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BAT74,215;BAT74,235;中文规格书,Datasheet资料

BAT74,215;BAT74,235;中文规格书,Datasheet资料
BAT74,215;BAT74,235;中文规格书,Datasheet资料

1. Product profile

1.1

General description

Planar Schottky barrier double diode with an integrated guard ring for stress protection.

Two electrically isolated Schottky barrier diodes, encapsulated in a small SOT143B Surface-Mounted Device (SMD) plastic package.

1.2Features and benefits

Low forward voltage Guard-ring protected

Small SMD plastic package

1.3Applications

Ultra high-speed switching Voltage clamping Protection circuits

Blocking diodes

1.4Quick reference data

2. Pinning information

BAT74

Schottky barrier double diode

Rev. 03 — 19 April 2010

Product data sheet

Table 1.Quick reference data Symbol Parameter Conditions

Min Typ Max Unit Per diode I F forward current --200mA V R reverse voltage --30V V F

forward voltage

I F =100mA --800

mV

Table 2.Pinning

Pin Description Simplified outline

Graphic symbol

1cathode (diode 1)2cathode (diode 2)3anode (diode 2)4

anode (diode 1)

2

1

3

4

006aaa434

2

3

4

1

3. Ordering information

4. Marking

[1]

* = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China

5. Limiting values

[1]Series connection.

[2]

If both diodes are in forward operation at the same moment, total device current is max. 110mA. If one diode is in reverse operation and the other is in forward operation at the same moment, total device current is max. 200mA.

Table 3.Ordering information

Type number Package Name

Description

Version BAT74

-

plastic surface-mounted package; 4leads

SOT143B

Table 4.Marking codes

Type number

Marking code [1]BAT74

*L4

Table 5.Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit Per diode V R reverse voltage -30V I F forward current -

200mA I FRM repetitive peak forward current

t p ≤1s; δ≤0.5

-300mA I FSM non-repetitive peak forward current

t p <10ms -600mA P tot total power dissipation T amb ≤25°C

-230mW T j junction temperature -125°C T amb ambient temperature ?65+125°C T stg storage temperature ?65+150°C Double diode operation

V R reverse voltage -30V [1]

-60V I F forward current [2]

-110mA I FRM

repetitive peak forward current

t p ≤1s; δ≤0.5

-

200

mA

6. Thermal characteristics

[1]

Refer to SOT143B standard mounting conditions.

7. Characteristics

[1]Temperature coefficient of forward voltage ?0.6%/K.[2]Pulse test: t p =300μs; δ=0.02.

[3]

When switched from I F =10mA to I R =10mA;R L =100Ω; measured at I R =1mA.

Table 6.Thermal characteristics Symbol Parameter

Conditions Min Typ Max Unit R th(j-a)

thermal resistance from

junction to ambient

in free air

[1]

-

-

500

K/W

Table 7.Characteristics

T amb =25°C unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unit Per diode V F

forward voltage

I F =0.1mA --240mV I F =1mA [1]

--320mV I F =10mA --400mV I F =30mA --500mV I F =100mA

-

-800mV I R reverse current V R =25V

[2]

--2μA C d diode capacitance V R =1V; f =1MHz

--10pF t rr

reverse recovery time

[3]

-

-

5

ns

8. Test information

9. Package outline

10. Packing information

Table 8.Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number Package Description Packing quantity

300010000 BAT74SOT143B4mm pitch, 8mm tape and reel-215-235

[1]For further information and the availability of packing methods, see Section14.

11. Soldering

12. Revision history

Table 9.Revision history

Document ID Release date Data sheet status Change notice Supersedes BAT74_320100419Product data sheet-BAT74_2 Modifications:?The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

?Legal texts have been adapted to the new company name where appropriate.

?Section 1.1 “General description”: amended

?Table 1 “Quick reference data”: added

?Section 4 “Marking”: updated

?Section 8 “Test information”: added

?Figure5: enhanced

?Figure6: superseded by minimized package outline drawing

?Section 10 “Packing information”: added

?Section 11 “Soldering”: added

?Section 13 “Legal information”: updated

BAT74_220010905Product specification-BAT74_1

BAT74_119960319Product specification--

13. Legal information

13.1 Data sheet status

[1]Please consult the most recently issued document before initiating or completing a design.

[2]The term ‘short data sheet’ is explained in section “Definitions”.

[3]The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL https://www.wendangku.net/doc/c47546040.html,.

13.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

13.3 Disclaimers

Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at https://www.wendangku.net/doc/c47546040.html,/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

Document status[1][2]Product status[3]Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

14. Contact information

For more information, please visit: https://www.wendangku.net/doc/c47546040.html,

For sales office addresses, please send an email to: salesaddresses@https://www.wendangku.net/doc/c47546040.html,

15. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5

9 Package outline. . . . . . . . . . . . . . . . . . . . . . . . . 5

10 Packing information . . . . . . . . . . . . . . . . . . . . . 5

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

14 Contact information. . . . . . . . . . . . . . . . . . . . . . 9

15 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

? NXP B.V.2010.All rights reserved.

For more information, please visit: https://www.wendangku.net/doc/c47546040.html,

For sales office addresses, please send an email to: salesaddresses@https://www.wendangku.net/doc/c47546040.html,

分销商库存信息:

NXP

BAT74,215BAT74,235

厚声电阻规格书

Contents Introduction ………………………………………………………………………………………Page 1.0 Scope (4) 2.0 Ratings & Dimension ………………………………………………………….…………....4~5 3.0 Structure.................................... (5) 4.0 Marking…….…………………………………… ………………………. ..… …………… 6~7 5.0 Derating Curve................................................... .. (8) 6.0 Performance Specification …………………………………………….……………..........8~9 7.0 Explanation of Part No. System ………………………………….…………………………9~10 8.0 Ordering Procedure (10) 9.0 Standard Packing ………………………………………………….…………………………11~12 10.0 Note Matter.................................................................. . (12)

File Name: CHIP SERIES ±0.5%,±1%,±2%,±5%& 0ΩDate 2013.12.20 Edition No. 1 Amendment Record Signature Edition Prescription of amendment Amend Page Amend Date Amended by Checked by

厚生电阻规格书 兴泰隆

Contents Introduction ………………………………………………………………………………………Page 1.0 Scope (4) 2.0 Ratings & Dimension ………………………………………………………….…………....4~5 3.0 Structure (5) 4.0 Marking…….……………………………………… ………………………..… …………..…6~7 5.0 Derating Curve................................................ .. (8) 6.0 Performance Specification …………………………………………………………..............8~9 7.0 Explanation of Part No. System (10) 8.0 Ordering Procedure (11) 9.0 Packing ………………….…………………………………………………………………..…11~13 10.0 Note Matter (14)

File Name: CHIP SERIES ±0.5%,±1%,±2%,±5%& 0ΩDate 2015.02.04 Edition No. 1 Amendment Record Signature Edition Prescription of amendment Amend Page Amend Date Amended by Checked by

This specification for approve relates to the Lead-Free Thick Film Chip Resistors manufactured by ROYALOHM. 2.0 Ratings & Dimension: 01005、0201、0402 0603、0805、1206、1210、1812、2010、2512 2.1 Dimension & Resistance Range : Type 70℃ Power Dimension(mm) Resistance Range L W H A B 0.5% 1.0% 2.0% 5.0% 01005 1/32W 0.40±0.02 0.20±0.02 0.13±0.02 0.10±0.050.10±0.03-- 10Ω-10M Ω 10Ω-10M Ω10Ω-10M Ω 0201 1/20W 0.60±0.03 0.30±0.03 0.23±0.03 0.10±0.050.15±0.05-- 1Ω-10M Ω 1Ω-10M Ω1Ω-10M Ω 0402 1/16W 1.00±0.10 0.50±0.05 0.35±0.05 0.20±0.100.25±0.101Ω-10M Ω0.1Ω~22M Ω 0.1Ω~22M Ω0.1Ω~22M Ω 0603 1/16W 1/10WS 1.60±0.10 +0.15 0.80 -0.10 0.45±0.10 0.30±0.20 0.30±0.20 1Ω-10M Ω 0.1Ω~33M Ω 0.1Ω~33M Ω 0.1Ω~100M Ω 0805 1/10W 1/8WS 2.00±0.15 +0.15 1.25 -0.10 0.55±0.10 0.40±0.200.40±0.201Ω-10M Ω0.1Ω~33M Ω 0.1Ω~33M Ω0.1Ω~100M Ω 1206 1/8W 1/4WS 3.10±0.15 +0.15 1.55 -0.10 0.55±0.10 0.45±0.200.45±0.201Ω-10M Ω0.1Ω~33M Ω 0.1Ω~33M Ω0.1Ω~100M Ω 1210 1/4W 1/3WS 1/2WSS 3.10±0.10 2.60±0.20 0.55±0.10 0.50±0.250.50±0.201Ω-10M Ω0.1Ω~10M Ω 0.1Ω~22M Ω0.1Ω~100M Ω 1812 1/2W 3/4WS 4.50±0.20 3.20±0.20 0.55±0.20 0.50±0.200.50±0.201Ω-10M Ω0.1Ω-10M Ω 0.1Ω-10M Ω0.1Ω-10M Ω 2010 1/2W 3/4WS 5.00±0.10 2.50±0.20 0.55±0.10 0.60±0.250.50±0.201Ω-10M Ω0.1Ω~22M Ω 0.1Ω~22M Ω0.1Ω~22M Ω 2512 1W 6.35±0.10 3.20±0.20 0.55±0.10 0.60±0.250.50±0.201Ω-10M Ω0.1Ω~33M Ω 0.1Ω~33M Ω0.1Ω~33M Ω

高分子湿敏电阻规格书

DHR01-3035型 高分子高分子湿敏电阻湿敏电阻湿敏电阻规格规格规格说明说明说明书书 一、原理 阻抗型高分子湿度传感器(湿敏电阻), 采用功能高分子膜涂敷在带有导电电极陶瓷衬底上,形成阻抗随相对湿度变化成对数变化的敏感部件,导电机理为水分子的存在影响高分子膜内部导电离子的迁移率。 二、应用 适合电气电力设备、仪器仪表、除湿加湿设备、电子温湿表、制冷、干燥、气象等需湿度测量的场所。 三、特性 高精度,高可靠,高耐水性,高、低湿适应性; 稳定,低漂移,反应快速。 四、电气规格 工作电压 1V AC(50Hz ~ 2 K Hz) 检测范围 20%~ 95% RH 检测精度 ±5% 储存温度 -20℃~﹢60℃ 95%RH 以下(无结露) 工作温度范围 -20℃~﹢80℃ 95%RH 以下(无结露) 特征阻抗 30 KΩ (60%RH, 25℃) 响应时间 ≤12 s (20%~ 90%) 湿度飘移(/年) ≤±2% RH 湿滞 ≤ 1.5% RH 五、外型尺寸及内部结构示意图如下:

六、型号命名 D HR HR 010101 —— XXXX XXXX 公司代号公司代号 湿敏电阻湿敏电阻湿敏电阻 编号编号编号 阻值阻值阻值((30-35KΩ) ) 备注: 1、标称阻值是指在温度为25℃,相对湿度为60%RH 下所测量阻抗值 2、本规格书所有参数均由LCR 数字电桥在(1K Hz,1V)下所测阻抗 3、基本参数:温度为25℃下,特征阻抗值 (单位:KΩ) 型号 湿度rh 30% 40% 50% 60% 70% 80% 90% DHR01-3035 阻值KΩ 352.8 166.6 60.6 29.9 15.4 9.13 4.6 4、各温度下,不同湿度/阻抗数据表 见表1 5、各温度下,不同湿度/阻抗3D 图 见图3 七、可靠性测试: 1、热测试:放置在50℃,30%RH 环境1000小时后,在通常环境下1小时后,阻抗变化不超过初始值对应湿度的±5%RH; 2、冷测试:放置在-10℃环境1000小时后,在通常环境下1小时后,阻抗变化不超过初始值对应湿度的±5%RH。 八、应用电路建议 1、如使用模拟电路,建议将湿度信号变为电压信号输出,请向厂家索取; 2、可采用555时基或RC 振荡电路,将湿度传感器等效为阻抗值,测量振荡频率输出,振荡频率在1K Hz 左右,(在60%RH,25℃)(建议串联电容采用温度系数低,精度在±5% J 级有机聚合物电容,例如涤纶或聚丙烯类电容); 3、对于采用单片机电路采集信号,可参考厂家提供的《湿度传感器单片机应用指南》 。 九、引用标准 GB/T15768-95 电容式湿敏元件及湿度传感器总规范; SJ/T10431-93 湿敏元件用湿度发生器和湿度测试方法; SJ20760-99 高分子湿度传感器总规范。 十、注意事项 1.不要对元件使用直流电源,检测时请使用电桥阻抗(LCR)测试设备; 2.避免硬物或手指直接接触元件表面,以免划伤或污染感湿膜; 3.焊接时温度不能过高(<180℃,2S 膜表面),使用低温烙铁或用镊子保护; 4.尽量避免在以下环境中直接使用: 盐雾,腐蚀性气体:强酸(硫酸,盐酸),强碱,有机溶剂(酒精,丙酮)等; 5.推荐储存条件:温度:10℃~40℃ 湿度:20%RH --60%RH 。

厚生电阻规格书

Page 4 ? Small size and lightweight ? Suitable for both flow and reflow soldering ? Reduction of assembly costs and matching with placement machines 2007 - 2008 Standard: 2%, 5%, 10%---E 24 series 1%---E 96 series

2007 - 2008 Page 5

Marking on the Resistors Body: ?For 0402 size, no marking on the body due to the small size of the resistor. ?±5% tolerance product. (Including resistance values less than 1?; both 1% and 5%) The marking is 3 digits, the first 2 digits are the significant figures of the resistance and the 3rd digit denotes number of zeros. 153 = 15000? = 15K?; 120 = 12? Below 10? shown as this: 6R8 = 6.8? 0.1?~0.99? shown as this: R33 = 0.33? ?±1% tolerance marking of case size 0805 and bigger is 4 digits, the first 3 digits are the significant figures of the resistance and the 4th digit denotes number of zeros. 2372 = 23700? = 23.7K?; 1430 = 143? Below 10? shown as this: 3R24 = 3.24?0.1?~0.99? shown as this: R33 = 0.33? Page 6 2007 - 2008

国巨电阻规格书

Approval Sheet for Thick Film Chip Resistor RL series 1% 2% 5% YAGEO CORPORATION Factory: No.11, Min Chuan Rd., Ta Sheh, Kaohsiung, Taiwan, R.O.C. Tel: 886-7-351-4117 Fax: 886-7-352-6475 Headquarters: 3F, No.233-1, Pao Chiao Rd., Hsin Tien, Taipei, Taiwan, R.O.C. Tel: 886-2-2917-7555 Fax: 886-2-2917-4286 https://www.wendangku.net/doc/c47546040.html, RL Series Version 2000-3 Page-1

RL Series Version 2000-3 Page-2 1. SUBJECT : This specification describes of RL series chip resistors made of YAGEO Corporation by thick film process. 2. PART NUMBER : Part number of the chip resistor is identified by the series, size, tolerance, packing style, temperature coefficient, special type and resistance value. Example : RL 1206 F R - 07 0R02 Series Size Resistance Packing Temperature Special Resistance Name Code Tolerance Style Coefficient Type Value of Resistance (1) Size : (unit: inches) 0603=0.063×0.033 1210=0.122×0.102 0805=0.083×0.051 2010=0.197×0.098 1206=0.122×0.063 2512=0.250×0.126 (2) Tolerance : F=±1%, G=±2%, J=±5% (3) Packaging Style : R =Paper Taping Reel. K =Embossed Plastic Tape Reel. C =Bulk Cassette. (4) T .C .R.: “-“Base on Spec. (5) Special Type : 07= 7 inch Dia. Reel 10=10 inch Dia. Reel 13=13 inch Dia. Reel (6) Resistance Value : 10m ?、20 m ?、51 m ?、100 m ?、330 m ?、470 m ?…… (7) Resistance Series : E24 (E48/96 on request)

厚生电阻规格书

RoHS Compliant Type 02010402060308051206121020102512 Max. Working Voltage 25V 50V 50V 150V 200V 200V 200V 200V Max. Overload Voltage 50V 100V 100V 300V 400V 400V 400V 400V Dielectric withstanding Voltage - 100V 300V 500V 500V 500V 500V 500V Operating Temperature -55~+155°C -55~+155°C -55~+155°C -55~+155°C -55~+155°C -55~+155°C -55~+155°C -55~+ 155°C Type 02010402060308051206121020102512Power Rating at 70°C 1/20W 1/16W 1/16W (1/10W-S)1/10W (1/8W-S)1/8W (1/4W-S)1/4W (1/3W-S) *1/2W (3/4W-S)1W L (mm)0.60 ± 0.03 1.00 ± 0.10 1.60 ± 0.10 2.00 ± 0.15 3.10 ± 0.15 3.10 ± 0.10 5.00 ± 0.10 6.35 ± 0.10W (mm) 0.30 ± 0.030.50 ± 0.050.80 +0.15 -0.10 1.25 +0.15 -0.10 1.55 +0.15 -0.10 2.60 +0.15 -0.10 2.50 +0.15 -0.10 3.20 +0.15 -0.10 Dimension H (mm)0.23 ± 0.030.35 ± 0.050.45 ± 0.100.55 ± 0.100.55 ± 0.100.55 ± 0.100.55 ± 0.100.55 ± 0.10A (mm)0.10 ± 0.050.20 ± 0.100.30 ± 0.200.40 ± 0.200.45 ± 0.200.50 ± 0.250.60 ± 0.250.60 ± 0.25B (mm) 0.15 ± 0.050.25 ± 0.100.30 ± 0.200.40 ± 0.200.45 ± 0.200.50 ± 0.200.50 ± 0.200.50 ± 0.20Resistance Value of Jumper <50m?<50m?<50m?<50m?<50m?<50m?<50m?<50m?Rated Current of Jumper 0.5A 1A 1A 2A 2A 2A 2A 2A Max. Current of Jumper 1A 2A 2A 5A 10A 10A 10A 10A Resistance Range of 0.5% (E-96)10? ~ 1M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?Resistance Range of 1% (E-96)10? ~ 1M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?Resistance Range of 2% (E-24)10? ~ 1M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?1? ~ 10M?Resistance Range of 5% (E-24) 1? ~ 1M? 1? ~ 10M? 1? ~ 10M? 1? ~ 10M? 1? ~ 10M? 1? ~ 10M? 1? ~ 10M? 1? ~ 10M? * 1210 size in 1/2W could be provided specially (1210U2) ? Small size & light weight ? Reduction of assembly costs and matching with placement machine ? Suitable for both flow & re-flow soldering ? Applications: Navigator (GPS), Mobile Phone,Telecom, PDA, Setbox, Meter. Feature Figures Derating Curve & Specification Thick Film Chip Resistors P e r c e n t r a t e d l o a d (%) Ambient termperature(°C ) 2 UniOhm

厚声贴片电阻规格书

RESISTORS SHALL HAVE A RATED DIRECT-CURRENT (DC) CONTINUOUS WORKING VOLTAGE OR AN APPROXIMATE SINE-WAVE ROOT-MEAN-SQUARE (RMS)

TYPE L W H l1 1.00±0.10 0.50±0.05 0.35±0.05 0.20±0.10 0.25 1.60±0.10 + 0.15 0.80 0.45±0.10 0.30±0.20 0.30 STRUCTURE: 1: HIGH PURITY ALUMINA SUBSTRATE 0.3±0.1%CaO、1.0±0.3%MgO、2.1±0.05%SiO2)

33000 2700

: 1.96K?=196×10?------29B 12.4?=124×10?-----10X STANDARD E-96 VALUES AND 0603 RESISTANCE CODE

CHARACTERISTIC LIMITS TEST METHOD (JIS-C-5201) 4.19 RESISTANCE CHANGE AFTER CONTINUOUS FIVE CYCLES FOR DUTY CYCLE SPECIFIED BELOW: STEP TEMPERATURE TIME ±0.5% ±1% ±(0.5%+0.05 ?)MAX 1 -55℃±3℃ 30 MINS 2 ROOM TEMP . 10 --- 15 MINS 3 +155℃±2℃ 30 MINS TEMPERATURE CYCLING ±2% ±5% ±(1.0%+0.05 ?) MAX. 4 ROOM TEMP . 10 --- 15 MINS 95% COVERAGE MIN. WAVE SOLDER: TEST TEMPERATURE OF SOLDER: 245℃±3℃ DIPPING TIME IN SOLDER: 2-3 SECONDS. SOLDERABILITY GO UP TIN RATE BIGGER THAN HALF OF END POLE REFLOW: ±0.5% ±1% ±(0.5%+0.1?) MAX. HUMIDITY ( STEADY STATE ) ±2% ±5% ±(3.0%+0.1?) MAX. 4.24 TEMPORARY RESISTANCE CHANGE AFTER 240 HOURS EXPOSURE IN A HUMIDITY TEST CHAMBER CONTROLLED AT 40±2℃ AND 90-95% RELATIVE HUMIDITY , RESISTANCE CHANGE RATE IS: ±0.5% ±1% ±(1%+0.1?)MAX. LOAD LIFE IN HUMIDITY ±2% ±5% ±(3%+0.1?)MAX. 7.9 RESISTANCE CHANGE AFTER 1,000 HOURS (1.5 HOURS “ON”,0.5 HOUR “OFF”) AT RCWV IN A HUMIDITY CHAMBER CONTROLLED AT 40℃±2℃ AND 90 TO 95% RELATIVE HUMIDITY . RESISTANCE CHANGE RATE IS: ±0.5% ±1% ±(1%+0.1?)MAX. LOAD LIFE ±2% ±5% ±(3%+0.1?)MAX. 4.2 5.1 PERMANENT RESISTANCE CHANGE AFTER 1,000 HOURS OPERATING AT RCWV WITH DUTY CYCLE 1.5 HOURS “ON”, 0.5 HOUR “OFF” AT 70℃±2℃ AMBIENT. RESISTANCE TO DISSOLUTION OF METALLIZATION TEST INSPECT FOR ANY DISSOLUTION OF METALLIZATION ON COMPONENT ELECTRODES WITH MAGNIFIER OF ABOUT 20-30 MAGNIFICATION TEST CONDITION: SOLDER TEMPERATURE 260±3IMMERSION ℃℃TIME 30±1 SECOND IMMERSION DEPTH 2.0-2.5MM

插件国巨电阻规格书

Page-1 Approval Sheet for Carbon Film Resistors CFR series ±2% & ±5% YAGEO CORPORATION Headquarters: 3F, No.233-1, Pao Chiao Rd., Shin Tien, Taipei, Taiwan, R.O.C. Tel: 886-2-2917-7555 Fax: 886-2-2917-4286 URL: https://www.wendangku.net/doc/c47546040.html,

Page-2

Page-3 1. PRODUCT : CARBON FILM RESISTORS (Normal & Miniature Style) 2. PART NUMBER : Part number of the carbon film resistor is identified by the name, power, tolerance, packing, temperature coefficient, special type and resistance value. Example : CFR -12 J T J 52 100R Series Size Resistance Packing Temperature Special Resistance Name Code Tolerance Style Coefficient Type Value of Resistance (1) Style: CFR SERIES (2) Power Rating: -12=1/6W 、25S=1/4WS 、-25=1/4W 、50S=1/2WS 、-50=1/2W 、 1WS=1WS 、100=1W 、2WS=2WS 、200=2W (3) Tolerance: G=±2% J=±5% (4) Packaging Type : R =Paper Taping Reel T =Tape on Box Packing B =Bulk Packing (5) T .C .R : J=±350ppm/℃ — =lgnore (6) Special Type : 26=26mm 、52=52.4mm 、73=73mm 、 PN =PANAsert AV =AVlsert (7) Resistance Value: 1R 、10R 、100R 、10K 、100K 、330K 、1M………

贴片电阻规格书

贴片电阻规格书(0201 0402 0603 0805 1206 1210 1812 2010 2512 PADS 9.3 的功能亮点,主要亮点如下: 1)DxDesigner 和Symbol Editor 已经完全支持公制单位的设计和符号创建。 2)PADS ES suite 增加了DxDataBook 功能。 3)PADS Logic, Layout, Router 新增PADS Archiver 项目归档功能。 4)PADS Logic 完全开放智能PDF功能,不需额外购买。 5)PADS Layout 新增Update from Library。 6)PADS Decal Wizard (封装向导)功能加强,更准确高效的建立各种封装。 7)PADS Layout 输出智能PDF 文档,可查看各种属性。 8)新增Net Bridging 功能。 9 ) 支持单面板设计的检查. 10)新增ODB++, IPC-D-356, Flat DXF 等….输出或输入接口。 11) Layout 的Verify Design 可显示错误的实际间距。 12) Decal Wizard增强了创建热焊盘的能力,并能够基于IPC-7351A 标准创建合适的封装,大大提高准确性和省时间。 13) 新增及加强的差分线和蛇形功能(包括蛇形线禁止区,支持弧形等),大大提高布线效率。 14) 新增Modeless Commands(显示,定原点,转换单位等....),方便省时,使工作更便利方便省时,使工作。 15) PADS Layout 已可设定显示网络和管脚名称。 16) PADS Router 能使用Miters 作自动布线,使自动布线后不需再大量修改90度线。 17) 基本功能强化包括ECO 对比,DFF检查,过孔矩阵,检查优化,针对RF 设计优化, 单面板的DRC 校验,灌铜可覆盖组件焊盘和自定义热焊盘等… 18) 3D 浏览器 19) PADS Layout 支持visECAD 和CAMCAD Professional 流程 20) 新增ECAD/MCAD Collaborator,使协作处理底板外框及禁区设定等更便利 21) Dxdesginer 强化包括, Navigator: 单击, Navigator: 拖拉页面, 传播层次化的属性, Ripped Net Spacing, 动态排列空间调整等等……. 22) PADS Layout/Logic/Dxdesigner 分别已能读入不同的CAD 文件,包括Expedition,Portel,P-CAD,CADSTAR,Orcad 破解方法,9.2的破解与安装与9.0一致: Mentor Graphics PADS9 运行Crack\MentorKG.exe,生成LICENSE.TXT。 附: WIN2000,winXP中环境变量的使用。 “我的电脑”,“属性”,“高级”,“环境变量” 系统变量 PowerPCB 变量名:MGLS_LICENSE_FILE: K! T1 u. E) 变量值:D:\PADS2007\Crack\LICENSE.TXT 请把路径设置对,如果安装有pads2007,就不需要设置。 拷贝MGLS.DLL至

厚生电阻规格书(新)_140523

Prepared

Contents Introduction ………………………………………………………………………………………Page 1.0 Scope (4) 2.0 Ratings & Dimension ………………………………………………………….…………....4~5 3.0 Structure.................................... (5) 4.0 Marking…….…………………………………… ………………………. ..… …………… 6~7 5.0 Derating Curve................................................... .. (8) 6.0 Performance Specification …………………………………………….……………..........8~9 7.0 Explanation of Part No. System ………………………………….…………………………9~10 8.0 Ordering Procedure (10) 9.0 Standard Packing ………………………………………………….…………………………11~12 10.0 Note Matter.................................................................. . (12)

File Name: CHIP SERIES ±0.5%,±1%,±2%,±5%& 0ΩDate 2014.05.23 Edition No. 1 Amendment Record Signature Edition Prescription of amendment Amend Page Amend Date Amended by Checked by

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