2N7002LT1G中文资料

2N7002L

Small Signal MOSFET

60 V, 115 mA, N?Channel SOT?23

Features

?Pb?Free Packages are Available

MAXIMUM RATINGS

Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.

THERMAL CHARACTERISTICS

current.

2.Pulse Test: Pulse Width ≤ 300 m s, Duty Cycle ≤ 2.0%.

3.FR?5 = 1.0 x 0.75 x 0.062 in.

4.Alumina = 0.4 x 0.3 x 0.025 in 99.5% alumina.

Device Package Shipping?

ORDERING INFORMATION

2N7002LT1

SOT?23

3000 Tape & Reel 2N7002LT310,000 Tape & Reel

https://www.wendangku.net/doc/9a13675544.html,

2N7002LT1G

SOT?23

(Pb?free)

3000 Tape & Reel 2N7002LT3G10,000 Tape & Reel ?For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D.

ELECTRICAL CHARACTERISTICS(T A = 25°C unless otherwise noted)

OFF CHARACTERISTICS

ON CHARACTERISTICS (Note 5)

DYNAMIC CHARACTERISTICS

SWITCHING CHARACTERISTICS (Note 5)

BODY?DRAIN DIODE RATINGS

5.Pulse Test: Pulse Width ≤ 300 m s, Duty Cycle ≤ 2.0%.

TYPICAL ELECTRICAL CHARACTERISTICS

I D , D R A I N C U R R E N T (A M P S )

r D S (o n ), S T A T I C D R A I N ?S O U R C E O N ?R E S I S T A N C E (N O R M A L I Z E D )

V G S (t h ), T H R E S H O L D V O L T A G E (N O R M A L I Z E D )

I D , D R A I N C U R R E N T (A M P S )

V

DS , DRAIN SOURCE VOLTAGE (VOLTS)

Figure 1. Ohmic Region

V GS , GATE SOURCE VOLTAGE (VOLTS)

Figure 2. Transfer Characteristics

? T, TEMPERATURE (°C)

Figure 3. Temperature versus Static Drain?Source On?Resistance T, TEMPERATURE (°C)

Figure 4. Temperature versus Gate

Threshold Voltage

PACKAGE DIMENSIONS

SOT?23 (TO?236)CASE 318?08ISSUE AH

NOTES:

1.DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2.CONTROLLING DIMENSION: INCH.

3.MAXIMUM LEAD THICKNESS INCLUDES LEAD

STYLE 21:

PIN 1.GATE

2.SOURCE

3.DRAIN

*For additional information on our Pb?Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION