AP9578M
P-CHANNEL ENHANCEMENT MODE POWER MOSFET
▼ Lower On-resistance BV DSS -60V ▼
Simple Drive Requirement R DS(ON)
170m Ω ▼Fast Switching Characteristic
I D
-3A
Description
Absolute Maximum Ratings
Symbol
Units V DS V V GS
V I D @T A =25℃A I D @T A =70℃A I DM
A P D @T A =25℃W W/℃T STG ℃T J
℃
Symbol
Value Unit Rthj-a
Thermal Resistance Junction-ambient 3
Max.
50
℃/W
Data and specifications subject to change without notice
200825041
AP9578M
Rating -60±25-3Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current 3Continuous Drain Current 3-2.3Pulsed Drain Current 1-202.5-55 to 150Operating Junction Temperature Range
-55 to 150
Linear Derating Factor 0.02Storage Temperature Range
Thermal Data
Parameter
Total Power Dissipation The Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching,
ruggedized device design, low on-resistance and cost-effectiveness.The SO-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters.
S S S
G
D
D D
D
SO-8
Electrical Characteristics@T j =25o C(unless otherwise specified)
Symbol Parameter
Test Conditions
Min.Typ.
Max.Units BV DSS
Drain-Source Breakdown Voltage V GS =0V, I D =-250uA
-60--V ΔB V DSS /ΔT j
Breakdown Voltage Temperature Coefficient Reference to 25℃, I D =-1mA
--0.04-V/℃R DS(ON)Static Drain-Source On-Resistance 2
V GS =-10V, I D =-3A --170m ΩV GS =-4.5V, I D =-2A --200m ΩV GS(th)Gate Threshold Voltage V DS =V GS , I D =-250uA -1--3V g fs Forward Transconductance
V DS =-10V, I D =-3A -4-S I DSS Drain-Source Leakage Current (T j =25o C)V DS =-60V, V GS =0V ---1uA Drain-Source Leakage Current (T j =70o C)
V DS =-48V, V GS =0V ---25uA I GSS Gate-Source Leakage V GS =±25V --nA Q g Total Gate Charge 2I D =-3A -915nC Q gs Gate-Source Charge V DS =-48V -2-nC Q gd Gate-Drain ("Miller") Charge V GS =-4.5V -3-nC t d(on)Turn-on Delay Time 2V DS =-30V -10-ns t r Rise Time
I D =-1A
-5-ns t d(off)Turn-off Delay Time R G =3.3Ω,V GS =-10V -36-ns t f Fall Time R D =30Ω-11-ns C iss Input Capacitance V GS =0V -8001280pF C oss Output Capacitance
V DS =-25V -75-pF C rss
Reverse Transfer Capacitance
f=1.0MHz
-
50
-pF
Source-Drain Diode
Symbol Parameter
Test Conditions
Min.Typ.Max.Units V SD
Forward On Voltage 2I S =-2A, V GS =0V ---1.2V t rr
Reverse Recovery Time 2I S =-3A, V GS =0V ,-41-ns Q rr
Reverse Recovery Charge
dI/dt=100A/μs
-95
-nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse width <300us , duty cycle <2%.
3.Surface mounted on 1 in 2 copper pad of FR4 board, t <10sec ; 125 ℃/W when mounted on Min. copper pad.
AP9578M
±100
AP9578M
Fig 1. Typical Output Characteristics
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
Fig 5. Forward Characteristic of
Reverse Diode
Junction Temperature
Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics Fig 9. Maximum Safe Operating Area
Fig 11. Switching Time Waveform Fig 12. Gate Charge Waveform AP9578M