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ISO35DW中文资料

FEATURES

APPLICATIONS

DESCRIPTION

R RE D GND1

Y Vcc2B Z A GND2

DE DW PACKAGE

Vcc1GND1

GND2GND2GND1

Z B A

function diagram

R RE D GND1

Vcc2

B A

GND2

DE DW PACKAGE

Vcc1GND1

GND2GND2GND1function diagram

ISO15ISO35

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ISOLATED 3.3-V FULL AND HALF-DUPLEX RS-485TRANSCEIVERS

?Security Systems ?4000-V PEAK Isolation,560-Vpeak V IORM

UL 1577,IEC 60747-5-2(VDE 0884,Rev 2)?Chemical Production ?Factory Automation ?1/8Unit Load –Up to 256Nodes on a Bus ?Motor/motion Control

?Meets or Exceeds TIA/EIA RS-485?HVAC and Building Automation Networks Requirements

Networked Security Stations

?Signaling Rates up to 1Mbps ?Thermal Shutdown Protection

?Low Bus Capacitance –16pF (Typ)?50kV/μs Typical Transient Immunity

?Fail-safe Receiver for Bus Open,Short,Idle ?

3.3-V Inputs are 5-V Tolerant

The ISO15is an isolated half-duplex differential line transceiver while the ISO35is an isolated full-duplex differential line driver and receiver for TIA/EIA 485/422applications.

These devices are ideal for long transmission lines since the ground loop is broken to allow for a much larger common-mode voltage range.The symmetrical isolation barrier of the device is tested to provide 2500Vrms of isolation for 60s between the bus-line transceiver and the logic-level interface.

Any cabled I/O can be subjected to electrical noise transients from various sources.These noise transients can cause damage to the transceiver and/or near-by sensitive circuitry if they are of sufficient magnitude and duration.These isolated devices can significantly increase protection and reduce the risk of damage to expensive control circuits.

The ISO15and ISO35are qualified for use from –40°C to 85°C.

Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

ABSOLUTE MAXIMUM RATINGS (1)

RECOMMENDED OPERATING CONDITIONS

SUPPLY CURRENT

ISO15

ISO35

SLOS580B–MAY 2008–REVISED JULY https://www.wendangku.net/doc/a817534594.html,

These devices have limited built-in ESD protection.The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

(1)Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device.These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)

All voltage values except differential I/O bus voltages are with respect to network ground terminal and are peak voltage values

MIN

TYP MAX UNIT V CC Supply Voltage,V CC1,V CC2 3.15 3.3

3.6V V OC Voltage at either bus I/O terminal A,B –712V V IH High-level input voltage 2V CC D,DE,RE V V IL Low-level input voltage 00.8V ID Differential input voltage A with respect to B

–1212

V R L Differential input resistance 5460

?Driver –6060I O Output current

mA Receiver –88T J

Operating junction temperature

–40

150

°C

over recommended operating condition (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT RE at 0V or Vcc,DE at 0V,No load (driver disabled)8ISO35

mA RE at 0V or Vcc,DE at V CC ,No Load (driver enabled)8Logic-side supply I CC1

current

RE at 0V or Vcc,DE at 0V,No load (driver disabled)8ISO15mA RE at 0V or Vcc,DE at V CC ,No Load (driver enabled)8RE at 0V or Vcc,DE at 0V,No load (driver disabled)15ISO35

mA RE at 0V or Vcc,DE at V CC ,No Load (driver enabled)19Bus-side supply I CC2

current

RE at 0V or Vcc,DE at 0V,No load (driver disabled)15ISO15

RE at 0V or Vcc,DE at V CC ,No Load (driver enabled)

DRIVER ELECTRICAL CHARACTERISTICS

DRIVER SWITCHING CHARACTERISTICS

ISO15ISO35

over

recommended operating

conditions (unless otherwise noted)

over recommended operating conditions (unless otherwise noted)

RECEIVER ELECTRICAL CHARACTERISTICS

RECEIVER SWITCHING CHARACTERISTICS

ISO15ISO35

SLOS580B–MAY 2008–REVISED

JULY https://www.wendangku.net/doc/a817534594.html,

over recommended operating conditions (unless otherwise noted)

PARAMETER MEASUREMENT INFORMATION

V CC2

V A V OC(SS)

OD(H)

OD(L)

C includes fixture and

Instrumentation Capacitance

L Generator: PRR = 500 kHz, 50% duty cycle, t <6ns, t <6ns, Z = 50r f O W = 50 pF L ISO15ISO35

Figure 1.Driver V OD Test and Current Definitions

Figure 2.Driver V OD With Common-Mode Loading Test

Circuit

Figure 3.Test Circuit and Waveform Definitions For The Driver Common-Mode Output Voltage

Figure 4.Driver Switching Test Circuit and Voltage Waveforms

OH = 110W

C includes fixture and

Instrumentation capacitance

L V OL

W 3V

Generator: PRR = 500 kHz, 50% duty cycle,t <6ns, t <6ns, Z = 50r f O W

instrumentation capacitance

= 15 pF L t <6ns, t <6ns, Z = 50r f O

V OH

V OL 0V

ISO15ISO35

SLOS580B–MAY 2008–REVISED JULY https://www.wendangku.net/doc/a817534594.html,

PARAMETER MEASUREMENT INFORMATION (continued)

Figure 5.Driver High-Level Output Enable and Disable Time Test Circuit and Voltage Waveforms

Figure 6.Driver Low-Level Output Enable and Disable Time Test Circuit and Voltage Waveform

Figure 7.Receiver Voltage and Current Definitions

Figure 8.Receiver Switching Test Circuit and Waveforms

?0V

Note:This test is conducted to test survivability only.

Data stability at the R output is not specified.

0 V

Pulse Generator

15s duration

1% duty cycle

t, t<100 ns

r f

ISO15

ISO35 https://www.wendangku.net/doc/a817534594.html,................................................................................................................................................................SLOS580B–MAY2008–REVISED JULY2008 PARAMETER MEASUREMENT INFORMATION(continued)

Figure9.Receiver Enable Test Circuit and Waveforms,Data Output High

Figure10.Receiver Enable Test Circuit and Waveforms,Data Output Low

Figure11.Transient Over-Voltage Test Circuit

F ±1%

V OH C = 0.1F ±1%

ISO15

ISO35

SLOS580B–MAY2008–REVISED https://www.wendangku.net/doc/a817534594.html, PARAMETER MEASUREMENT INFORMATION(continued)

Figure12.Half-Duplex Common-Mode Transient Immunity Test Circuit

Figure13.Full-Duplex Common-Mode Transient Immunity Test Circuit

DEVICE INFORMATION PACKAGE CHARACTERISTICS ISO15 ISO35

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Table1.Driver Function Table

ENABLE

INPUT

INPUT OUTPUTS

(D)

V CC1V CC2(DE)

A or Y

B or Z

PU PU H H H L

PU PU L H L H

PU PU X L Z Z

PU PU X OPEN Z Z

PU PU OPEN H H L

PD PU X X Z Z

PU PD X X Z Z

PD PD X X Z Z

Table2.Receiver Function Table

DIFFERENTIAL INPUT ENABLE OUTPUT

V CC1V CC2

V ID=(V A–V B)(RE)(R)

PU PU–0.01V≤V ID L H

PU PU–0.2V

PU PU V ID≤–0.2V L L

PU PU X H Z

PU PU X OPEN Z

PU PU Open circuit L H

PU PU Short Circuit L H

PU PU Idle(terminated)bus L H

PD PU X X Z

PU PD X L H

over recommended operating conditions(unless otherwise noted)

PARAMETER(1)TEST CONDITIONS MIN TYP MAX UNIT

L(I01)Minimum air gap(Clearance)Shortest terminal to terminal distance through air8.34mm

Shortest terminal to terminal distance across the

L(I02)Minimum external tracking(Creepage)8.1mm

package surface

Tracking resistance(Comparative Tracking

CTI DIN IEC60112/VDE0303Part1≥175V Index)

Minimum Internal Gap(Internal Clearance)Distance through the insulation0.008mm

Input to output,V IO=500V,all pins on each

R IO Isolation resistance side of the barrier tied together creating a>1012?

two-terminal device

C IO Barrier capacitance Input to output V I=0.4sin(4E6πt)2pF

C I Input capacitance to ground V I=0.4sin(4E6πt)2pF

(1)Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application.Care

should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed circuit board do not reduce this distance.

Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation Glossary.Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications.

IEC 60664-1RATINGS TABLE

IEC 60747-5-2INSULATION CHARACTERISTICS

(1)

REGULATORY INFORMATION

ISO15ISO35

SLOS580B–MAY 2008–REVISED JULY https://www.wendangku.net/doc/a817534594.html,

PARAMETER TEST CONDITIONS SPECIFICATION

Basic isolation group Material group

IIIa Rated mains voltage ≤150V RMS I-IV Installation classification

Rated mains voltage ≤300V RMS I-III Rated mains voltage ≤400V RMS

I-II

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

SPECIFICATION

UNIT Maximum working insulation V IORM 560

V voltage

Method b1,V PR =V IORM ×1.875,

V PR Input to output test voltage 1050V 100%Production test with t =1s,Partial discharge <5pC V IOTM Transient overvoltage t =60s

4000V R S

Insulation resistance V IO =500V at T S

>109

Pollution degree

(1)

Climatic Clasification 40/125/21

VDE

Certified according to IEC 60747-5-2Recognized under 1577Component Recognition Program (1)

File Number:40016131File Number:E181974

(1)

Production tested ≥3000VRMS for 1second in accordance with UL 1577.

IEC SAFETY LIMITING VALUES

THERMAL CHARACTERISTICS

100

150

200

T - Case Temperature - °C

C S a f e t y L i m i t i n g C u r r e n t - m A

ISO15ISO35

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.A failure of the IO can allow low resistance to ground or the supply and,without current limiting,dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures.

PARAMETER

TEST CONDITIONS MIN

TYP

MAX UNIT θJA =212°C/W,V I =5.5V,I S Safety input,output,or supply current DW-16210mA T J =170°C,T A =25°C

T S

Maximum case temperature

DW-16

150

°C

The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum ratings table.The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature.The assumed junction-to-air thermal resistance in the Thermal Characteristics table is that of a device installed in the JESD51-3,Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages and is conservative.The power is the recommended maximum input voltage times the current.The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP MAX UNIT Low-K Thermal Resistance (1)168θJA Junction-to-Air

°C/W High-K Thermal Resistance

96.1θJB Junction-to-Board Thermal Resistance 61°C/W θJC Junction-to-Case Thermal Resistance 48

°C/W V CC1=V CC2=5.25V,T J =150°C,C L =15pF,P D Device Power Dissipation

220

Input a 20MHz 50%duty cycle square wave

(1)

Tested in accordance with the Low-K or High-K thermal metric defintions of EIA/JESD51-3for leaded surface mount packages.

Figure 14.DW-16θJC Thermal Derating Curve per IEC 60747-5-2

EQUIVALENT CIRCUIT SCHEMATICS

ISO15ISO35

SLOS580B–MAY 2008–REVISED JULY https://www.wendangku.net/doc/a817534594.html,

TYPICAL CHARACTERISTICS CURVES

V - Output Voltage - V

O I - O u t p u t C u r r e n t - m A

V - Output Voltage - V

O 5

I - O u t p u t C u r r e n t

- m A

O -60-40

-20

-7

-4-12581114

I - B u s I n p u t C u r r e n t I -A

m V

- Bus Input Voltage - V

I 0

200

400

600

1000

Signaling Rate - kbps

R M S S u p p l y C u r r e n t - m A

800

ISO15ISO35

LOW-LEVEL OUTPUT CURRENT

HIGH-LEVEL OUTPUT CURRENT

LOW-LEVEL OUTPUT VOLTAGE

HIGH-LEVEL OUTPUT VOLTAGE

Figure 15.

Figure 16.

RMS SUPPLY CURRENT

BUS INPUT CURRENT

SIGNALING RATE

INPUT VOLTAGE

Figure 17.Figure 18.

-60

-40

-20

6080V - D i f f e r e n t i a l O u t p u t V o l t a g e - V

O D T - Free-Air Temperature -C A o

143 V

3.6 V

811

10976-60

-40

-20

6080D r i v e r P r o p a g a t i o n D e l a y - n s

T - Free-Air Temperature -C

A o

ISO15ISO35

SLOS580B–MAY 2008–REVISED JULY https://www.wendangku.net/doc/a817534594.html,

TYPICAL CHARACTERISTICS CURVES (continued)

DRIVER DIFFERENTIAL OUTPUT VOLTAGE

DRIVER PROPAGATION DELAY

FREE-AIR TEMPERATURE

Figure 19.Figure 20.

APPLICATION INFORMATION

Transient Voltages

ISO

GND2N

ISO IN

Z V =V Z Z +(1)x 9

GND2ISO 94N ISO IN V R 10==V R R 10610++(2)ISO ISO ISO

1C GND2

C 111N

C C 16

C V 1

1===

=0.94

V 11+

(3)

V N

A, B,Y, or Z

(GND2)

16V

ISO15ISO35

Isolation of a circuit insulates it from other circuits and earth so that noise develops across the insulation rather than circuit components.The most common noise threat to data-line circuits is voltage surges or electrical fast transients that occur after installation.The transient ratings of the ISO15and ISO35are sufficient for all but the most severe installations.However,some equipment manufacturers use their ESD generators to test transient susceptibility of their equipment,and can exceed insulation ratings.ESD generators simulate static discharges that may occur during device or equipment handling with low-energy but high voltage transients.

Figure 21models the ISO15and ISO35bus IO connected to a noise generator.C IN and R IN is capacitance or across the device and any other stray or added capacitance or resistance across the A or B pin to GND2.C ISO and R ISO is the capacitance and resistance between GND1and GND2of the ISO15and ISO35plus those of any other insulation (transformer,etc.).The stray inductance is assumed to be negligible.From this model,the voltage at the isolated bus return is,

and will always be less than 16V from V N .If the ISO15and ISO35are tested as a stand-alone device,R IN =6?104?,C IN =16?10–12F,R ISO =109?and C ISO =10–12F.

Note from Figure 21that the resistor ratio determines the voltage ratio at low frequency and it is the inverse frequency.In the stand-alone case and for low frequency,

or essentially all of noise appears across the barrier.At high frequency,

and 94%of V N appears across the barrier.As long as R ISO is greater than R IN and C ISO is less than C IN ,most of transient noise appears across the isolation barrier.

It is not recommend for the user to test equipment transient susceptibility with ESD generators,or consider product claims of ESD ratings above the barrier transient ratings of an isolated interface.ESD is best managed through recessing or covering connector pins in a conductive connector shell and installer training.

Figure 21.Noise Model

PACKAGING INFORMATION

Orderable Device

Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)

Lead/Ball Finish MSL Peak Temp (3)ISO15DW ACTIVE SOIC DW 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR ISO15DWG4ACTIVE SOIC DW 1640

Green (RoHS &no Sb/Br)

CU NIPDAU Level-2-260C-1YEAR ISO15DWR ACTIVE SOIC DW 162000Green (RoHS &

no Sb/Br)CU NIPDAU Level-2-260C-1YEAR ISO15DWRG4ACTIVE SOIC DW 162000Green (RoHS &

no Sb/Br)CU NIPDAU Level-2-260C-1YEAR ISO35DW ACTIVE SOIC DW 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR ISO35DWG4ACTIVE SOIC DW 1640

Green (RoHS &no Sb/Br)

CU NIPDAU Level-2-260C-1YEAR ISO35DWR ACTIVE SOIC DW 162000Green (RoHS &

no Sb/Br)CU NIPDAU Level-2-260C-1YEAR ISO35DWRG4

ACTIVE

SOIC

2000Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1YEAR

(1)

The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.

LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.

NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.

PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.

(2)

Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check https://www.wendangku.net/doc/a817534594.html,/productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the

die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.

Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)

(3)

MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

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11-Jul-2008

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Type Package Drawing Pins SPQ

Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)

P1(mm)W (mm)Pin1Quadrant ISO15DWR SOIC DW 162000330.016.410.910.78 3.012.016.0Q1ISO35DWR

SOIC

2000

330.0

16.4

10.9

10.78

3.0

12.0

16.0

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) ISO15DWR SOIC DW162000358.0335.035.0 ISO35DWR SOIC DW162000358.0335.035.0

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