Gpm200技术资料

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Printed Circuit Materials

Riston ?

GPM200

Data Sheet & Processing Information

Photopolymer Films

Photopolymer Dry Film for Acid and Alkaline Etch, Copper,Tin, & Tin/Lead, Nickel & Gold

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DuPont Photopolymer & Electronic Materials

深圳市甘井高新材料有限公司

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P RODUCT F EATURES /A PPLICATIONS

Riston? GPM200 has very strong resistance to lifting on all surfaces. It has been formulated to be compatible with incoming copper clad surfaces, scrubbed and unscrubbed electroless,direct metalization processes and panel plated copper.

The resist is designed to be used in the follow-ing applications: acid and alkaline etch, tent and etch, copper, tin, tin/lead, nickel and gold plating.

P ROCESSING D ATA

This Processing guide documents specific process information for Riston? GPM200. Data quoted in this guide have been generated using production equipment as well as laboratory test methods and are offered as a guideline. Actual production parameters will depend upon the equipment,

chemistries, and process controls in use, and should be selected for best performance. For more background on general processing see the General Processing Guide.

S TORAGE

See recommendations in the General Processing Guide (DS98-41).

S AFE H ANDLING

Consult the Material Safety Data Sheet (MSDS) for Riston? dry film photoresist vapors. The vapor MSDS for this film was prepared using the highest lamination roll temperature recommended for use.If you choose to exceed this temperature, be aware that the amount of vapor may increase and that the identity of the materials vaporized may vary from those in the MSDS. For more Safe Handling information, see publication H-43328 (12/92)“Handling Procedure for DuPont Photopolymer Films”.

W ASTE D ISPOSAL

For questions concerning disposal of photoresist waste refer to the latest DuPont literature and Federal, State, and Local Regulations.

PART 1: C OPPER S URFACES AND S URFACE P REPARATION

Riston? GPM200 has very strong resistance to lifting on all surfaces. Riston? GPM200 is compatible with the following surfaces and surface preparations:

? I/L copper

Pumice

Chemical Clean

? Electroless:

Unscrubbed

Pumice and Brush scrubbed

? Direct metallization surfaces

? Panel plated copper

Unscrubbed

Scrubbed

Antitarnish

The following antitarnishes have been used successfully per manufacturers' processing recommendations:

?Shipley 7130

?Duratech PCL

?Enthone Entek Cu56

(Others may give equally acceptable results) For prelamination cleaning suggestions, see General Processing Guide and its references.PART 2: L AMINATION Lamination Conditions for DuPont HRL-24/Yieldmaster? Film Laminator

?Pre-Heat: Optional

?Lam. Roll Temp.: 110-120°C (230-245°F)

?Recommended : 115°C (239°F)

NOTE: Expected Board Exit Temperatur e: Innerlayers: 60-70°C (140-160°F) Outerlayers (gold plate): 50-55°C (120-130°F) Outerlayers (Cu/Sn or Cu/Sn-Pb): 45-55°C (110-130°F)

For information on how to use Board Exit Temperature for process control, see General Processing Guide

?Roll Speed: 0.6-1.5 m/min (2-5 ft/min)

?Air Assist Pressure: 0-2.8 bar (0-40 psig) Note: for >1.4 bar use heavy-duty rolls)

Lamination Conditions for Automatic Sheet Laminators

?Pre-heat: Optional

?Seal Bar Temp.: 50-80°C

?Lamination Roll Temp.:110-120°C NOTE: Expected Board Exit Temperature: Innerlayers: 60-70°C (140-160°F) Outerlayers (gold plate): 50-55°C (120-130°F)

Outerlayers (Cu/Sn or Cu/Sn-Pb): 45-55°C (110-130°F)

(For information on how to use Board Exit Temperature for process control, see General Processing Guide)

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? Seal Bar Pressure: 3.5-4.5 bar (50-65 psig)

? Lam. Roll Pressure: 3.0-5.0 bar (43-72 psig)

? Seal Time: 1-4 seconds

? Lamination Speed: 1.5-3 m/min (5-10 ft/min)

PART 3: E XPOSURE

Riston? GPM200 can be exposed on all stand-ard equipment used in the printed circuit board industry. Choose lamps that compliment the peak resist response of 350 to 380 nm.

Riston? GPM200 has better resolution and wid-er exposure latitude than other resists. It is also more resistant to off-contact exposure defects, which are common in glass/glass exposure frames.

Resolution down to 50 microns (2 mil) lines and spaces is possible with Riston? GPM200

in optimized production environments.

Recommended Exposure Range

GPM213GPM215GPM220 Nominal 30μm 40μm 50μm Thickness

RST 25 10-18 10-18 10-18 SST 21 7-9 7-9 7-9

SST 41 19-28 19-28 19-28

mJ/cm220-55 25-60 30-75 Suggestions:

?Start with RST 13-14 for fine line applica-tions, (100 microns L/S).

?Start with RST 15-16 for >125 microns L/S. Note:

?RST = DuPont Riston? 25-Step Density Tablet (read as highest resist step)?SST 41 = Stouffer 41-Step Sensitivity Guide (read as highest resist step)

?SST = Stouffer 21-Step Sensitivity Guide (read as highest resist step)

?Exposure energy (mJ/cm2) from International Light Radiometer model IL1400A with Super Slim UV Probe (SSL001A) on an Olec AP30-8000 exposure unit.

PART 4: D EVELOPMENT

Riston? GPM200 can be developed in sodium or potassium carbonate with good productivity. It has wide development latitude. Development Recommendations

? Spray Pressure1.4-2.2 bar (25-30 psig)

High impact direct-fan or cone nozzles

preferred

? Chemistry

Na

2

CO

3

0.7-1.0 wt%; 0.85 wt% preferred

Na

2

CO

3·

H

2

O 0.8-1.1 wt%; 1.0 wt% preferred

K

2

CO

3

0.8-1.1 wt%; 1.0 wt% preferred ? Temperature27-35°C (80-95°F); 30°C (85F)

preferred

? Breakpoint 50-65% (60% preferred)

? Dwell Times Riston? GPM220 32-42 secs (approx.) Riston? GPM215 25 - 35 sec

Riston? GPM213 22-30 secs ? Resist Loading:

Feed & Bleed4-8 mil-ft2/gal: 0.07-0.14 m2/

liter

Batch To 12 mil-ft2/gal; to 0.20 m2/

liter

? Rinse Water Hard water (150-250 ppm

CaCO3 equivalent), or soft

water are acceptable

? Rinse Spray High Impact, direct fan

Nozzles nozzles preferred

? Drying Blow dry throughly; Hot air

preferred

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Recommended Acid Hot Soak Cleaners:

VersaCLEAN? 425:

6-12 vol%; 40-50°C (100-120°F);2-4 min Others may work equally well

PART 6: E TCHING

?Riston? GPM200 is compatible and strongly resistant to most alkaline ammonical etch processes. Excellent adhesion after multiple passes through alkaline machines capable of 4oz copper.?Riston? GPM200 is compatible with most acid etchants, e.g. cupric chloride ( free HCl normal-ity<3.0 N), H 2O 2/H 2SO 4, and ferric chloride.

PART 7: S TRIPPING

Riston? GPM200 is formulated to dissolve

slowly in stripping solution afer breaking up into pieces. This can greatly increase the life of the stripping solution and reduce costs, if the resist can be removed before dissolving. Filtration is strongly recommended.Stripping Recommendations

? Chemistry:

NaOH: 1.5-3 wt%; faster stripping at 3 wt%KOH: 1.5-3 wt%; faster stripping at 3 wt%Proprietary Strippers:Concentration per vendor recommendation

Spray Pressures: 1.4-2.4 bar (20-35 psig)Spray Nozzles: High impact direct fan Breakpoint: 50% or lower

NOTE:

Dwell Time ranges were established in Chemcut 547 type developer equipment, using sodium carbonate and 2-10 mil-ft 2/gal (0.07-0.17 m 2/liter)loading, with all other variables set within the preferred ranges mentioned above.

Defoamers

Riston? GPM200 could require the use of a defoamer. If required, add 0.8 ml/liter (3 ml/gallon) of one of these antifoams:

FoamFREE? 940Pluronic 31R1Dexter DF1205RBP BB

Others may work equally well.

PART 5: P LATING

(acid copper sulfate; tin/lead; tin; nickel;gold)

(Follow plating vendors’ recommendations )

Riston? GPM200 can be used for pattern plate

processes with acid copper, tin/lead, tin, nickel

and gold plating baths. Riston? GPM200 has

very strong resistance to lifting and underplating.

The plating process conditions should not be altered for the GPM200 test probe.

Recommendations: Preplate Cleaning Process Sequence

-Acid Cleaner : 38-50°C (100-120°F); 2-4minutes

-Spray Rinse: 2 minutes

-Microetch to remove 0.15-0.25 μm (5-10μ”)copper

(time: as required)

-Spray Rinse: 2 minutes

-Sulfuric acid (5-10 vol%) dip; 1-2 minutes -(Optional: spray rinse; 1-2 minutes)

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? Stripper Dwell Times (seconds) at 55°C

(130°F). Dwell time is the total time spent in the stripper, given a 50% breakpoint: Chemisrty

GPM215

GPM220

3.0 wt% NaOH 60-80 90-1201.5wt% NaOH 130-160 150-1803.0wt% KOH 110-140 130-1701.5 wt% KOH 140-170 150-180Defoamers:

Follow recommendations in Development Section.

Proprietary Strippers :

The following proprietary strippers have been used successfully for GPM200.

? RBP ADF-30? Dexter 2210? Dexter RS1609? NTS402HV

Others may perform equally well.

Generic mixtures of 3% NaOH (or KOH) plus 3%MEA (monoethanolamine) have also been used successfully.

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The information given herein is based on data believed to be reliable, but the DuPont Company makes no warranties, express or implied, as to its

accuracy and assumes no liability arising out of its use by others. This publication is not to be taken as a license to operate under, or recommendation to infringe,any patent.

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