901
FLASH MEMORY FEATURES
s Sector Architecture (Each Die)
q 8 Equal Sectors of 64K bytes each
q Any combination of sectors can be erased with one
command sequence.
s +5V Programing, 5V ±10% Supply
s Embedded Erase and Program Algorithms s Hardware and Software Write Protection s Internal Program Control Time.s
10,000 Erase / Program Cycles
Pin Description
FI/O 0-15Flash Data I/O SI/O 0-15SRAM Data I/O A 0–18Address Inputs FWE 1-2Flash Write Enables SWE 1-2SRAM Write Enables
FCE 1-2Flash Chip Enables SCE 1-2SRAM Chip Enables OE Output Enable NC Not Connected V CC Power Supply GND
Ground
512Kx8
FCE 2
OE A 0 – A 18
SI/O 0-7
SI/O 8-15
FI/O 0-7
FI/O 8-15
88
88FCE 1FWE 2FWE 1SWE 2SWE 1SCE 1SCE 2Block Diagram – PGA Type Packages (P3 & P7) & CQFP (F18)
SRAM 512Kx8SRAM 512Kx8Flash 512Kx8Flash 512Kx16 SRAM/FLASH Multichip Module
ACT–SF512K16 High Speed
Note: Programming information available upon request
Absolute Maximum Ratings
Symbol Rating Range Units T C Operating Temperature-55 to +125°C T STG Storage Temperature-65 to +150°C V G Maximum Signal Voltage to Ground-0.5 to +7V T L Maximum Lead Temperature (10 seconds)300°C
Parameter
Flash Data Retention10 Y ears
Flash Endurance (Write/Erase Cycles)10,000
Normal Operating Conditions
Symbol Parameter Minimum Maximum Units
V CC Power Supply Voltage+4.5+5.5V
V IH Input High Voltage+2.2V CC + 0.3V
V IL Input Low Voltage-0.5+0.8V
Capacitance
(V IN = 0V, f = 1MHz, T C = 25°C)
Symbol Parameter Maximum Units
C A
D A0 – A18 Capacitance 50pF
C OE OE Capacitance50pF
C WE1,2F/S Write Enable Capacitance20pF
C CE1,2F/S Chip Enable Capacitance20pF
C I/O I/O0 – I/O15 Capacitance20pF These parameters are guaranteed by design but not tested
DC Characteristics
(V CC = 5.0V, V SS = 0V, Tc = -55°C to +125°C, unless otherwise indicated)
Parameter Sym Conditions Min Max Units Input Leakage Current I LI V CC = Max, V IN=0to V CC10μA
Output Leakage Current I LO FCE = SCE = V IH, OE = V IH,
V OUT=0to V CC
10μA
SRAM Operating Supply Current x 16 Mode I CC x16SCE = V IL, OE = V IH, f = 5MHz, V CC =
Max, FCE = V IH
260mA
Standby Current I SB FCE = SCE = V IH, OE = V IH, f = 5MHz,
V CC = Max
35mA
SRAM Output Low Voltage V OL I OL = 8 mA, V CC = Min, FCE = V IH0.4V SRAM Output High Voltage V OH I OH = -4.0 mA, , V CC = Min, FCE = V IH 2.4V Flash Vcc Active Current for Read (1)I CC1FCE = V IL, OE = V IH, SCE = V IH130mA
Flash Vcc Active Current for Program or Erase (2)I CC2FCE = V
IL
, OE = V IH, SCE = V IH150mA
Flash Output Low Voltage V OL I OL = 8 mA, V CC = Min, SCE = V IH0.45V Flash Output High Voltage V OH I OH = -2.5 mA, , V CC = Min, SCE = V IH0.85 x V CC V Flash Low Vcc Lock Out Voltage V LKO 3.2 4.2V Notes: 1) The I CC current listed includes both the DC operating current and the frequency dependent component (at 5MHz). The frequency component typically is less than 2mA/MHz, with OE at V IH 2) I CC active while Embedded Algorithim (program or erase) is in progress 3) DC test conditions: V IL = 0.3V, V IH = V CC - 0.3V
SRAM AC Characteristics
(V CC = 5.0V, V SS= 0V, Tc= -55°C to +125°C) Read Cycle
Parameter Symbol
–025
Min Max
–035
Min Max
Units
Read Cycle Time t RC2535ns Address Access Time t AA2535ns Chip Select Access Time t ACE2535ns Output Hold from Address Change t OH00ns Output Enable to Output Valid t OE1225ns Chip Select to Output in Low Z * t CLZ24ns Output Enable to Output in Low Z * t OLZ00ns Chip Deselect to Output in High Z * t CHZ1215ns Output Disable to Output in High Z * t OHZ1215ns * Parameters guaranteed by design but not tested
Write Cycle
Parameter Symbol
–025
Min Max
–035
Min Max
Units
Write Cycle Time t WC2535ns Chip Select to End of Write t CW1725ns Address Valid to End of Write t AW1725ns Data Valid to End of Write t DW1320ns Write Pulse Width t WP1725ns Address Setup Time t AS22ns Output Active from End of Write * t OW44ns Write to Output in High Z * t WHZ1315ns Data Hold from Write Time t DH00ns Address Hold Time t AH00ns * Parameters guaranteed by design but not tested
Truth Table
Mode SCE OE SWE Data I/O Power Standby H X X High Z Standby Read L L H Data Out Active Output Disable L H H High Z Active Write L X L Data In Active
Flash AC Characteristics – Read Only Operations (Vcc = 5.0V, Vss = 0V, Tc = -55°C to +125°C)
Parameter
Symbol
JEDEC Stand’d
–60
Min Max
–70
Min Max
–90
Min Max
Units
Read Cycle Time t AVAV t RC607090ns Address Access Time t AVQV t ACC607090ns Chip Enable Access Time t ELQV t CE607090ns Output Enable to Output Valid t GLQV t OE303535ns Chip Enable to Output High Z (1)t EHQZ t DF202020ns Output Enable High to Output High Z(1)t GHQZ t DF202020ns Output Hold from Address, CE or OE Change, Whichever is First t AXQX t OH000ns Note 1. Guaranteed by design, but not tested
Flash AC Characteristics – Write / Erase / Program Operations, FWE Controlled
(Vcc = 5.0V, Vss = 0V, Tc = -55°C to +125°C)
Parameter
Symbol
JEDEC Stand’d
–60
Min Max
–70
Min Max
–90
Min Max
Units
Write Cycle Time t AVAC t WC607090ns Chip Enable Setup Time t ELWL t CE000ns Write Enable Pulse Width t WLWH t WP404545ns Address Setup Time t AVWL t AS000ns Data Setup Time t DVWH t DS404545ns Data Hold Time t WHDX t DH000ns Address Hold Time t WLAX t AH454545ns Write Enable Pulse Width High t WHWL t WPH202020ns Duration of Byte Programming Operation t WHWH114TYP14TYP14TYPμs Sector Erase Time t WHWH2303030Sec Read Recovery Time before Write t GHWL000μs Vcc Setup Time t VCE505050μs Chip Programming Time505050Sec Chip Enable Hold Time t OEH1101010ns Chip Erase Time t WHWH3120120120Sec 1. Toggle and Data Polling only.
Flash AC Characteristics – Write / Erase / Program Operations, FCE Controlled
(Vcc = 5.0V, Vss = 0V, Tc = -55°C to +125°C)
Parameter
Symbol
JEDEC Stand’d
–60
Min Max
–70
Min Max
–90
Min Max
Units
Write Cycle Time t AVAC t WC607090ns Write Enable Setup Time t WLE L t WS000ns Chip Enable Pulse Width t ELEH t CP404545ns Address Setup Time t AVEL t AS000ns Data Setup Time t DVEH t DS404545ns Data Hold Time t EHDX t DH000ns Address Hold Time t ELAX t AH454545ns Chip Enable Pulse Width High t EHEL t CPH202020ns Duration of Byte Programming t WHWH114TYP14TYP14TYPμs Sector Erase Time t WHWH2303030Sec Read Recovery Time t GHEL000ns Chip Programming Time505050Sec Chip Erase Time t WHWH3120120120Sec
FWE
OE
FCE
Data
Addresses
5.0V
5555H PA
Data Polling
PA
D7
D OUT
PD
AOH
t WHWH 1
t AH
t AS
t DH
t CPH
t CP
t DS
t WS
t WC
t GHWL
Notes:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7 is the 0utput of the complement of the data written to the device.
4. D OUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
Write/Erase/Program Operation for Flash Memory, FCE Controlled
Pin Numbers & Functions
66 Pins — PGA-Type
Pin #Function Pin #Function Pin #Function Pin #Function 1SI/O 818A 1235FI/O 952FWE 12SI/O 919Vcc 36FI/O 1053FCE 13SI/O 1020SCE 137A 654GND 4A 1321NC 38A 755FI/O 35A 1422SI/O 339NC 56FI/O 156A 1523SI/O 1540A 857FI/O 147A 1624SI/O 1441A 958FI/O 138A 1825SI/O 1342FI/O 059FI/O 129SI/O 026SI/O 1243FI/O 160A 010SI/O 127OE 44FI/O 261A 111SI/O 228A 1745V CC 62A 212SWE 229SWE 146FCE 263FI/O 713SCE 230SI/O 747FWE 264FI/O 614GND 31SI/O 648FI/O 1165FI/O 515SI/O 1132SI/O 549A 366
FI/O 4
16A 1033SI/O 450A 417
A 11
34
FI/O 8
51
A 5
All dimensions in inches
1.085 SQ 1.000.600
1.000
.100
.020.016
.100
.180TYP 1.0301.040
.160Pin 56
Pin 66
Pin 11
Pin 1
Bottom View (P7 & P3)
MAX MAX
"P3" — 1.08" SQ PGA Type (without shoulder) Package "P7" — 1.08" SQ PGA Type (with shoulder) Package
1.0301.040
.020.016
.100
.025.185MAX Side View
(P7)
Side View
(P3)
.050
.180TYP
.035
Ordering Information
Model Number DESC SMD Number Speed Package ACT–SF512K16N–26P3Q5462-96901 (Pending)25(S) / 60(F) ns 1.08"sq PGA-Type ACT–SF512K16N–37P3Q5462-96901 (Pending)35(S) / 70(F) ns 1.08"sq PGA-Type ACT–SF512K16N–39P3Q5462-96901 (Pending)35(S) / 90(F) ns 1.08"sq PGA-Type ACT–SF512K16N–26P7Q5462-96901 (Pending)25(S) / 60(F) ns 1.08"sq PGA-Type ACT–SF512K16N–37P7Q5462-96901 (Pending)35(S) / 70(F) ns 1.08"sq PGA-Type ACT–SF512K16N–39P7Q5462-96901 (Pending)35(S) / 90(F) ns 1.08"sq PGA-Type ACT–SF512K16N–26F18Q5462-96901 (Pending)25(S) / 60(F) ns.94"sq CQFP ACT–SF512K16N–37F18Q5462-96901 (Pending)35(S) / 70(F) ns.94"sq CQFP ACT–SF512K16N–39F18Q5462-96901 (Pending)35(S) / 90(F) ns.94"sq CQFP Note: (S) = Speed for SRAM, (F) = Speed for FLASH
Part Number Breakdown
ACT–S F512K16 N–26P7Q
Aeroflex Circuit
Technology
Memory Type
S (SRAM) & F (FLASH) Combo
Memory Depth
Memory Width, Bits Memory Speed Code
Package Type & Size
C = Commercial Temp, 0°C to +70°C
I = Industrial Temp, -40°C to +85°C
T = Military Temp, -55°C to +125°C
M = Military Temp, -55°C to +125°C, Screening *
Q = MIL-PRF-38534 Compliant / SMD
Screening
*Screened to the individual test methods of MIL-STD-883 Surface Mount Packages Thru-Hole Packages
F18 = .94"SQ 68 Lead Dual-Cavity
CQFP
P3 = 1.085"SQ PGA 66 Pins
with out shoulder
P7 = 1.085"SQ PGA 66 Pins
with shoulder
26 = 25ns SRAM & 60ns FLASH
37 = 35ns SRAM & 70ns FLASH
39 = 35ns SRAM & 90ns FLASH Options, N = none
Aeroflex Circuit Technology
35 South Service Road
Plainview New York 11830
Telephone: (516) 694-6700
FAX: (516) 694-6715 Toll Free Inquiries: 1-(800) 843-1553
C I R C U I T T E C H N O L O G Y
Specifications subject to change without notice.