Surface Mount RF Schottky
Barrier Diodes
Technical Data
HSMS-281x Series
Features
?Surface Mount Packages ?Low Flicker Noise
?Low FIT (Failure in Time) Rate*
?Six-sigma Quality Level ?Single, Dual and Quad
Versions
?Tape and Reel Options
Available
?Lead-free Option Available *For more information see the Surface Mount Schottky Reliability Data Sheet.
Description/Applications These Schottky diodes are specifically designed for both analog and digital applications. This series offers a wide range of specifications and package configurations to give the designer wide flexibility. The HSMS-281x series of diodes features very low flicker (1/f) noise.
Note that Agilent’s manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match.Package Lead Code Identification, SOT-23/SOT-143 (Top View)
COMMON
CATHODE
COMMON
ANODE
SERIES
SINGLE
Package Lead Code
Identification, SOT-323
(Top View)
Package Lead Code
Identification, SOT-363
(Top View)
UNCONNECTED
TRIO
L
HIGH ISOLATION
UNCONNECTED PAIR
K
1.Package marking provides
orientation and identification.
2.See “Electrical Specifications” for
appropriate package marking.
Pin Connections and
Package Marking
6
5
4
2
Electrical Specifications T C = 25°C, Single Diode [4]
Maximum
Maximum
Minimum Maximum Forward Reverse Typical Part Package
Breakdown Forward Voltage Leakage Maximum Dynamic Number Marking Lead Voltage Voltage V F (V) @I R (nA) @Capacitance Resistance HSMS [5]Code Code Configuration V BR (V)V F (mV)I F (mA)
V R (V)C T (pF)R D (?)[6]2810B0[3]0Single
20
400
1.0
35
200 15
1.2
15
2812B2[3]2Series
2813B3[3]3Common Anode 2814B4[3]4Common Cathode 2815B5[3]5Unconnected Pair 2817B7[3]7Ring Quad [5]2818B8[3]8Bridge Quad [5]281B B0[7]B Single 281C B2[7]C Series
281E B3[7]E Common Anode 281F B4[7]F Common Cathode 281K BK [7]K High Isolation
Unconnected Pair 281L
BL [7]
L
Unconnected Trio
Test Conditions
I R = 10 μA I F = 1 mA
V F = 0 V I F = 5 mA
f = 1 MHz
Notes:
1. ?V F for diodes in pairs and quads in 15 mV maximum at 1 mA.
2. ?C TO for diodes in pairs and quads is 0.2 pF maximum.
3. Package marking code is in white.
4. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
5. See section titled “Quad Capacitance.”
6. R D = R S + 5.2? at 25°C and I f = 5 mA.
7. Package marking code is laser marked.
Absolute Maximum Ratings [1] T C = 25°C
Symbol Parameter
Unit SOT-23/SOT-143SOT-323/SOT-363
I f Forward Current (1 μs Pulse)
Amp 1
1
P IV Peak Inverse Voltage V Same as V BR
Same as V BR
T j Junction Temperature °C 150150T stg Storage Temperature °C -65 to 150-65 to 150θjc
Thermal Resistance [2]
°C/W
500
150
Notes:
1.Operation in excess of any one of these conditions may result in permanent damage to the device.
2.T C = +25°C, where T C is defined to be the temperature at the package pins where contact is made to the circuit board.ESD WARNING:
Handling Precautions Should Be Taken To Avoid Static Discharge.
3
Quad Capacitance
Capacitance of Schottky diode quads is measured using an HP4271 LCR meter. This
instrument effectively isolates individual diode branches from the others, allowing accurate
capacitance measurement of each branch or each diode. The conditions are: 20 mV R.M.S.voltage at 1 MHz. Agilent defines this measurement as “CM ”, and it is equivalent to the capacitance of the diode by itself. The equivalent diagonal and adjacent capacitances can then be
calculated by the formulas given below.
In a quad, the diagonal capaci-tance is the capacitance between points A and B as shown in the figure below. The diagonal capacitance is calculated using the following formula
C 1 x C 2 C 3 x C 4
C DIAGONAL = _______ + _______
C 1 + C 2 C 3 + C 4
C 1
C 2
C 4
C 3
A
B
C
The equivalent adjacent
capacitance is the capacitance between points A and C in the figure below. This capacitance is calculated using the following formula
1
C ADJACENT = C 1 + ____________
1 1 1–– + –– + –– C
2 C 3C 4
SPICE Parameters
Parameter Units
HSMS-281x B V V 25C J0pF 1.1
E G eV 0.69I BV A E -5I S A 4.8E -9N 1.08R S ?10P B V
0.65P T 2M
0.5
C j
R j =
8.33 X 10-5 nT I b + I s
where
I b = externally applied bias current in amps
I s = saturation current (see table of SPICE parameters)T = temperature, °K
n = ideality factor (see table of SPICE parameters)Note:
To effectively model the packaged HSMS-281x product, please refer to Application Note AN1124.
R S = series resistance (see Table of SPICE parameters)C j = junction capacitance (see Table of SPICE parameters)Linear Equivalent Circuit, Diode Chip
4
Typical Performance, T C = 25°C (unless otherwise noted), Single Diode
Figure 1. Forward Current vs. Forward Voltage at Temperatures.
I F – F O R W A R D C U R R E N T (m A )
V F – FORWARD VOLTAGE (V)
0.01
10
1
0.1
100
Figure 2. Reverse Current vs. Reverse Voltage at Temperatures.I R – R E V E R S E C U R R E N T (n A )
V R – REVERSE VOLTAGE (V)
Figure 3. Dynamic Resistance vs. Forward Current.
0.1
1100
R D – D Y N A M I C R E S I S T A N C E (?)
I F – FORWARD CURRENT (mA)
10110
1000
100
Figure 4. Total Capacitance vs. Reverse Voltage.0
2
6
4
10
12
8
16
14
C T – C A P A C I T A N C E (p F )
V R – REVERSE VOLTAGE (V)
00.75
0.50
0.251.25
1V F - FORWARD VOLTAGE (V)
Figure 5. Typical V f Match, Pairs and Quads.
30
101
0.3
I F - F O R W A R D C U R R E N T (m A )
?V F - F O R W A R D V O L T A G E D I F F E R E N C E (m V )
0.2
0.40.60.8 1.0 1.2
1.4
5
Table 1. Typical SPICE Parameters.
Parameter Units HSMS-280x
HSMS-281x HSMS-282x B V V 752515C J0pF 1.6 1.10.7E G eV 0.690.690.69I BV A 1 E-5 1 E-5 1 E-4I S A 3 E-8 4.8 E-9 2.2 E-8N 1.08 1.08 1.08R S ?3010 6.0P B (V J )V
0.650.650.65P T (XTI)222M
0.5
0.5
0.5
Applications Information
Introduction —Product Selection
Agilent ’s family of Schottky
products provides unique solu-tions to many design problems.The first step in choosing the right product is to select the diode type.All of the products in the
HSMS-282x family use the same diode chip, and the same is true of the HSMS-281x and HSMS-280x families. Each family has a different set of characteristics which can be compared most easily by consulting the SPICE parameters in Table 1.
A review of these data shows that the HSMS-280x family has the highest breakdown voltage, but at the expense of a high value of series resistance (R s ). In applica-tions which do not require high voltage the HSMS-282x family,with a lower value of series
resistance, will offer higher current carrying capacity and better performance. The HSMS-281x family is a hybrid Schottky (as is the HSMS-280x), offering lower 1/f or flicker noise than the HSMS-282x family.
In general, the HSMS-282x family should be the designer ’s first choice, with the -280x family
reserved for high voltage applica-tions and the HSMS-281x family for low flicker noise applications.
Assembly Instructions
SOT-323 PCB Footprint
A recommended PC
B pad layout for the miniature SOT-323 (SC-70)package is shown in Figure 6(dimensions are in inches). This layout provides ample allowance for package placement by auto-mated assembly equipment without adding parasitics that could impair the performance.
Figure 6. PCB Pad Layout (dimensions in inches).
Assembly Instructions
SOT-363 PCB Footprint
A recommended PC
B pad layout for the miniature SOT-363 (SC-70,6 lead) package is shown in Figure 7 (dimensions are in inches). This layout provides ample allowance for package
placement by automated assembly equipment without adding
parasitics that could impair the performance.
Figure 7. PCB Pad Layout (dimensions in inches).
6
TIME (seconds)
T E M P E R A T U R E (°C )
050100
150
200250
60
120
180
240
300
Figure 8. Surface Mount Assembly Profile.
SMT Assembly
Reliable assembly of surface mount components is a complex process that involves many
material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.)
circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal
conductivity and thermal mass of components. Components with a low mass, such as the SOT
package, will reach solder reflow temperatures faster than those with a greater mass.
Agilent ’s SOT diodes have been qualified to the time-temperature profile shown in Figure 8. This profile is representative of an IR reflow type of surface mount assembly process.
These parameters are typical for a surface mount assembly process for Agilent diodes. As a general guideline, the circuit board and components should be exposed only to the minimum tempera-tures and times necessary to achieve a uniform reflow of solder.
After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste)passes through one or more
preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporat-ing solvents from the solder paste.The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder.The rates of change of tempera-ture for the ramp-up and cool-down zones are chosen to be low enough to not cause deformation of the board or damage to compo-nents due to thermal shock. The maximum temperature in the reflow zone (T MAX ) should not exceed 235°C.
7
Part Number Ordering Information
No. of Part Number Devices Container HSMS-281x-TR2*1000013" Reel HSMS-281x-TR1*30007" Reel HSMS-281x-BLK *
100
antistatic bag
x = 0, 2, 3, 4, 5, 7, 8, B, C, E, F, K, L
For lead-free option, the part number will have the character "G" at the end, eg. HSMS-281x-TR2G for a 10,000 lead-free reel.
Package Dimensions
Outline 23 (SOT-23)
Outline 143 (SOT-143)
SIDE VIEW
END VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
PACKAGE MARKING CODE (XX)
Outline SOT-363 (SC-70 6 Lead)
Outline SOT-323 (SC-70 3 Lead)
0.25 (0.010)0.30 (0.012)0.10 (0.004)
0.425 (0.017)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
0.30 (0.012)0.10 (0.004)
0.425 (0.017)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
8
Device Orientation
USER FEED
For Outline SOT-143
Note: "AB" represents package marking code. "C" represents date code.END VIEW
TOP VIEW For Outlines SOT-23, -323
Note: "AB" represents package marking code. "C" represents date code.
END VIEW
TOP VIEW END VIEW
TOP VIEW Note: "AB" represents package marking code. "C" represents date code.
For Outline SOT-363
9
Tape Dimensions and Product Orientation
For Outline SOT-23
DESCRIPTION
SYMBOL SIZE (mm)SIZE (INCHES)LENGTH WIDTH DEPTH PITCH
BOTTOM HOLE DIAMETER A 0B 0K 0P D 1 3.15 ± 0.102.77 ± 0.101.22 ± 0.104.00 ± 0.101.00 + 0.050.124 ± 0.0040.109 ± 0.0040.048 ± 0.0040.157 ± 0.0040.039 ± 0.002CAVITY
DIAMETER PITCH POSITION D P 0E 1.50 + 0.104.00 ± 0.101.75 ± 0.100.059 + 0.0040.157 ± 0.0040.069 ± 0.004PERFORATION
WIDTH THICKNESS
W t18.00 + 0.30 – 0.100.229 ± 0.0130.315 + 0.012 – 0.0040.009 ± 0.0005CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION)CAVITY TO PERFORATION (LENGTH DIRECTION)
F P 2
3.50 ± 0.052.00 ± 0.05
0.138 ± 0.0020.079 ± 0.002
DISTANCE BETWEEN CENTERLINE
For Outline SOT-143
1
DESCRIPTION
SYMBOL SIZE (mm)SIZE (INCHES)LENGTH WIDTH DEPTH PITCH
BOTTOM HOLE DIAMETER A 0B 0K 0P D 1 3.19 ± 0.102.80 ± 0.101.31 ± 0.104.00 ± 0.101.00 + 0.250.126 ± 0.0040.110 ± 0.0040.052 ± 0.0040.157 ± 0.0040.039 + 0.010CAVITY
DIAMETER PITCH POSITION D P 0E 1.50 + 0.104.00 ± 0.101.75 ± 0.100.059 + 0.0040.157 ± 0.0040.069 ± 0.004PERFORATION
WIDTH THICKNESS
W t18.00 + 0.30 – 0.100.254 ± 0.0130.315+ 0.012 – 0.0040.0100 ± 0.0005CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION)CAVITY TO PERFORATION (LENGTH DIRECTION)
F P 2
3.50 ± 0.052.00 ± 0.05
0.138 ± 0.0020.079 ± 0.002
DISTANCE
https://www.wendangku.net/doc/ca4084291.html,/semiconductors
For product information and a complete list of distributors, please go to our web site.For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or (916) 788-6763
Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (65) 6756 2394
India, Australia, New Zealand: (65) 6755 1939Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only)Korea: (65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand, Philippines,Indonesia: (65) 6755 2044Taiwan: (65) 6755 1843
Data subject to change.
Copyright ? 2004 Agilent Technologies, Inc.Obsoletes 5968-7649E March 24, 20045989-0475EN
Tape Dimensions and Product Orientation
For Outlines SOT-323, -363
(CARRIER TAPE THICKNESS)
(COVER TAPE THICKNESS)
DESCRIPTION
SYMBOL SIZE (mm)SIZE (INCHES)LENGTH WIDTH DEPTH PITCH
BOTTOM HOLE DIAMETER A 0B 0K 0P D 1 2.40 ± 0.102.40 ± 0.101.20 ± 0.104.00 ± 0.101.00 + 0.250.094 ± 0.0040.094 ± 0.0040.047 ± 0.0040.157 ± 0.0040.039 + 0.010CAVITY
DIAMETER PITCH POSITION D P 0E 1.55 ± 0.054.00 ± 0.101.75 ± 0.100.061 ± 0.0020.157 ± 0.0040.069 ± 0.004PERFORATION
WIDTH THICKNESS W t 18.00 ± 0.300.254 ± 0.020.315 ± 0.0120.0100 ± 0.0008CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION)CAVITY TO PERFORATION (LENGTH DIRECTION)
F P 2 3.50 ± 0.052.00 ± 0.050.138 ± 0.0020.079 ± 0.002
DISTANCE
FOR SOT-323 (SC70-3 LEAD)An
8°C MAX FOR SOT-363 (SC70-6 LEAD)
10°C MAX
ANGLE
WIDTH
TAPE THICKNESS C T t 5.4 ± 0.100.062 ± 0.0010.205 ± 0.0040.0025 ± 0.00004COVER TAPE