NSSB100B中文资料
No. STSE-CC5037A
SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED
MODEL : NSSB100BT
NICHIA CORPORATION
Nichia STSE-CC5037A
1.SPECIFICATIONS
(1) Absolute Maximum Ratings (Ta=25°C)
Item Symbol Absolute Maximum Rating Unit
Forward Current I F 30 mA Pulse Forward Current I FP 100 mA Reverse Voltage V R 5 V Power Dissipation P D 120 mW Operating Temperature T opr -30 ~ + 85 °C Storage Temperature T stg -40 ~ +100 °C Soldering Temperature T sld Reflow Soldering : 260°C for 10sec.
Hand Soldering : 350°C for 3sec.
I FP Conditions : Pulse Width 10msec. and Duty 1/10
(2) Initial Electrical/Optical Characteristics (Ta=25°C)
Item Symbol Condition Typ. Max. Unit
Forward Voltage V F I F =20[mA](3.6) 4.0 V Reverse Current I R V R = 5[V] - 50 μA Luminous Intensity Iv I F =20[mA](212) - mcd
x - I F =20[mA]0.133 - -
Chromaticity Coordinate
y - I F =20[mA]0.075 - -
Please refer to CIE 1931 chromaticity diagram.
(3) Ranking
(Ta=25°C)
Item Symbol
Condition Min. Max. Unit Rank V Iv
I F =20[mA]250 356 mcd Rank U Iv
I F =20[mA]178 250 mcd Luminous Intensity Rank T Iv
I F =20[mA]124 178 mcd
Luminous Intensity Measurement allowance is ± 10%.
Color Rank (I F =20mA,Ta=25°C)
Rank W x 0.11 0.11 0.15 0.15 y 0.04 0.10 0.10 0.04
Color Coordinates Measurement allowance is ± 0.01.
One delivery will include up to one color rank and three luminous intensity ranks of the products.
The quantity-ratio of the ranks is decided by Nichia.
2.TYPICAL INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
<= <=
Nichia STSE-CC5037A
Please refer to figure’s page.
Material as follows ; Package : Ceramics
Encapsulating Resin : Silicone Resin
Electrodes : Au Plating
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to figure’s page.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
- U
- Year ( 4 for 2004, 5 for 2005 )
- Month ( 1 for Jan., 9 for Sep., A for Oct., B for Nov. )
- Nichia's Product Number
U - Ranking by Color Coordinates
- Ranking by Luminous Intensity
Nichia STSE-CC5037A
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Standard Test Method
Test Conditions
Note Number of Damaged Resistance to Soldering Heat (Reflow Soldering) JEITA ED-4701
300 301
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
2 times
0/50
Solderability
(Reflow Soldering) JEITA ED-4701300 303 Tsld=215 ± 5°C, 3sec.
(Lead Solder) 1 time over 95% 0/50 Thermal Shock
JEITA ED-4701300 307 0°C ~ 100°C 15sec. 15sec.
20 cycles 0/50
Temperature Cycle
JEITA ED-4701100 105 -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min.
100 cycles 0/50
Moisture Resistance Cyclic JEITA ED-4701200 203 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle 10 cycles 0/50 High Temperature Storage JEITA ED-4701200 201
Ta=100°C 1000 hrs. 0/50
Temperature Humidity Storage
JEITA ED-4701100 103 Ta=60°C, RH=90% 1000 hrs. 0/50
Low Temperature Storage JEITA ED-4701200 202
Ta=-40°C 1000 hrs. 0/50
Steady State Operating Life Condition 1
Ta =25°C, I F =
20mA 1000 hrs. 0/50
Steady State Operating Life Condition 2
Ta =25°C, I F =30mA 1000 hrs. 0/50
Steady State Operating Life of High Temperature
Ta =85°C, I F =
7.5mA 1000 hrs. 0/50 Steady State Operating Life of High Humidity Heat
60°C, RH=90%, I F =20mA 500 hrs. 0/50
Steady State Operating Life of Low Temperature Ta =
-30°C, I F =20mA 1000 hrs. 0/50
Vibration
JEITA ED-4701400 403 100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s 2 3direction, 4cycles 48min. 0/50
Substrate Bending
JEITA ED-4702 3mm, 5 ± 1 sec. 1 time 0/50 Stick
JEITA ED-4702
5N, 10 ± 1 sec.
1 time
0/50
(2) CRITERIA FOR JUDGING THE DAMAGE
Criteria for Judgement
Item Symbol Test Conditions
Min. Max.
Forward Voltage V F I F =
20mA - U.S.L.*) 1.1 Reverse Current I R V R =5V - U.S.L.*) 2.0 Luminous Intensity I V I F =20mA L.S.L.**) 0.7 - *) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level
Nichia STSE-CC5037A-1
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag. A package of
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a
year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package. If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent
material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag
and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65 ± 5°C
· Nichia LED electrode sections are comprised of a gold plated. The gold surface may be
affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Heat Generation
· Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
120sec.Max.Pre-heating 260°C Max.10sec. Max. 60sec.Max. Above 220°C 1 ~ 5°C / sec. 1 ~ 5°C / sec. 180 ~ 200°C <1 : Lead Solder> <2 : Lead-free Solder> Pre-heating
240°C Max.
10sec. Max. 60sec.Max. Above 200°C
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec. 120 ~ 150°C 120sec.Max.
Nichia STSE-CC5037A
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. · Recommended soldering conditions
Reflow Soldering
Hand Soldering
Lead Solder Lead-free Solder Pre-heat Pre-heat time Peak temperature Soldering time Condition 120 ~ 150°C 120 sec. Max. 240°C Max. 10 sec. Max. refer to Temperature - profile 1. 180 ~ 200°C 120 sec. Max. 260°C Max. 10 sec. Max. refer to Temperature - profile 2.(N 2 reflow is recommended.)
Temperature Soldering time 350°C Max. 3 sec. Max. (one time only)
After reflow soldering rapid cooling should be avoided.
[Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure.
[Recommended soldering pad design] Use the following conditions shown in the figure.
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method.
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. · Reflow soldering should not be done more than two times. · When soldering, do not put stress on the LEDs during heating. · After soldering, do not warp the circuit board.
(5) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
2.2
1.5 4.4
(Unit : mm)
Nichia STSE-CC5037A-1
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded.
It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs. · When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not. It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). · Damaged LEDs will show some unusual characteristics such as the leak current remarkably
increases, the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria : (V F> 2.0V at I F=0.5mA)
(7) Others
· NSSB100B complies with RoHS Directive.
· Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating
when using the LEDs with matrix drive.
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice.
N ichia STSE-CC5037A
?Color Coordinates Measurement allowance is ± 0.01.
N ichia ST -8- N ichia ST SE -C C 5037A -9- Nichia STSE-CC5037A Nichia STSE-CC5037A -11- 元器件交易网https://www.wendangku.net/doc/cf8702176.html, Nichia STSE-CC5037A-1