3 Channel Headset EMI Filter with ESD Protection
Features
?Functionally and pin compatible with California Micro Device’s CSPEMI205
?Optiguard ? coated for improved reliability at assembly
?Three channels of EMI filtering, two for earpiece speakers and one for a microphone
?Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network
?Greater than 30dB relative attenuation in the 800-2700MHz range
?+8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)?+15kV ESD protection on each channel (HBM)?8-bump, 1.41mm X 1.45mm footprint Chip Scale Package (CSP)
?Chip Scale Package features extremely low para-sitic inductance for optimum filter performance ?
Lead-free version available
Applications
?EMI filtering and ESD protection for headset micro-phone and speaker
?Cellular / Mobile Phones
?Notebooks and Personal Computers ?Handheld PCs / PDAs / Tablets ?Wireless Handsets ?
Digital Camcorders
Product Description
The CM1415 is a low-pass filter array integrating three pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the head-set port on a cellular telephone, and contains two dif-ferent filter values. Each high quality filter provides more than 30dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filter-ing, controlling EMI both to and from the microphone and speaker elements. They also support bipolar sig-nals, enabling audio signals to pass through without distortion.
In addition, the CM1415 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV.
The CM1415 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight.
The CM1415 incorporates Optiguard ? coating which results in improved reliability at assembly. The CM1415is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing.
Electrical Schematic
10 ?
100p F
100p F
Earpiece 1A3
B4
C1C3
B2GND GND
A1
10 ?
Input
Earpiece 2Input
Earpiece 1
Output
Earpiece 2Output
100p F
100p F
68 ?
47p F 47p F
Microphone C5A5
Input
Microphone
Output
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
A1EAR1_IN Earpiece Input 1 (from audio circuitry)A3EAR2_IN Earpiece Input 2 (from audio circuitry)A5MIC_IN Microphone Input (from microphone)B2GND Device Ground B4GND Device Ground
C1EAR1_OUT Earpiece Output 1 (to earpiece)C3EAR2_OUT Earpiece Output 2 (to earpiece)C5
MIC_OUT
Microphone Output (to audio circuitry)
PART NUMBERING INFORMATION
Bumps Package Standard Finish
Lead-free Finish 2
Ordering Part
Number 1Part Marking
Ordering Part Number 1Part Marking
8
CSP
CM1415-03CS
CD
CM1415-03CP
CD
Specifications
Note 1:T A =25°C unless otherwise specified.
Note 2:ESD applied to input and output pins with respect to GND, one at a time.
Note 3:Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4:Unused pins are left open
Note 5:The parameters are guaranteed by design.Note 6:Z SOURCE =50?, Z LOAD =50?
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING UNITS Storage T emperature Range -65 to +150
°C DC Power per Resistor 100mW DC Package Power Rating
300
mW
STANDARD OPERATING CONDITIONS
PARAMETER
RATING UNITS Operating Temperature Range
-40 to +85
°C
ELECTRICAL OPERATING CHARACTERISTICS 1
SYMBOL
PARAMETER CONDITIONS
MIN TYP MAX UNITS R 1Resistance 91011?R 2Resistance 546875?C 1 Capacitance 80100120pF C 2 Capacitance
38
47
57pF I LEAK Diode Leakage Current V IN =5.0V 1.0μA V SIG
Signal Voltage
Positive Clamp Negative Clamp
I LOAD = 10mA
5-57-10
15-15
V V V ESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883, Method 3015
b) Contact Discharge per IEC 61000-4-2 Level 4Notes 2,4 and 5
±15±8
kV kV
V CL
Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV
Positive Transients Negative T ransients Notes 2,3,4 and 5
+15-19
V V f C1Cut-off frequency 1; Note 6R = 10?, C = 100pF 34MHz f C2
Cut-off frequency 2; Note 6
R = 68?, C = 47pF
63
MHz
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Earpiece Circuit (A1-C1) EMI Filter Performance
Figure 2. Earpiece Circuit (A3-C3) EMI Filter Performance
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. Microphone Circuit (A5-C5) EMI Filter Performance
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
Figure 4. Recommended Non-Solder Mask Defined Pad Illustration
Figure 5. Eutectic (SnPb) Solder Ball Reflow Profile Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER VALUE
Pad Size on PCB0.275mm Round
Pad Definition Non-Solder Mask defined pads Solder Mask Opening0.325mm Round Solder Stencil Thickness0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls)0.330mm Round Solder Flux Ratio50/50 by volume Solder Paste T ype No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A) T olerance — Edge T o Corner Ball+50μm
Solder Ball Side Coplanarity+20μm
Maximum Dwell Time Above Liquidous60 seconds
Soldering Maximum Temperature
260°C Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Mechanical Details
CSP Mechanical Specifications
CM1415 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the Cali-fornia Micro Devices CSP Package Information docu-ment.
Package Dimensions for CM1415
Chip Scale Package
CSP Tape and Reel Specifications
Figure 7. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package Custom CSP
Bumps 8
Dim Millimeters Inches Min Nom Max Min Nom
Max
A1 1.405 1.450 1.4950.05530.05710.0589A2 1.365 1.410 1.4550.05370.05550.0573B10.4950.5000.5050.01950.01970.0199B20.2450.2500.2550.00960.00980.0100B30.4300.4350.4400.01690.01710.0173B40.4300.4350.4400.01690.01710.0173C10.1750.2250.2750.00690.00890.0108C20.2200.2700.3200.00870.01060.0126D10.6000.6700.7390.02360.02640.0291D2
0.394
0.445
0.495
0.01550.01750.0195# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
A
B C 135
DIMENSIONS IN MILLIMETERS
D1D2
A2
BOTTOM VIEW
SIDE
VIEW
24C1
B1
A1
B3
C2
B40.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)OptiGuard TM
Coating
PART NUMBER
CHIP SIZE (mm)POCKET SIZE (mm)
B 0 X A 0 X K 0TAPE WIDTH
W
REEL DIAMETER QTY PER REEL P 0P 1CM1415
1.45 X 1.41 X 0.6
1.55 X 1.52 X 0.71
8mm
178mm (7")
3500
4mm
4mm
only including draft.