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OPA356AIDBVTG4中文资料

SBOS212A – NOVEMBER, 2001

DESCRIPTION

The OPAx356 series high-speed, voltage-feedback CMOS operational amplifiers are designed for video and other applications requiring wide bandwidth. The OPAx356 is unity gain stable and can drive large output currents. Differential gain is 0.02% and differential phase is 0.05°. Quiescent current is only 8.3mA per channel.

OPAx356 is optimized for operation on single or dual sup-plies as low as 2.5V (±1.25V) and up to 5.5V (±2.75V).Common-mode input range for the OPAx356 extends 100mV below ground and up to 1.5V from V+. The output swing is within 100mV of the rails, supporting wide dynamic range.The OPAx356 series is available in single (SOT23-5 and SO-8),and dual (MSOP-8 and SO-8) versions. Multichannel versions feature completely independent circuitry for lowest crosstalk and freedom from interaction. All are specified over the extended –40°C to +125°C range.

FEATURES

q UNITY-GAIN BANDWIDTH: 450MHz q WIDE BANDWIDTH: 200MHz GBW q HIGH SLEW RATE: 360V/μs q LOW NOISE: 5.8nV/H z

q EXCELLENT VIDEO PERFORMANCE:DIFF GAIN: 0.02%, DIFF PHASE: 0.05°0.1dB GAIN FLATNESS: 75MHz q INPUT RANGE INCLUDES GROUND q RAIL-TO-RAIL OUTPUT (within 100mV)q LOW INPUT BIAS CURRENT: 3pA q THERMAL SHUTDOWN

q SINGLE-SUPPLY OPERATING RANGE: 2.5V to 5.5V q Micro SIZE PACKAGES

200MHz, CMOS

OPERATIONAL AMPLIFIER

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

APPLICATIONS

q VIDEO PROCESSING q ULTRASOUND

q OPTICAL NETWORKING, TUNABLE LASERS q PHOTODIODE TRANSIMPEDANCE AMPS q ACTIVE FILTERS

q HIGH-SPEED INTEGRATORS

q ANALOG-TO-DIGITAL (A/D) CONVERTER INPUT BUFFERS q DIGITAL-TO-ANALOG (D/A) CONVERTER OUTPUT AMPLIFIERS q BARCODE SCANNERS q COMMUNICATIONS

OPAx356 RELATED PRODUCTS

FEATURES

PRODUCT 200MHz, Rail-to-Rail Output, CMOS, Shutdown OPAx35538MHz, Rail-to-Rail Input/Output, CMOS OPAx35075MHz, Rail-to-Rail Output OPAx631150MHz, Rail-to-Rail Output

OPAx634Differential Input/Output, 3.3V Supply

THS412x

OPA356

Out

V+

V –

–V IN +V IN

O P A

356

O P A

235

O P A 2356

OPA356OPA2356

ABSOLUTE MAXIMUM RATINGS(1)

Supply Voltage, V+ to V–................................................................... 7.5V Signal Input Terminals, Voltage(2).................... (V–) – 0.5V to (V+) + 0.5V

Current(2).....................................................10mA Output Short-Circuit(3)..............................................................Continuous Operating Temperature..................................................–55°C to +150°C Storage Temperature......................................................

–65°C to +150°C Junction Temperature....................................................................+160°C Lead Temperature (soldering, 10s)...............................................+300°C NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground one amplifier per package.This integrated circuit can be damaged by ESD. Texas Instru-ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION Top View

PIN CONFIGURATIONS

1 2 35

V+

–In

Out

V–

+In

OPA356

SOT23

NC(1)

V+

Out

NC(1)

–In

+In

V–

OPA356

V+

Out B

–In B

+In B

Out A

–In A

+In A

V–

OPA2356

MSOP, SO

NOTE: (1) NC means no internal connection.

SPECIFIED

PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT

PRODUCT PACKAGE-LEAD DESIGNATOR(1)RANGE MARKING NUMBER(2)MEDIA, QUANTITY OPA356AIDBV SOT23-5DBV–40°C to +125°C OAAI OPA356AIDBVT Tape and Reel, 250 """""OPA356AIDBVR Tape and Reel, 3000 OPA356AID SO-8D–40°C to +125°C OPA356A OPA356AID Rails, 100 """""OPA356AIDR Tape and Reel, 2500 OPA2356AIDGK MSOP-8DGK–40°C to +125°C AYI OPA2356AIDGKT Tape and Reel, 250 """""OPA2356AIDGKR Tape and Reel, 2500 OPA2356AID SO-8D–40°C to +125°C OPA2356A OPA2356AID Rails, 100 """""OPA2356AIDR Tape and Reel, 2500

NOTES: (1) For the most current specifications and package information, refer to our web site at https://www.wendangku.net/doc/a311879469.html,. (2) Models labeled with “T” indicate smaller quantity tape and reel, “R” indicates large quantity tape and reel and “D” indicates rails of specified quantity.

ELECTRICAL CHARACTERISTICS: V S = +2.7V to +5.5V Single Supply Boldface limits apply over the specified temperature range, T A = –40°C to +125°C.

At T A = +25°C, R F = 604?, R L = 150?, Connected to V S/2, unless otherwise noted.

OPA356AIDBV, AID,

OPA2356AIDGK, AID

PARAMETER CONDITION MIN TYP MAX UNITS OFFSET VOLTAGE

Input Offset Voltage V OS V S = +5V±2±9mV

Specified Temperature Range±15mV vs Temperature dV OS/dT Specified Temperature Range±7μV/°C vs Power Supply PSRR V S = +2.7V to +5.5V, V CM = V S/2 – 0.15V±80±350μV/V

INPUT BIAS CURRENT

Input Bias Current I B3±50pA Input Offset Current I OS±1±50pA NOISE

Input Noise Voltage Density e n f = 1MHz 5.8nV/√Hz Current Noise Density i n f = 1MHz50fA/√Hz

INPUT VOLTAGE RANGE

Common-Mode Voltage Range V CM(V–) – 0.1(V+) – 1.5V Common-Mode Rejection Ratio CMRR V S = +5.5V, –0.1V < V CM < +4.0V6680dB

Specified Temperature Range66dB

INPUT IMPEDANCE

Differential1013 || 1.5? || pF Common-Mode1013 || 1.5? || pF

OPEN-LOOP GAIN V S = +5V, 0.3V < V O < 4.7V8492dB

OPA356V S = +5V, 0.3V < V O < 4.7V80dB

OPA2356V S = +5V, 0.4V < V O < 4.6V80dB

FREQUENCY RESPONSE

Small-Signal Bandwidth f–3dB G = +1, V O = 100mVp-p, R F = 0?450MHz

f–3dB G = +2, V O = 100mVp-p, R L = 50?100MHz

f–3dB G = +2, V O = 100mVp-p, R L = 150?170MHz

f–3dB G = +2, V O = 100mVp-p, R L = 1k?200MHz Gain-Bandwidth Product GBW G = +10, R L = 1k?200MHz Bandwidth for 0.1dB Gain Flatness f0.1dB G = +2, V O = 100mVp-p, R F = 560?75MHz Slew Rate SR V S = +5V, G = +2, 4V Output Step300/–360V/μs Rise-and-Fall Time G = +2, V O = 200mVp-p, 10% to 90% 2.4ns

G = +2, V O = 2Vp-p, 10% to 90%8ns Settling Time, 0.1%V S = +5V, G = +2, 2V Output Step30ns

0.01%V S = +5V, G = +2, 2V Output Step120ns Overload Recovery Time V IN? Gain = V S8ns Harmonic Distortion

2nd Harmonic G = +2, f = 1MHz, V O = 2Vp-p, R L = 200?–81dBc 3rd Harmonic G = +2, f = 1MHz, V O = 2Vp-p, R L = 200?–93dBc Differential Gain Error NTSC, R L = 150?0.02% Differential Phase Error NTSC, R L = 150?0.05degrees Channel-to-Channel Crosstalk OPA2356 f = 5MHz–90dB

OUTPUT

Voltage Output Swing from Rail V S = +5V, R L = 150?, A OL > 84dB0.20.3V Voltage Output Swing from Rail V S = +5V, R L = 1k?0.1V Voltage Output Swing from Rail I O = ±100mA0.81V Ouput Current, Continuous(1)I O±60mA Maximum Output Current, Peak(1)I O V S = +5V±100mA Maximum Output Current, Peak(1)I O V S = +3V±80mA Short Circuit Current+250/–200mA Closed-Loop Output Impedance f < 100kHz0.02?

POWER SUPPLY

Specified Voltage Range V S 2.7 5.5V Operating Voltage Range 2.5 to 5.5V Quiescent Current (per amplifier)I Q V S = +5V, I O = 08.311mA

Specified Temperature Range14mA

ELECTRICAL CHARACTERISTICS: V S = +2.7V to +5.5V Single Supply (Cont.) Boldface limits apply over the specified temperature range, T A = –40°C to +125°C.

At T A = +25°C, R F = 604?, R L = 150?, Connected to V S/2, unless otherwise noted.

OPA356AIDBV, AID,

OPA2356AIDGK, AID

PARAMETER CONDITION MIN TYP MAX UNITS THERMAL SHUTDOWN

Junction Temperature

Shutdown160°C Reset from Shutdown140°C

TEMPERATURE RANGE

Specified Range–40125°C Operating Range–55150°C Storage Range–65150°C Thermal ResistanceθJA°C/W SOT23-5, MSOP-8150°C/W SO-8125°C/W

NOTES: (1) See typical characteristic “Output Voltage Swing vs Output Current”.

TYPICAL CHARACTERISTICS

At T A = +25°C and V S = 5V, G = +2, R F = 604?, R L = 150? connected to V S /2, unless otherwise noted.

NON-INVERTING SMALL-SIGNAL

FREQUENCY RESPONSE

Frequency (Hz)

N o r m a l i z e d G a i n (d B )

10M

100M 1G 100k

30–3

–6

–9

–12–15

INVERTING SMALL-SIGNAL FREQUENCY RESPONSE

Frequency (Hz)

N o r m a l i z e d G a i n (d B )

10M

100M 1G

100k

0–3–6

–9–12–15

NON-INVERTING SMALL-SIGNAL

STEP RESPONSE Time (20ns/div)

O u t p

u t V o l t a g e (50m V /d i v )

NON-INVERTING LARGE-SIGNAL

STEP RESPONSE

Time (20ns/div)

O u t p

u t V o l t a g e (500m V /d i v )

0.1dB GAIN FLATNESS FOR VARIOUS R F

Frequency (MHz)

N o r m a l i z e d G a i n (d B )

100

0.50.40.3

0.20.10–0.1–0.2–0.3–0.4–0.5

HARMONIC DISTORTION vs OUTPUT VOLTAGE

Output Voltage (Vp-p)

H a r m o n i c D i s t o r t i o n (d B c )

–50

–60

–70

–80

–90

–100

TYPICAL CHARACTERISTICS (Cont.)

At T A = +25°C and V S = 5V, G = +2, R F = 604?, R L = 150? connected to V S /2, unless otherwise noted.

HARMONIC DISTORTION vs NON-INVERTING GAIN

Gain (V/V)

H a r m o n i c D i s t o r t i o n (d B c )

–50

–60–70

–80–90

–100

HARMONIC DISTORTION vs INVERTING GAIN

Gain (V/V)

H a r m o n i c D i s t o r t i o n (d B c )

–50

–60

–70

–80

–90

–100

HARMONIC DISTORTION vs FREQUENCY

Frequency (Hz)

H a r m o n i c D i s t o r t i o n (d B c )

10M

100k

–50

–60–70–80

–90–100

HARMONIC DISTORTION vs LOAD RESISTANCE

R L (?)

H a r m o n i c D i s t o r t i o n (d B c )

100

–50

–60

–70

–80

–90

–100

INPUT VOLTAGE AND CURRENT NOISE SPECTRAL DENSITY vs FREQUENCY

Frequency (Hz)

V o l t a g e N o i s e (n V /√H z ), C u r r e n t N o i s e (f A /√H z )

100M

100

10k

100k

10M

10k

100

1FREQUENCY RESPONSE FOR VARIOUS R L

Frequency (Hz)

N o r m a l i z e d G a i n (d B )

10M

100M 1G

100k

30–3–6

–9–12

–15

TYPICAL CHARACTERISTICS (Cont.)

At T A = +25°C and V S = 5V, G = +2, R F = 604?, R L = 150? connected to V S /2, unless otherwise noted.

FREQUENCY RESPONSE FOR VARIOUS C L

Frequency (Hz)

N o r m a l i z e d G a i n (d B )

10M

100M

100k

9630–3–6–9–12–15

RECOMMENDED R S vs CAPACITIVE LOAD

Capacitive Load (pF)

R S (?)

100

1201008060

200

FREQUENCY RESPONSE vs CAPACITIVE LOAD

Frequency (Hz)

N o r m a l i z e d G a i n (d B )

10M 100M

30–3–6–9–12–15

Frequency (Hz)

10M 100M 100k

1M 1G

10k 10090

80706050403020100

COMMON-MODE REJECTION RATIO AND

POWER-SUPPLY REJECTION RATIO vs FREQUENCY

C M R R , P S R R (d B )

OPEN-LOOP GAIN AND PHASE

Frequency (Hz)

O p e n -L o o p G a i n (d B )

O p e

n -L o o p P h a s e (d e g r e e s )10M

100M 100k 1M 1G

10k

180160140120100806040200–20

COMPOSITE VIDEO

DIFFERENTIAL GAIN AND PHASE

Number of 150? Loads

d G /d P (%/d

e g r e e s )

324

0.400.350.300.250.200.150.100.050dP

TYPICAL CHARACTERISTICS (Cont.)

At T A = +25°C and V S = 5V, G = +2, R F = 604?, R L = 150? connected to V S /2, unless otherwise noted.

INPUT BIAS CURRENT vs TEMPERATURE

Temperature (°C)

I n p u t B i a s C u r r e n t (p A )

6585

1055

2545135

125–55

–35

–15

10n

100

1OUTPUT VOLTAGE SWING vs OUTPUT CURRENT

FOR V S = 3V

Output Current (mA)

O u t p u t V o l t a g e (V )

6030

90120

150

SUPPLY CURRENT vs TEMPERATURE

Temperature (°C)

S u p p l y C u r r e n t

(m A )

6585

1055

2545135

125–55

–35

–15

14121086420OUTPUT VOLT AGE SWING vs OUTPUT CURRENT

FOR V S = 5V

Output Current (mA)

O u t p u t V o l t a g e (V )

10050

150200

250

0CLOSED-LOOP OUTPUT IMPEDANCE vs FREQUENCY Frequency (Hz)

O u t p u t I m p e d a n c e (?)

10M 100M

1M 1G

10k

100k

100

0.1

0.01

0.001

MAXIMUM OUTPUT VOLTAGE vs FREQUENCY Frequency (MHz)

O u t p u t V o l t a g e (V p -p )

100

543

210

TYPICAL CHARACTERISTICS (Cont.)

At T A = +25°C and V S = 5V, G = +2, R F = 604?, R L = 150? connected to V S /2, unless otherwise noted.

OUTPUT SETTLING TIME TO 0.1%

Time (ns)

O u t p u t E r r o r (%)

253040

2050

0.2

0.10–0.1–0.2–0.3–0.4

OPEN-LOOP GAIN vs TEMPERATURE

Temperature (°C)

O p e n -L o o p G a i n (d B )

6585

1055

2545135

125–55

–35

–15

110

100

OFFSET VOLTAGE PRODUCTION DISTRIBUTION

Offset Voltage (mV)

P e r c e n t o f A m p l i f i e r s (%)

–6–7–8–9–5–4–3–2–10123456789

2018161412108642

COMMON-MODE REJECTION RATIO AND

POWER-SUPPLY REJECTION RATIO vs TEMPERATURE

Temperature (°C)

C M R R , P S R R (d B )

6585

1055

2545135

125–55

–35

–

100

50CHANNEL-TO-CHANNEL CROSSTALK

Frequency (Hz)

C r o s s t a l k , I n p u t -R e f e r r e d (d B )

10M 1M

100M

100k

–20–40–60–80

–100–120

APPLICATIONS INFORMATION

The OPAx356 series is a CMOS, high-speed, voltage feed-back, operational amplifier designed for video and other general-purpose applications. It is available as a single or dual op amp.

The amplifier features a 200MHz gain bandwidth and 360V/μs slew rate, but it is unity-gain stable and can be operated as a +1V/V voltage follower.

Its input common-mode voltage range includes ground, al-lowing the OPAx356 to be used in virtually any single-supply application up to a supply voltage of +5.5V.

PCB LAYOUT

Good high-frequency PC board layout techniques should be employed for the OPAx356. Generous use of ground planes,short direct signal traces, and a suitable bypass capacitor located at the V+ pin will assure clean, stable https://www.wendangku.net/doc/a311879469.html,rge areas of copper also provide a means of dissipating heat that is generated within the amplifier in normal opera-tion.

Sockets are definitely not recommended for use with any high-speed amplifier.

A 10μF ceramic bypass capacitor is the minimum recom-mended value; adding a 1μF or larger tantalum capacitor in parallel can be beneficial when driving a low-resistance load.Providing adequate bypass capacitance is essential to achiev-ing very low harmonic and intermodulation distortion.

OPERATING VOLTAGE

The OPAx356 is specified over a power-supply range of +2.7V to +5.5V (±1.35 to ±2.75V). However, the supply voltage may range from +2.5V to +5.5V (±1.25V to ±2.75V).Supply voltages higher than 7.5V (absolute maximum) can permanently damage the amplifier.

FIGURE 1. Internal ESD Protection.

Parameters that vary significantly over supply voltage or temperature are shown in the “Typical Characteristics ” sec-tion of this data sheet.

OUTPUT DRIVE

The OPAx356 output stage is capable of driving a standard back-terminated 75? video cable. By back-terminating a transmission line, it does not exhibit a capacitive load to its driver. A properly back-terminated 75? cable does not ap-pear as capacitance; it presents only a 150? resistive load to the OPAx356 output.

The output stage can supply high short-circuit current (typi-cally over 200mA). Therefore, an on-chip thermal shutdown circuit is provided to protect the OPAx356 from dangerously high junction temperatures. At 160°C, the protection circuit will shut down the amplifier. Normal operation will resume when the junction temperature cools to below 140°C.NOTE: It is not recommended to run a continuous DC current in excess of ±60mA. Refer to the graph of “Output Voltage Swing vs Output Current ”, shown in the “Typical Character-istics ” section of this data sheet.

INPUT AND ESD PROTECTION

All OPAx356 pins are static protected with internal ESD protection diodes tied to the supplies, as shown in Figure 1.These diodes will provide overdrive protection if the current is externally limited to 10mA by the source or by a resistor.

PACKAGE DRAWINGS

DBV (R-PDSO-G5)PLASTIC SMALL-OUTLINE

NOTES: A.All linear dimensions are in millimeters.

B.This drawing is subject to change without notice.

C.Body dimensions do not include mold flash or protrusion.

D.Falls within JEDEC MO-178

PACKAGE DRAWINGS (Cont.)

MPDS028B – JUNE 1997 – REVISED SEPTEMBER 2001 DGK (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE

NOTES: A.All linear dimensions are in millimeters.

B.This drawing is subject to change without notice.

C.Body dimensions do not include mold flash or protrusion.

D.Falls within JEDEC MO-187

PACKAGE DRAWINGS (Cont.)

MSOI002B – JANUARY 1995 – REVISED SEPTEMBER 2001

D (R-PDSO-G**) PLASTIC SMALL-OUTLIN

E PACKAGE

8 PINS SHOWN

NOTES: A.All linear dimensions are in inches (millimeters).

B.This drawing is subject to change without notice.

C.Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).

D.Falls within JEDEC MS-012

PACKAGING INFORMATION

Orderable Device Status (1)Package Type Package Drawing

Pins Package Qty Eco Plan (2)

Lead/Ball Finish MSL Peak Temp (3)OPA2356AID ACTIVE SOIC D 8100Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR OPA2356AIDG4ACTIVE SOIC D 8100

Green (RoHS &no Sb/Br)

CU NIPDAU Level-2-260C-1YEAR OPA2356AIDGKR ACTIVE MSOP DGK 82500Green (RoHS &

no Sb/Br)CU NIPDAU Level-2-260C-1YEAR OPA2356AIDGKRG4ACTIVE MSOP DGK 82500Green (RoHS &

no Sb/Br)CU NIPDAU Level-2-260C-1YEAR OPA2356AIDGKT ACTIVE MSOP DGK 8250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR OPA2356AIDGKTG4ACTIVE MSOP DGK 8250

Green (RoHS &no Sb/Br)

CU NIPDAU Level-2-260C-1YEAR OPA2356AIDR ACTIVE SOIC D 82500Green (RoHS &

no Sb/Br)CU NIPDAU Level-2-260C-1YEAR OPA2356AIDRG4ACTIVE SOIC D 82500Green (RoHS &

no Sb/Br)CU NIPDAU Level-2-260C-1YEAR OPA356AID ACTIVE SOIC D 8100

Green (RoHS &no Sb/Br)

CU NIPDAU Level-2-260C-1YEAR OPA356AIDBVR ACTIVE SOT-23DBV 53000Green (RoHS &

no Sb/Br)

CU NIPDAU Level-2-260C-1YEAR OPA356AIDBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &

no Sb/Br)CU NIPDAU Level-2-260C-1YEAR OPA356AIDBVT ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR OPA356AIDBVTG4ACTIVE SOT-23DBV 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR OPA356AIDG4ACTIVE SOIC D 8100

Green (RoHS &no Sb/Br)

CU NIPDAU Level-2-260C-1YEAR OPA356AIDR ACTIVE SOIC D 82500Green (RoHS &

no Sb/Br)CU NIPDAU Level-2-260C-1YEAR OPA356AIDRG4

ACTIVE

SOIC

2500Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1YEAR

(1)

The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.

LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.

NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.

PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.

(2)

Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check https://www.wendangku.net/doc/a311879469.html,/productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.

Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)

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(3)

MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual

basis.

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7-May-2007

TAPE AND REEL

INFORMATION

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7-May-2007

Device

Package Pins Site

Reel Diameter (mm)

Reel Width (mm)A0(mm)B0(mm)K0(mm)

P1(mm)W (mm)Pin1Quadrant OPA2356AIDGKR DGK 8CAR 00 5.3 3.4 1.4812Q1OPA2356AIDR D 8CRS 00

6.4 5.2 2.1812Q1OPA356AIDR

CRS

6.4

5.2

2.1

TAPE AND REEL BOX INFORMATION

Device Package Pins Site Length (mm)

Width (mm)Height (mm)

OPA2356AIDGKR DGK 8CAR 346.0346.029.0OPA2356AIDR D 8CRS 342.9336.620.6OPA356AIDR

CRS

342.9

336.6

20.6

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