BGF100中文资料

BGF100

Microphone Filter and ESD Protection Evaluation Kit

Edition 2007-02-21

Published by

Infineon Technologies AG

81726 München, Germany

? Infineon Technologies AG 2007.

All Rights Reserved.

LEGAL DISCLAIMER

THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND (INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN IN THIS APPLICATION NOTE.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (https://www.wendangku.net/doc/c03696831.html,).

Warnings

Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain

Microphone Filter and ESD Protection Evaluation Kit

Revision History: 2007-02-21, Rev. 1.2

Previous Version: 2006-02.13, Rev. 1.1

Page Subjects (major changes since last revision) 1Titel change

1BGF100 Microphone Filter and ESD Protection Evaluation Kit

1.1Description

The BGF100 is a microphone filter with low pass characteristic offering a very high stop band attenuation up to 6GHz. It also provides an ESD protection at the input pins up to 15kV contact discharge. The wafer level package is a green lead free package with a size of only 1.6mm x 2.1mm and a total height of 0.65mm.

The evaluation kit for the BGF100 microphone filter and ESD protection IC consists of two printed circuit boards:?DC board

?RF board

1.2DC Board

bgf100_dc_bb.vsd

Figure2DC evaluation board

Figure 2 shows the DC evaluation board used in this evaluation kit. This PCB was designed to be mounted with two BGF100. On the left hand side the HiPAC IC is soldered to the board while the right hand side of the board was left open to show the footprint required for BGF100.

The size of the board is 15mm by 38mm. The pitch size of the pads is 2.54mm.

This board was designed to perform pin-to-pin DC tests, like measuring the values of the integrated resistors, as well as checking the ESD performance of the IC. It can also be used for qualification purposes.

1.3RF Board

Figure 3

Bare RF Board

Figure 4Populated RF Board

bgf100_rf_bb.vsd

bgf100_rf_pb.vsd

Figure3 shows an unpopulated RF board for testing BGF100. It offers the possibility to measure the RF performance of the two signal lines B4-B1 and C4-C1. Additional DC pads on the board give access to pins A1 and A4 as well as to the GND pins. Please note that pin C2 is grounded.

Figure4 shows a fully assembled RF board. The size of this board is 28mm by 38mm, not including the SMA connectors.

1.3.1RF Measurement Curves

Figure5 shows the RF performance of the BGF100, it was measured in a 50? system. The typical transmission characteristics of both signal lines are displayed, B1-B4 in blue and C4-C1 in magenta.

Please note that the difference between the two curves is due to the fact that the resistor between C1 and C2 on signal line C4-C1 is connected to ground while its equivalent on line B4-B1 is left open.