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CM1415中文资料

3 Channel Headset EMI Filter with ESD Protection

Features

?Functionally and pin compatible with California Micro Device’s CSPEMI205

?Optiguard ? coated for improved reliability at assembly

?Three channels of EMI filtering, two for earpiece speakers and one for a microphone

?Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network

?Greater than 30dB relative attenuation in the 800-2700MHz range

?+8kV ESD protection on each channel

(IEC 61000-4-2 Level 4, contact discharge)?+15kV ESD protection on each channel (HBM)?8-bump, 1.41mm X 1.45mm footprint Chip Scale Package (CSP)

?Chip Scale Package features extremely low para-sitic inductance for optimum filter performance ?

Lead-free version available

Applications

?EMI filtering and ESD protection for headset micro-phone and speaker

?Cellular / Mobile Phones

?Notebooks and Personal Computers ?Handheld PCs / PDAs / Tablets ?Wireless Handsets ?

Digital Camcorders

Product Description

The CM1415 is a low-pass filter array integrating three pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the head-set port on a cellular telephone, and contains two dif-ferent filter values. Each high quality filter provides more than 30dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filter-ing, controlling EMI both to and from the microphone and speaker elements. They also support bipolar sig-nals, enabling audio signals to pass through without distortion.

In addition, the CM1415 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV.

The CM1415 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight.

The CM1415 incorporates Optiguard ? coating which results in improved reliability at assembly. The CM1415is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing.

Electrical Schematic

10 ?

100p F

Earpiece 1A3

C1C3

B2GND GND

10 ?

Input

Earpiece 2Input

Earpiece 1

Output

Earpiece 2Output

100p F

68 ?

47p F 47p F

Microphone C5A5

Input

Microphone

Output

Ordering Information

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.

Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.

PIN DESCRIPTIONS

PIN NAME DESCRIPTION

A1EAR1_IN Earpiece Input 1 (from audio circuitry)A3EAR2_IN Earpiece Input 2 (from audio circuitry)A5MIC_IN Microphone Input (from microphone)B2GND Device Ground B4GND Device Ground

C1EAR1_OUT Earpiece Output 1 (to earpiece)C3EAR2_OUT Earpiece Output 2 (to earpiece)C5

MIC_OUT

Microphone Output (to audio circuitry)

PART NUMBERING INFORMATION

Bumps Package Standard Finish

Lead-free Finish 2

Ordering Part

Number 1Part Marking

Ordering Part Number 1Part Marking

CSP

CM1415-03CS

CM1415-03CP

Specifications

Note 1:T A =25°C unless otherwise specified.

Note 2:ESD applied to input and output pins with respect to GND, one at a time.

Note 3:Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,

then clamping voltage is measured at Pin C1.

Note 4:Unused pins are left open

Note 5:The parameters are guaranteed by design.Note 6:Z SOURCE =50?, Z LOAD =50?

ABSOLUTE MAXIMUM RATINGS

PARAMETER

RATING UNITS Storage T emperature Range -65 to +150

°C DC Power per Resistor 100mW DC Package Power Rating

300

STANDARD OPERATING CONDITIONS

PARAMETER

RATING UNITS Operating Temperature Range

-40 to +85

°C

ELECTRICAL OPERATING CHARACTERISTICS 1

SYMBOL

PARAMETER CONDITIONS

MIN TYP MAX UNITS R 1Resistance 91011?R 2Resistance 546875?C 1 Capacitance 80100120pF C 2 Capacitance

57pF I LEAK Diode Leakage Current V IN =5.0V 1.0μA V SIG

Signal Voltage

Positive Clamp Negative Clamp

I LOAD = 10mA

5-57-10

15-15

V V V ESD

In-system ESD Withstand Voltage

a) Human Body Model, MIL-STD-883, Method 3015

b) Contact Discharge per IEC 61000-4-2 Level 4Notes 2,4 and 5

±15±8

kV kV

V CL

Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV

Positive Transients Negative T ransients Notes 2,3,4 and 5

+15-19

V V f C1Cut-off frequency 1; Note 6R = 10?, C = 100pF 34MHz f C2

Cut-off frequency 2; Note 6

R = 68?, C = 47pF

MHz

Performance Information

Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)

Figure 1. Earpiece Circuit (A1-C1) EMI Filter Performance

Figure 2. Earpiece Circuit (A3-C3) EMI Filter Performance

Performance Information (cont’d)

Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)

Figure 3. Microphone Circuit (A5-C5) EMI Filter Performance

Application Information

Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.

Figure 4. Recommended Non-Solder Mask Defined Pad Illustration

Figure 5. Eutectic (SnPb) Solder Ball Reflow Profile Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile

PRINTED CIRCUIT BOARD RECOMMENDATIONS

PARAMETER VALUE

Pad Size on PCB0.275mm Round

Pad Definition Non-Solder Mask defined pads Solder Mask Opening0.325mm Round Solder Stencil Thickness0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls)0.330mm Round Solder Flux Ratio50/50 by volume Solder Paste T ype No Clean

Pad Protective Finish OSP (Entek Cu Plus 106A) T olerance — Edge T o Corner Ball+50μm

Solder Ball Side Coplanarity+20μm

Maximum Dwell Time Above Liquidous60 seconds

Soldering Maximum Temperature

260°C Solder Mask Opening

0.325mm DIA.

Non-Solder Mask Defined Pad

0.275mm DIA.

Solder Stencil Opening

0.330mm DIA.

Mechanical Details

CSP Mechanical Specifications

CM1415 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the Cali-fornia Micro Devices CSP Package Information docu-ment.

Package Dimensions for CM1415

Chip Scale Package

CSP Tape and Reel Specifications

Figure 7. Tape and Reel Mechanical Data

PACKAGE DIMENSIONS

Package Custom CSP

Bumps 8

Dim Millimeters Inches Min Nom Max Min Nom

Max

A1 1.405 1.450 1.4950.05530.05710.0589A2 1.365 1.410 1.4550.05370.05550.0573B10.4950.5000.5050.01950.01970.0199B20.2450.2500.2550.00960.00980.0100B30.4300.4350.4400.01690.01710.0173B40.4300.4350.4400.01690.01710.0173C10.1750.2250.2750.00690.00890.0108C20.2200.2700.3200.00870.01060.0126D10.6000.6700.7390.02360.02640.0291D2

0.394

0.445

0.495

0.01550.01750.0195# per tape and

reel

3500 pieces

Controlling dimension: millimeters

Mechanical Package Diagrams

B C 135

DIMENSIONS IN MILLIMETERS

D1D2

BOTTOM VIEW

SIDE

VIEW

24C1

B40.30 DIA.

63/37 Sn/Pb (Eutectic) or

SOLDER BUMPS

95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)OptiGuard TM

Coating

PART NUMBER

CHIP SIZE (mm)POCKET SIZE (mm)

B 0 X A 0 X K 0TAPE WIDTH

REEL DIAMETER QTY PER REEL P 0P 1CM1415

1.45 X 1.41 X 0.6

1.55 X 1.52 X 0.71

8mm

178mm (7")

3500

4mm

only including draft.