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27C256-15中文资料

SYMBOL PIN NAME A0~A14Address Input Q0~Q7Data Input/Output

CE Chip Enable Input OE Output Enable Input VPP Program Supply Voltage NC No Internal Connection VCC Power Supply Pin (+5V)GND

Ground Pin

GENERAL DESCRIPTION

The MX27C256 is a 5V only, 256K-bit, One-Time Programmable Read Only Memory. It is organized as 32K by 8 bits, operates from a single + 5volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming from outside the system, existing EPROM programmers

FEATURES

? 32K x 8 organization ? Single +5V power supply ? +12.5V programming voltage

? Fast access time: 45/55/70/90/100/120/150 ns ? Totally static operation

? Completely TTL compatible

? Operating current: 30mA ? Standby current: 100uA ? Package type:

- 28 pin plastic DIP - 32 pin PLCC

- 28 pin 8 x 13.4mm TSOP(I )

PIN CONFIGURATIONS

PDIP

may be used. The MX27C256 supports intelligent fast programming algorithm which can result in program-ming time of less than ten seconds.

This EPROM is packaged in industry standard 28 pin dual-in-line packages, 32 lead PLCC, and 28 lead TSOP (I ) packages.

BLOCK DIAGRAM

PIN DESCRIPTION

PLCC

8 x 13.4mm 28-TSOP(I )

MX27C256

256K-BIT [32K x 8] CMOS EPROM 145

13141720212529

30A8A9A11NC

OE A10CE Q7

A6A5A4A3A2A1A0NC Q0

Q 1

Q 2

G N D

N C

Q 3

Q 4

Q 5

A 7

A 12

V P P

N C

V C C

A 14

A 13

MX27C256

1234567891011121314

VPP A12A7A6A5A4A3A2A1A0Q0Q1Q2GND

2827262524232221201918171615

VCC A14A13A8A9A11OE A10CE Q7Q6Q5Q4Q3

M X 27C 256

OE A11A9A8A13A14VCC VPP A12A7A6A5A4A3

222324252627281234567

A10Q7Q6Q5Q4Q3GND Q2Q1Q0A0A1A2

21201918171615141312111098

MX27C256

VCC GND

VPP

MX27C256

AUTO IDENTIFY MODE

The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the MX27C256.

To activate this mode, the programming equipment must force 12.0 ± 0.5 (VH) on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode.

Byte 0 ( A0 = VIL) represents the manufacturer code,and byte 1 (A0 = VIH), the device identifier code. For the MX27C256, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q7)defined as the parity bit.

READ MODE

The MX27C256 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection.Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE).Data is available at the outputs tOE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tOE.

STANDBY MODE

The MX27C256 has a CMOS standby mode which reduces the maximum Vcc current to 100 uA. It is placed in CMOS standby when CE is at VCC ± 0.3 V.The MX27C256 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input.

FUNCTIONAL DESCRIPTION

THE PROGRAMMING OF THE MX27C256

When the MX27C256 is delivered, or it is erased, the chip has all 256K bits in the "ONE" or HIGH state."ZEROs" are loaded into the MX27C256 through the procedure of programming.

For programming, the data to be programmed is applied with 8 bits in parallel to the data pins.

VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP. When programming an MXIC EPROM, a 0.1uF capacitor is required across VPP and ground to suppress spurious voltage transients which may damage the device.

FAST PROGRAMMING

The device is set up in the fast programming mode when the programming voltage VPP = 12.75V is applied, with VCC = 6.25 V and OE = VIH (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the CE input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = VPP = 5V ± 10%.

PROGRAM INHIBIT MODE

Programming of multiple MX27C256s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27C256 may be common. A TTL low-level program pulse applied to an MX27C256CE input with VPP = 12.5 ± 0.5 V and OE HIGH will program that MX27C256. A high-level CE input inhibits the other MX27C256s from being programmed.

PROGRAM VERIFY MODE

Verification should be performed on the programmed bits to determine that they were correctly programmed.The verification should be performed with CE and OE at VIL, and VPP at its programming voltage.

MX27C256

TWO-LINE OUTPUT CONTROL FUNCTION

To accommodate multiple memory connections, a two-line control function is provided to allow for:

1. Low memory power dissipation,

2. Assurance that output bus contention will not

occur.

It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device.SYSTEM CONSIDERATIONS

During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between VCC and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between Vcc and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array.

MODE SELECT TABLE

PINS

MODE CE OE A0A9VPP OUTPUTS Read VIL VIL X X VCC DOUT Output Disable VIL VIH X X VCC High Z Standby (TTL)VIH X X X VCC High Z Standby (CMOS)VCC±0.3V X X X VCC High Z Program VIL VIH X X VPP DIN Program Verify VIH VIL X X VPP DOUT Program Inhibit VIH VIH X X VPP High Z Manufacturer Code(3)VIL VIL VIL VH VCC C2H Device Code(3)VIL VIL VIH VH VCC10H

NOTES:

1.VH = 1

2.0 V ± 0.5 V

2.X = Either VIH or VIL

3.A1 - A8 = A10 - A14 = VIL (For auto select)

4.See DC Programming characteristics for VPP voltage during programming.

MX27C256

ABSOLUTE MAXIMUM RATINGS

RATING

VALUE Ambient Operating Temperature -40o C to 85o C Storage Temperature -65o C to 125o C Applied Input Voltage -0.5V to 7.0V Applied Output Voltage -0.5V to VCC + 0.5V VCC to Ground Potential -0.5V to 7.0V A9 & Vpp

-0.5V to 13.5V

NOTICE:

Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability.

NOTICE:

Specifications contained within the following tables are sub-ject to change.

DC CHARACTERISTICS

SYMBOL PARAMETER MIN.MAX.

UNIT CONDITIONS VOH Output High Voltage 2.4

V IOH = -0.4mA VOL Output Low Voltage 0.4V IOL = 2.1mA

VIH Input High Voltage 2.0VCC + 0.5

V VIL Input Low Voltage -0.30.8V ILI Input Leakage Current -1010uA VIN = 0 to 5.5V ILO Output Leakage Current -1010uA VOUT = 0 to 5.5V ICC3VCC Power-Down Current 100uA CE = VCC ± 0.3V ICC2VCC Standby Current 1.5mA CE = VIH

ICC1VCC Active Current 30mA CE = VIL, f=5MHz, Iout =0mA IPP

VPP Supply Current Read

10uA

CE = OE = VIL, VPP = 5.5V CAPACITANCE TA = 25o C, f = 1.0 MHz (Sampled only)

SYMBOL PARAMETER MIN.MAX.UNIT CONDITIONS CIN Input Capacitance 812pF VIN = 0V COUT Output Capacitance 812pF VOUT = 0V VPP

VPP Capacitance

VPP = 0V

DC/AC Operating Conditions for Read Operation

MX27C256

-45

-55-70-90-10-12-15Operating Commercial 0°C to 70°C 0°C to 70°C

0°C to 70°C

Temperature

Industrial

-45°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C Vcc Power Supply

5V ± 10%

5V ±10%

5V ± 10%

MX27C256

AC CHARACTERISTICS

27C256-4527C256-55 27C256-70 27C256-90 SYMBOL PARAMETER MIN.MAX.MIN.MAX.MIN.MAX.MIN.MAX.UNIT CONDITIONS tACC Address to Output Delay45557090ns CE = OE = VIL tCE Chip Enable to Output Delay45557090ns OE = VIL tOE Output Enable to Output22303540ns CE = VIL Delay

tDF OE High to Output Float,016020020025ns

or CE High to Output Float

tOH Output Hold from Address,0000ns

CE or OE which ever occurred

first

27C256-10 27C256-12 27C256-15

SYMBOL PARAMETER MIN.MAX.MIN.MAX.MIN.MAX.UNIT CONDITIONS tACC Address to Output Delay100120150ns CE = OE = VIL tCE Chip Enable to Output Delay100120150ns OE = VIL

tOE Output Enable to Output455055ns CE = VIL Delay

tDF OE High to Output Float,030035050ns

or CE High to Output Float

tOH Output Hold from Address,000ns

CE or OE which ever occurred

first

DC PROGRAMMING CHARACTERISTICS TA = 25o C ± 5°C

SYMBOL PARAMETER MIN.MAX.UNIT CONDITIONS VOH Output High Voltage 2.4V IOH = -0.40mA VOL Output Low Voltage0.4V IOL = 2.1mA

VIH Input High Voltage 2.0VCC + 0.5V

VIL Input Low Voltage-0.30.8V

ILI Input Leakage Current-1010uA VIN = 0 to 5.5V VH A9 Auto Select Voltage11.512.5V

ICC3VCC Supply Current(Program & Verify)40mA

IPP2VPP Supply Current(Program)30mA CE = VIL, OE = VIH VCC1Fast Programming Supply Voltage 6.00 6.50V

VPP1Fast Programming Voltage12.513.0V

MX27C256

AC PROGRAMMING CHARACTERISTICS TA = 25o C ± 5°C

SYMBOL PARAMETER MIN.MAX.UNIT CONDITIONS tAS Address Setup Time 2.0us

tOES OE Setup Time 2.0us

tDS Data Setup Time 2.0us

tAH Address Hold Time0us

tDH Data Hold Time 2.0us

tDFP Output Enable to Output Float Delay0130ns

tVPS VPP Setup Time 2.0us

tVCS VCC Setup Time 2.0us

tOE Data Valid from OE150ns

tPW PGM Program Pulse Width95105us

MX27C256

ORDERING INFORMATION

PLASTIC PACKAGE

PART NO.ACCESS TIME(ns)OPERATING STANDBY OPERATING PACKAGE

CURRENT MAX.(mA)CURRENT MAX.(uA)TEMPERATURE MX27C256PC-4545301000°C to 70°C28 Pin DIP MX27C256QC-4545301000°C to 70°C32 Pin PLCC MX27C256TC-4545301000°C to 70°C28 Pin TSOP(I) MX27C256PC-5555301000°C to 70°C28 Pin DIP MX27C256QC-5555301000°C to 70°C32 Pin PLCC MX27C256TC-5555301000°C to 70°C28 Pin TSOP(I) MX27C256PC-7070301000°C to 70°C28 Pin DIP MX27C256QC-7070301000°C to 70°C32 Pin PLCC MX27C256TC-7070301000°C to 70°C28 Pin TSOP(I) MX27C256PC-9090301000°C to 70°C28 Pin DIP MX27C256QC-9090301000°C to 70°C32 Pin PLCC MX27C256TC-9090301000°C to 70°C28 Pin TSOP(I) MX27C256PC-10100301000°C to 70°C28 Pin DIP MX27C256QC-10100301000°C to 70°C32 Pin PLCC MX27C256TC-10100301000°C to 70°C28 Pin TSOP(I) MX27C256PC-12120301000°C to 70°C28 Pin DIP MX27C256QC-12120301000°C to 70°C32 Pin PLCC MX27C256TC-12120301000°C to 70°C28 Pin TSOP(I) MX27C256PC-151********°C to 70°C28 Pin DIP MX27C256QC-151********°C to 70°C32 Pin PLCC MX27C256TC-151********°C to 70°C28 Pin TSOP(I) MX27C256PI-454530100-40°C to 85°C28 Pin DIP MX27C256QI-454530100-40°C to 85°C32 Pin PLCC MX27C256TI-454530100-40°C to 85°C28 Pin TSOP(I) MX27C256PI-555530100-40°C to 85°C28 Pin DIP MX27C256QI-555530100-40°C to 85°C32 Pin PLCC MX27C256TI-555530100-40°C to 85°C28 Pin TSOP(I) MX27C256PI-707030100-40°C to 85°C28 Pin DIP MX27C256QI-707030100-40°C to 85°C32 Pin PLCC MX27C256TI-707030100-40°C to 85°C28 Pin TSOP(I) MX27C256PI-909030100-40°C to 85°C28 Pin DIP MX27C256QI-909030100-40°C to 85°C32 Pin PLCC MX27C256TI-909030100-40°C to 85°C28 Pin TSOP(I) MX27C256PI-1010030100-40°C to 85°C28 Pin DIP MX27C256QI-1010030100-40°C to 85°C32 Pin PLCC MX27C256TI-1010030100-40°C to 85°C28 Pin TSOP(I) MX27C256PI-1212030100-40°C to 85°C28 Pin DIP MX27C256QI-1212030100-40°C to 85°C32 Pin PLCC MX27C256TI-1212030100-40°C to 85°C28 Pin TSOP(I) MX27C256PI-1515030100-40°C to 85°C28 Pin DIP MX27C256QI-1515030100-40°C to 85°C32 Pin PLCC MX27C256TI-1515030100-40°C to 85°C28 Pin TSOP(I)

MX27C256

REVISION HISTORY

Revision No.Description Page Date

5.01) Reduce operating current from 40mA to 30mA.6/16/1997

2) Add 28-TSOP(I) and 28-SOP packages offering.

3) Eliminate Interactive Programming Mode.

5.11) IPP1 100uA ----> 10uA7/17/1997 5.2Cancel ceramic DIP package type P1,2,10,12FEB/25/2000 5.3Remove 28-pin SOP Package P1,10SEP/19/2001

Package Information format changed P11~13

5.4Remove "ultraviolet erasable" wording P1APR/24/2002 5.5To modify Package Information P11~13NOV/19/2002 5.6To modify 32-PLCC package information P12AUG/26/2003

A1: from 0.50mm(0.020 inch)/nom. to 0.58mm(0.023 inch)/nom.

from 0.66mm(0.026 inch)/nom. to 0.81mm(0.032 inch)/nom.

MX27C256 M ACRONIX I NTERNATIONAL C O., L TD.

HEADQUARTERS:

TEL:+886-3-578-6688

FAX:+886-3-563-2888

EUROPE OFFICE:

TEL:+32-2-456-8020

FAX:+32-2-456-8021

JAPAN OFFICE:

TEL:+81-44-246-9100

FAX:+81-44-246-9105

SINGAPORE OFFICE:

TEL:+65-348-8385

FAX:+65-348-8096

TAIPEI OFFICE:

TEL:+886-2-2509-3300

FAX:+886-2-2509-2200

M ACRONIX A MERICA, I NC.

TEL:+1-408-453-8088

FAX:+1-408-453-8488

CHICAGO OFFICE:

TEL:+1-847-963-1900

FAX:+1-847-963-1909

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