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HSMS-2810-BLK中文资料

Surface Mount RF Schottky

Barrier Diodes

Technical Data

HSMS-281x Series

Features

?Surface Mount Packages ?Low Flicker Noise

?Low FIT (Failure in Time) Rate*

?Six-sigma Quality Level ?Single, Dual and Quad

Versions

?Tape and Reel Options

Available

?Lead-free Option Available *For more information see the Surface Mount Schottky Reliability Data Sheet.

Description/Applications These Schottky diodes are specifically designed for both analog and digital applications. This series offers a wide range of specifications and package configurations to give the designer wide flexibility. The HSMS-281x series of diodes features very low flicker (1/f) noise.

Note that Agilent’s manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match.Package Lead Code Identification, SOT-23/SOT-143 (Top View)

COMMON

CATHODE

COMMON

ANODE

SERIES

SINGLE

Package Lead Code

Identification, SOT-323

(Top View)

Package Lead Code

Identification, SOT-363

(Top View)

UNCONNECTED

TRIO

HIGH ISOLATION

UNCONNECTED PAIR

1.Package marking provides

orientation and identification.

2.See “Electrical Specifications” for

appropriate package marking.

Pin Connections and

Package Marking

Electrical Specifications T C = 25°C, Single Diode [4]

Maximum

Minimum Maximum Forward Reverse Typical Part Package

Breakdown Forward Voltage Leakage Maximum Dynamic Number Marking Lead Voltage Voltage V F (V) @I R (nA) @Capacitance Resistance HSMS [5]Code Code Configuration V BR (V)V F (mV)I F (mA)

V R (V)C T (pF)R D (?)[6]2810B0[3]0Single

400

1.0

200 15

1.2

2812B2[3]2Series

2813B3[3]3Common Anode 2814B4[3]4Common Cathode 2815B5[3]5Unconnected Pair 2817B7[3]7Ring Quad [5]2818B8[3]8Bridge Quad [5]281B B0[7]B Single 281C B2[7]C Series

281E B3[7]E Common Anode 281F B4[7]F Common Cathode 281K BK [7]K High Isolation

Unconnected Pair 281L

BL [7]

Unconnected Trio

Test Conditions

I R = 10 μA I F = 1 mA

V F = 0 V I F = 5 mA

f = 1 MHz

Notes:

1. ?V F for diodes in pairs and quads in 15 mV maximum at 1 mA.

2. ?C TO for diodes in pairs and quads is 0.2 pF maximum.

3. Package marking code is in white.

4. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.

5. See section titled “Quad Capacitance.”

6. R D = R S + 5.2? at 25°C and I f = 5 mA.

7. Package marking code is laser marked.

Absolute Maximum Ratings [1] T C = 25°C

Symbol Parameter

Unit SOT-23/SOT-143SOT-323/SOT-363

I f Forward Current (1 μs Pulse)

Amp 1

P IV Peak Inverse Voltage V Same as V BR

Same as V BR

T j Junction Temperature °C 150150T stg Storage Temperature °C -65 to 150-65 to 150θjc

Thermal Resistance [2]

°C/W

500

150

Notes:

1.Operation in excess of any one of these conditions may result in permanent damage to the device.

2.T C = +25°C, where T C is defined to be the temperature at the package pins where contact is made to the circuit board.ESD WARNING:

Handling Precautions Should Be Taken To Avoid Static Discharge.

Quad Capacitance

Capacitance of Schottky diode quads is measured using an HP4271 LCR meter. This

instrument effectively isolates individual diode branches from the others, allowing accurate

capacitance measurement of each branch or each diode. The conditions are: 20 mV R.M.S.voltage at 1 MHz. Agilent defines this measurement as “CM ”, and it is equivalent to the capacitance of the diode by itself. The equivalent diagonal and adjacent capacitances can then be

calculated by the formulas given below.

In a quad, the diagonal capaci-tance is the capacitance between points A and B as shown in the figure below. The diagonal capacitance is calculated using the following formula

C 1 x C 2 C 3 x C 4

C DIAGONAL = _______ + _______

C 1 + C 2 C 3 + C 4

C 1

C 2

C 4

C 3

The equivalent adjacent

capacitance is the capacitance between points A and C in the figure below. This capacitance is calculated using the following formula

C ADJACENT = C 1 + ____________

1 1 1–– + –– + –– C

2 C 3C 4

SPICE Parameters

Parameter Units

HSMS-281x B V V 25C J0pF 1.1

E G eV 0.69I BV A E -5I S A 4.8E -9N 1.08R S ?10P B V

0.65P T 2M

0.5

C j

R j =

8.33 X 10-5 nT I b + I s

where

I b = externally applied bias current in amps

I s = saturation current (see table of SPICE parameters)T = temperature, °K

n = ideality factor (see table of SPICE parameters)Note:

To effectively model the packaged HSMS-281x product, please refer to Application Note AN1124.

R S = series resistance (see Table of SPICE parameters)C j = junction capacitance (see Table of SPICE parameters)Linear Equivalent Circuit, Diode Chip

Typical Performance, T C = 25°C (unless otherwise noted), Single Diode

Figure 1. Forward Current vs. Forward Voltage at Temperatures.

I F – F O R W A R D C U R R E N T (m A )

V F – FORWARD VOLTAGE (V)

0.01

0.1

100

Figure 2. Reverse Current vs. Reverse Voltage at Temperatures.I R – R E V E R S E C U R R E N T (n A )

V R – REVERSE VOLTAGE (V)

Figure 3. Dynamic Resistance vs. Forward Current.

0.1

1100

R D – D Y N A M I C R E S I S T A N C E (?)

I F – FORWARD CURRENT (mA)

10110

1000

100

Figure 4. Total Capacitance vs. Reverse Voltage.0

C T – C A P A C I T A N C E (p F )

V R – REVERSE VOLTAGE (V)

00.75

0.50

0.251.25

1V F - FORWARD VOLTAGE (V)

Figure 5. Typical V f Match, Pairs and Quads.

101

0.3

I F - F O R W A R D C U R R E N T (m A )

?V F - F O R W A R D V O L T A G E D I F F E R E N C E (m V )

0.2

0.40.60.8 1.0 1.2

1.4

Table 1. Typical SPICE Parameters.

Parameter Units HSMS-280x

HSMS-281x HSMS-282x B V V 752515C J0pF 1.6 1.10.7E G eV 0.690.690.69I BV A 1 E-5 1 E-5 1 E-4I S A 3 E-8 4.8 E-9 2.2 E-8N 1.08 1.08 1.08R S ?3010 6.0P B (V J )V

0.650.650.65P T (XTI)222M

0.5

Applications Information

Introduction —Product Selection

Agilent ’s family of Schottky

products provides unique solu-tions to many design problems.The first step in choosing the right product is to select the diode type.All of the products in the

HSMS-282x family use the same diode chip, and the same is true of the HSMS-281x and HSMS-280x families. Each family has a different set of characteristics which can be compared most easily by consulting the SPICE parameters in Table 1.

A review of these data shows that the HSMS-280x family has the highest breakdown voltage, but at the expense of a high value of series resistance (R s ). In applica-tions which do not require high voltage the HSMS-282x family,with a lower value of series

resistance, will offer higher current carrying capacity and better performance. The HSMS-281x family is a hybrid Schottky (as is the HSMS-280x), offering lower 1/f or flicker noise than the HSMS-282x family.

In general, the HSMS-282x family should be the designer ’s first choice, with the -280x family

reserved for high voltage applica-tions and the HSMS-281x family for low flicker noise applications.

Assembly Instructions

SOT-323 PCB Footprint

A recommended PC

B pad layout for the miniature SOT-323 (SC-70)package is shown in Figure 6(dimensions are in inches). This layout provides ample allowance for package placement by auto-mated assembly equipment without adding parasitics that could impair the performance.

Figure 6. PCB Pad Layout (dimensions in inches).

Assembly Instructions

SOT-363 PCB Footprint

A recommended PC

B pad layout for the miniature SOT-363 (SC-70,6 lead) package is shown in Figure 7 (dimensions are in inches). This layout provides ample allowance for package

placement by automated assembly equipment without adding

parasitics that could impair the performance.

Figure 7. PCB Pad Layout (dimensions in inches).

TIME (seconds)

T E M P E R A T U R E (°C )

050100

150

200250

120

180

240

300

Figure 8. Surface Mount Assembly Profile.

SMT Assembly

Reliable assembly of surface mount components is a complex process that involves many

material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.)

circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal

conductivity and thermal mass of components. Components with a low mass, such as the SOT

package, will reach solder reflow temperatures faster than those with a greater mass.

Agilent ’s SOT diodes have been qualified to the time-temperature profile shown in Figure 8. This profile is representative of an IR reflow type of surface mount assembly process.

These parameters are typical for a surface mount assembly process for Agilent diodes. As a general guideline, the circuit board and components should be exposed only to the minimum tempera-tures and times necessary to achieve a uniform reflow of solder.

After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste)passes through one or more

preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporat-ing solvents from the solder paste.The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder.The rates of change of tempera-ture for the ramp-up and cool-down zones are chosen to be low enough to not cause deformation of the board or damage to compo-nents due to thermal shock. The maximum temperature in the reflow zone (T MAX ) should not exceed 235°C.

Part Number Ordering Information

No. of Part Number Devices Container HSMS-281x-TR2*1000013" Reel HSMS-281x-TR1*30007" Reel HSMS-281x-BLK *

100

antistatic bag

x = 0, 2, 3, 4, 5, 7, 8, B, C, E, F, K, L

For lead-free option, the part number will have the character "G" at the end, eg. HSMS-281x-TR2G for a 10,000 lead-free reel.

Package Dimensions

Outline 23 (SOT-23)

Outline 143 (SOT-143)

SIDE VIEW

END VIEW

DIMENSIONS ARE IN MILLIMETERS (INCHES)

PACKAGE MARKING CODE (XX)

Outline SOT-363 (SC-70 6 Lead)

Outline SOT-323 (SC-70 3 Lead)

0.25 (0.010)0.30 (0.012)0.10 (0.004)

0.425 (0.017)

DIMENSIONS ARE IN MILLIMETERS (INCHES)

0.30 (0.012)0.10 (0.004)

0.425 (0.017)

DIMENSIONS ARE IN MILLIMETERS (INCHES)

Device Orientation

USER FEED

For Outline SOT-143

Note: "AB" represents package marking code. "C" represents date code.END VIEW

TOP VIEW For Outlines SOT-23, -323

Note: "AB" represents package marking code. "C" represents date code.

END VIEW

TOP VIEW END VIEW

TOP VIEW Note: "AB" represents package marking code. "C" represents date code.

For Outline SOT-363

Tape Dimensions and Product Orientation

For Outline SOT-23

DESCRIPTION

SYMBOL SIZE (mm)SIZE (INCHES)LENGTH WIDTH DEPTH PITCH

BOTTOM HOLE DIAMETER A 0B 0K 0P D 1 3.15 ± 0.102.77 ± 0.101.22 ± 0.104.00 ± 0.101.00 + 0.050.124 ± 0.0040.109 ± 0.0040.048 ± 0.0040.157 ± 0.0040.039 ± 0.002CAVITY

DIAMETER PITCH POSITION D P 0E 1.50 + 0.104.00 ± 0.101.75 ± 0.100.059 + 0.0040.157 ± 0.0040.069 ± 0.004PERFORATION

WIDTH THICKNESS

W t18.00 + 0.30 – 0.100.229 ± 0.0130.315 + 0.012 – 0.0040.009 ± 0.0005CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION)CAVITY TO PERFORATION (LENGTH DIRECTION)

F P 2

3.50 ± 0.052.00 ± 0.05

0.138 ± 0.0020.079 ± 0.002

DISTANCE BETWEEN CENTERLINE

For Outline SOT-143

DESCRIPTION

SYMBOL SIZE (mm)SIZE (INCHES)LENGTH WIDTH DEPTH PITCH

BOTTOM HOLE DIAMETER A 0B 0K 0P D 1 3.19 ± 0.102.80 ± 0.101.31 ± 0.104.00 ± 0.101.00 + 0.250.126 ± 0.0040.110 ± 0.0040.052 ± 0.0040.157 ± 0.0040.039 + 0.010CAVITY

DIAMETER PITCH POSITION D P 0E 1.50 + 0.104.00 ± 0.101.75 ± 0.100.059 + 0.0040.157 ± 0.0040.069 ± 0.004PERFORATION

WIDTH THICKNESS

W t18.00 + 0.30 – 0.100.254 ± 0.0130.315+ 0.012 – 0.0040.0100 ± 0.0005CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION)CAVITY TO PERFORATION (LENGTH DIRECTION)

F P 2

3.50 ± 0.052.00 ± 0.05

0.138 ± 0.0020.079 ± 0.002

DISTANCE

https://www.wendangku.net/doc/ca4084291.html,/semiconductors

For product information and a complete list of distributors, please go to our web site.For technical assistance call:

Americas/Canada: +1 (800) 235-0312 or (916) 788-6763

Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (65) 6756 2394

India, Australia, New Zealand: (65) 6755 1939Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only)Korea: (65) 6755 1989

Singapore, Malaysia, Vietnam, Thailand, Philippines,Indonesia: (65) 6755 2044Taiwan: (65) 6755 1843

Data subject to change.

Tape Dimensions and Product Orientation

For Outlines SOT-323, -363

(CARRIER TAPE THICKNESS)

(COVER TAPE THICKNESS)

DESCRIPTION

SYMBOL SIZE (mm)SIZE (INCHES)LENGTH WIDTH DEPTH PITCH

BOTTOM HOLE DIAMETER A 0B 0K 0P D 1 2.40 ± 0.102.40 ± 0.101.20 ± 0.104.00 ± 0.101.00 + 0.250.094 ± 0.0040.094 ± 0.0040.047 ± 0.0040.157 ± 0.0040.039 + 0.010CAVITY

DIAMETER PITCH POSITION D P 0E 1.55 ± 0.054.00 ± 0.101.75 ± 0.100.061 ± 0.0020.157 ± 0.0040.069 ± 0.004PERFORATION

WIDTH THICKNESS W t 18.00 ± 0.300.254 ± 0.020.315 ± 0.0120.0100 ± 0.0008CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION)CAVITY TO PERFORATION (LENGTH DIRECTION)

F P 2 3.50 ± 0.052.00 ± 0.050.138 ± 0.0020.079 ± 0.002

DISTANCE

FOR SOT-323 (SC70-3 LEAD)An

8°C MAX FOR SOT-363 (SC70-6 LEAD)

10°C MAX

ANGLE

WIDTH

TAPE THICKNESS C T t 5.4 ± 0.100.062 ± 0.0010.205 ± 0.0040.0025 ± 0.00004COVER TAPE