P P r r o o d d u u c c t t //产产品品:: 44001144贴贴片片白白光光 P P a a r r t t N N u u m m b b e e r r //型型号号:: Z Z H H --T T 44001144W W --112200B B --R R 7700 C C u u s s t t o o m m e e r r //客客户户:: // I I s s s s u u e e D D a a t t e e //发发行行日日期期:: 22001111--1100--0077
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周晓辉
广州众恒光电LED 封装事业部使命:
协助LED 照明厂商让全球都能用上真正节能、
●Dimensional drawing/尺寸图
0.63
4.003.70
1.25
1.444.0
1.27
0.50
0.75
All dimensions are in millimeter/图中所有尺寸均以毫米为单位
Tolerance is ±0.25mm(0.10″)unless otherwise noted/若无特别标注,图中尺寸公差为±0.25mm
●Shape Specification /外观要求
●Opto-Electronical Characteristics /光电特性
Forward Current vs.Forward Voltage Maximum Forward Current vs. Ambient Temperature
伏安特性 环境温度与电流的关系
No. 序号
ITEM 项目 SPEC OR DESCRIPTION 规格要求描述
1
Lens 胶体
◆ No change color/不可有胶体变色 ◆ No Disrepair/不可有破损
◆ Scratch/划伤(lengt h ≤2.0mm,Width ≤0.25mm )
◆ macula/黑点、异物(≤0.25mm and ≤2EA in Encapsulation reverse ) ◆ bubble/气泡(≤0.3mm and ≤2EA Encapsulation reverse ) 2 PIN PIN 脚 ◆ No bottom crook/PIN 尖不可有弯脚 ◆ No oxidation/不可有氧化
◆ No electropolar reverse/不可有切反(极性反) 3 Configuration 结构
◆ No Encapsulation reverse/不可封反 ◆ No PIN loosen/PIN 脚不可松动
4 surface preparation
表面处理 ◆ Cut needn’t electroplate /切口处无需作电镀
5
Lens color 胶体颜色
◆ Yellow 黄色
()
()
()
Lighting Angle / 发光角度
●Absolute maximum ratings/最大绝对额定值
●Opto-Electronical Specification/光电参数规格
Parameter 参数
Symbol 符号 Value 数值 Unit 单位 Forward Current 正向电流
If 60 mA Reverse Voltage 反向电压
Vr 5 V Operating Temperature 工作温度
Topr -25~+85 ℃ Storage Temperature 储存温度
Tstg -35~+85 ℃ Soldering temperature 焊接温度
Tsol 260±5℃(for4sec )
℃ Power Dissipation 功率消耗 Pd
200 mW Pulse Current 脉冲电流
I FP
100
mA
Parameter 参数
Symbol 符号 Min 最小值 Typ 平均值 Max 最大值 Unit 单位 Tolerance 误差值 Test Conditinos 测试条件 Forward Voltage 正向电压
Vf 2.80 -- 3.60 V ± 0.05V IF/正向电流=60mA
Test Temperature 测试温度=25℃
Luminous Intensity 发光强度
IV 5000 -- 6500 mcd ± 60 mcd Color Temperature 色温
TC 5500 -- 7000 k ±100k Chromatic current 光谱坐标
X 0.30 -- 0.34 / ±0.005 Y 0.31 -- 0.35 / ±0.005 Luminous Flux 光通量
Φ
18 20 22 Lm ±0.1 Lm Lighting Angle 发光角度
θ
120 130 140 deg ±2 Color Rendering Index 显色指数
CRI 70 -- -- / ±2 Reverse Current 反向电流
IR
--
--
5
μA
±0.1μA
Vr=5V
0.20.40.6 1.0
0.80.2
0.40.60.81.00°
10°
20°
30°
40°
50°
60°
70°80°
-10°
-20°-30°
-40°
-50°-60°-70°-80°
●Opto-Electronical Grading Specification /光电分级规格
●Reliability Test Items/可靠度测试项目
●Judgment Criteria/判定标准:
Item
项目
Symbol Test Conditions Judgment Criteria
Forward Voltage
正向电压
Vf I F = 60 mA Δ% < 10 %
Leakage Current
反向漏电流
Ir Vr = 5V < 10 uA
Luminous Intensity
发光强度
Iv I F = 60 mA Δ% <20 %
Luminous Flux 光通量lm I F = 60 mA Δ%<20 %
Forward Voltage 正向电压Luminous Intensity
发光强度
Color Temperature
色温
Chromatic current
光谱坐标Test Conditinos
测试条件
X Y
2.8-
3.0 v
3.0-3.2 v 3.2-3.4 v 3.4-3.6 v / 5500-6000K
6000-6500K
6500-7000K
/ /
IF/正向电流=60mA
Test Temperature
测试温度=25℃
No.
Item
测度项目
Condition
测试条件
Time/Cycle
测试时间或周期
Number of Damaged
不良数/测试数
1. Soldering Heat Test
焊接试验
260±5 o C 10 sec 0/60
2 Thermal Shock
热冲击
0 o C (15sec) ~ 100 oC(15sec) 20 cycle 0/60
3 High Temp. Storage
高温储存
100 o C 1000Hrs 0/60
4 Low Temp. Storage
低温储存
-40 o C 1000Hrs 0/60
5 Temperature Cycle Test
高低温循环
-40 o C ~ 80 o C 100 Cycles, 200 Hrs 0/60
6 High Temp. High Humidity Test
高温高湿
60 o C, 90 % RH 1000 Hrs 0/60
7 Operation Life Test 1
常温老化
Room Temp., 20mA 1000 Hrs 0/60
8 Operation Life Test 2
常温老化
Room Temp., 30mA 500 Hrs 0/60
9 High Temp. Operation Life Test
高温老化
85 o C , 5mA 1000 Hrs 0/60
10 Low Temp. Operation Life Test
低温老化
-30 o C , 20mA 1000 Hrs 0/60
● Packaging Specifications/包装规格
Φ4.
Φ
17
8
2.2
Φ60
Φ13.3
屏蔽袋
标签
包装卷带
覆盖膜
使用方向
13.0
15.0
●Lead Solder/含铅焊锡
● Lead-Free Solder/无铅焊锡
●Caution/注意事项
1、 After open the package, the LED should be kept at 25o C, 65 % RH environment or less.
打开包装后请在温度25±3 o C湿度65±5%的环境下使用。
2、When hand soldering, keep the temperature of the iron under 300℃, and at that temperature keep the time under 3 sec.
洛铁焊接时,温度在300℃以下焊接时间不得大于3秒。
3、The LED should be soldered within 48 hours ( 2 days ) after opening the package.
打开包装后请在48小时内作焊接.
4、The LAMP LED is an ESD sensitive device. All the equipment and machine must be properly grounded.
LED是静电敏感器件,使用时所有设备、机构都需有适当的接地导电措施。
5、when make use of it,please use static-free container,operator showld ware antistatic clothes and rope-satic-ring
also should make effective ground.
使用时请使用防静电的盛装容器,作业人员应穿着防静电服装及佩戴有绳之静电环并作有效接地。
6、Damaged device will appear some symptoms,lower forward voltage,higher leak current,or even short curcuit
受静电与突波破坏之LED的电性特性上,会有明显的漏电流,或驱动电压明显变低,甚至是短路现象。
7、After soldering the LED should keep out off any shake or outer force before it come to normal tempreture
在焊接温度回到正常以前,必须避免使LED受到任何震动或外力。
8、LED is one-way continuity, please check electrode before mount, if amount wrong ,the LED chip will damage or fail when
LED applied voltage
单向导通性,安装前确认极性,若装反,在施加电压时容易造成LED芯片损伤或失效。
9、please design the PCB board to keep a distance between LED and other emit heat component
线路设计时,请不要将LED与发热组件靠得过近。
10、strongly recommend design the board according setting current other than setting voltage .if you are really need setting voltage type please consider
there may cause influence arise by difference voltage of difference LED
电路设计上,建议以定电流设计,若为定电压设计,请考虑LED之间不同正向电压所可能造成之影响。
11、the outer voltage change will bring the current index change .unsuitable design and current control,easy cause LED fail .for example excess current
will cause LED life short or even burn down , too little electricity will cause lacking light
LED之外加电压变化,会造成电流指数级变化,不当之设计与电流控制,易造成LED失效,如电流过大引起寿命问题甚至烧毁,电流过小引起亮度不足。
12、If you need make difference BIN LED in the one module .please confirm whether it can meet the electric and optics characteristic require such as the
current balance, emitting and brightness consistency.
不同BIN号之LED需安装在同一个组件时,请先确认是否可满足相关电气及光学之特性要求,如电流是否均衡,光色、亮度的一致性等。
13、The encapsulated material of the LEDs is silicone . Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will
be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part.
LED密封的材料为硅胶,因此这LED顶部是柔软的,顶部表面受压力会直接影响发光二极管的可靠性,所以要采取防范措施避免让封装部门承受较大的压力。
14、Welding repair cannot directly LED by hand or contact colloid top person. Homework way below image.
焊接返修LED时不能直接用手或硬物接触胶体顶部,作业方式如下图。