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IEEE Transactions on Dielectrics and Electrical Insulation 论文模板(TDEI Template)

IEEE Transactions on Dielectrics and Electrical Insulation 论文模板(TDEI Template)
IEEE Transactions on Dielectrics and Electrical Insulation 论文模板(TDEI Template)

Preparation of Papers for Publication

in IEEE Transactions on Dielectrics and Electrical Insulation

Author(s) Same Address

Sheridan Printing Co.

1425 Third Avenue

Alpha, NJ 08865, USA

and Other Author(s)

University of Knowledge

Department of Fun

City of Leisure, PA 18045, USA

ABSTRACT

These instructions give you guidelines for preparing papers for the IEEE

T RANSACTIONS ON D IELECTRICS AND E LECTRICAL I NSULATION. Use this document as a

template with Microsoft Word 6.0 or later. Define all symbols used in the abstract. Do

not cite references in the abstract. The abstract body copy should be in Times or Times

New Roman, 10 pt. Bold.

Index Terms —Instructions,guidelines, abstract, copy. A list of accepted

IEEE/TDEI index terms are available on the submission page.

1 INTRODUCTION

T HIS document is a template for Microsoft Word versions 6.0

or later. If you are reading a paper or PDF version of this

document, please download the electronic template from https://www.wendangku.net/doc/d311885992.html,/ieeetdei/TDEI%20Template.doc

to prepare your manuscript.

The objective of this document is to provide a template for the

preparation of a paper for publication in the IEEE T RANSACTIONS ON D IELECTRICS AND E LECTRICAL I NSULATION. The use of this template will ensure the professional appearance of your paper as

well as providing a uniform digital source from which to satisfy the

electronic publication requirements of IEEE Xplore.

When you open this document, select “Page Layout” or “Print Layout” from the “View” menu in the menu bar, which allows you to see the footnotes. Then type over sections of this document or cut from another document and paste and then use markup styles. The pull-down style menu is at the left of the Formatting Toolbar at the top of your Word window (for example, the style at this point in the document is “Text”). Highlight a section that you want to designate with a certain style, then select the appropriate name on the style menu. The style will adjust your fonts and line spacing. Do not change the font sizes or line spacing to squeeze more text into a limited number of pages.

Use italics for emphasis; do not underline. Turn off “smart quotes” (Tools | AutoCorrect | AutoFormat tabs). Turn off automatic hyphenation (Tools | Language | Hyphenation).

To insert images in Word,position the cursor at the insertion point and either use Insert | Picture | From File or copy the image to the Windows clipboard and then Edit | Paste Special | Picture (wit h “Float over text” unchecked).

2 PROCEDURE FOR PAPER SUBMISSION This section covers the details regarding preparation of your manuscript for submission, the submission procedure, review process and copyright information.

2.1 PREPARATION OF MANUSCRIPT

In the interest of speed and economy, the IEEE T RANSACTIONS ON D IELECTRICS AND E LECTRICAL I NSULATION is printed directly from this electronic template as furnished by the author after a thorough peer review. Since the final printed pages are based on the submitted copy, we urge that utmost care be taken in the preparation utilizing this electronic template. For your information, page size is 8.5x11 inches and column width is 3.5 inches (8.9 mm) and column length 9.2 inches (23.4 cm). All figures and tables should have adequate titles or captions, and must be integrally placed at their proper location(s) in the text. For the benefit of the readers, the figures, tables, graphs and photos should be placed near the corresponding text; that is, not accumulated at the end of the text or at the end of the manuscript. Further information on Figures and Tables can be found in Section 6.1.

Due care should be exercised to avoid the use of abbreviations and phrases which may not be familiar to all readers. Readers of the IEEE T RANSACTIONS ON D IELECTRICS

Manuscript received on X Month 2005, in final form XX Month 2005.

AND E LECTRICAL I NSULATION have wide and diverse backgrounds and may not be employed in the specific area of any given paper, but are still interested in following the state-of-the-art. All abbreviations and phrases need to be suitably defined in the text.

The length of technical papers, in general, is preferred to be not more than 8 pages (including all figures and biographies). Review type papers may be longer. This requirement is unfortunately dictated by financial constraints.

The efforts of the persons who otherwise provided help to the author(s) should be recognized in the Acknowledgment section at the end of the paper.

For each author, we require a photograph of head and shoulder (24 mm x 30 mm) and a brief technical biography. Begin with the author name followed by IEEE membership grade(s) (e.g. S?91-M?95-SM?00-F?05). Continue with the date and place of birth, educational background, degrees received, year received and universities names and their locations, employment history and special fields of interest.

2.2 SUBMISSION PROCEDURE

The Transactions Editor will need to receive an electronic version of your manuscript. The only acceptable electronic format is Word 6.0 or later (.doc).

Papers must be submitted electronically to the following web site: https://www.wendangku.net/doc/d311885992.html,/ieeetdei.. The web site will require you to enter information about the paper as well as contact information. Upon successful submission of the paper an email confirmation will be sent to the corresponding author acknowledging the receipt of the paper and other information including the name of the Associate/Guest Editor who is handling the review.

If there are questions, the corresponding author may wish to contact:

Professor Reuben Hackam

Editor-in-Chief, IEEE TDEI

725 North Talbot Road

Windsor, Ontario N9G 1M8, Canada

Tel.: 519-966-4748

hackam@uwindsor.ca or r.hackam@https://www.wendangku.net/doc/d311885992.html,

2.3 REVIEW PROCESS

All papers submitted to the IEEE T RANSACTIONS ON D IELECTRICS AND E LECTRICAL I NSULATION are subject to a thorough review process. The Editor-in-Chief is responsible for coordinating the review among members of the Editorial Board and making final decisions on the paper subject to the recommendation of the Associate/Guest Editor handling the paper. Routine inquiries as to the status of the submitted paper within the Review process cannot be accommodated.

2.4 COPYRIGHT

It is the policy of the IEEE to own the copyright to the technical contributions that it publishes on behalf of the interests of the IEEE, its authors, and their employers, and to facilitate the appropriate re-use of this material by others. To comply with the U.S. copyright law, authors are required to sign an IEEE Copyright Form before publication. This form returns to authors, and their employers, full rights to reuse their material for their own purposes. Authors must submit a signed copy of this form with their manuscripts online during the submission of the paper. The form will be generated during the electronic submission process.

3 E DITORIAL P OLICIES

The IEEE Dielectrics and Electrical Insulation Society (DEIS) is responsible for leadership, coordination, and communication among those who are concerned with dielectric phenomena and measurements; with development and characterization of gaseous, liquid, and solid electrical insulating materials and vacuum; and with utilization of these materials in circuits and systems under conditions of use. The Society offers two publications which are relevant to the dissemination of information within its scope: these Transactions on Dielectrics and Electrical Insulation and the Electrical Insulation Magazine. In each publication, every paper is reviewed and evaluated for acceptability in terms of its relevance, its technical contribution, and, for the Transactions on Dielectrics and Electrical Insulation its continuing value as part of the permanent literature.

Reports and articles worth writing deserve skillful presentation. The text must be stylistically and grammatically correct. The facts and ideas need to be expressed clearly, succinctly, and attractively for the average reader; the author should not assume that every reader is an expert in the author?s field. Stimulating and informative communication of scientific and technical knowledge that has continuing value is required. Good style and clarity are courtesies that the author owes to the reader. The purpose of publication is to convey technical information. Good writing ensures that this is accomplished. The author needs not be a member of the IEEE or of the DEIS. All persons active in the field are encouraged to submit papers for consideration, irrespective of professional affiliation.

An essential part of research is open publication of its results. Therefore, it can be argued that a research project should bear part of the publication cost, usually paid in the form of page charges. Nevertheless, the DEIS currently does not levy page charges. All publication costs are paid by the DEIS as a service to its members and the research community. However, if either the figures, tables or other artwork in the manuscript violate the guidelines, or if changes are made on the final proof beyond the original manuscript, the author will be charged appropriate modification costs.

published bimonthly to provide a permanent record of the expanding corpus of scientific and technical knowledge for all IEEE members and others interested in the interdisciplinary field of dielectrics and electrical insulation. It is an archival publication which disseminates the results of fundamental and applied research. This journal is edited to encourage deeper understanding and greater effectiveness in the reporting of facts and theories germane to dielectric behavior and properties of electrical insulating materials and systems. Thoughtfully prepared and carefully documented papers dealing with fundamental concepts of dielectric behavior, with original theoretical and experimental studies, and with reproducible means of evaluating performance of materials and equipment are most appropriate. Tutorial or synoptic papers are encouraged, provided they present a fresh approach and a penetrating analysis of an established subject in the field of dielectrics or electrical insulation.

Conclusions must be supported by data or literature references so that the reader may judge the paper?s validity independently. The author is expected to differentiate between conclusions based on association and those that can be attributed to specific causes. The manuscript should be precise, concise, and candid. All pertinent literature, including antithetical references, should be cited. Mere summaries of the literature, progress reports having no permanent value, and papers containing commercial overtones are not acceptable. Failure either to disclose the generic name of a material, or to characterize it technically, and the improper use of a trademark will result in a request for revision as a condition of acceptance.

The Transactions on Dielectrics and Electrical Insulation publishes four categories of technical reports: papers, reviews, communications, and discussions. Papers, as described above, are well-documented final reports of research projects. Communications are shorter and contain noteworthy items of technical interest or ideas required rapid publication. Reviews are synoptic papers on a subject of general interest, with ample literature references, and written for readers with widely varying background. Discussions on published reports, with author rebuttals, form the fourth category of TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION publications.

4 MATH

When using Word, use either the Microsoft Equation Editor or the MathType add-on (https://www.wendangku.net/doc/d311885992.html,) for equations in your paper (Insert | Object | Create New | Microsoft Equation or MathType Equation). “Float over text” should not be selected.

5 UNITS

Use only SI units. In cases where none SI units are desired these must be placed in parenthesis next to the SI units.

6 HELPFUL HINTS

6.1 FIGURES AND TABLES

Large figures and tables may span both columns. Place figure captions below the figures; place table titles above the tables. If your figure has two parts, for example, include the labels “(a)” and “(b)” as part of the artwork. In the text use Figure 4a and not Fig. 4 (a). Figures 5a and 5b and not Figs. 5 (a) and (b). Please verify that figures and tables that you men tion in the text actually exist. Use …Figure? even in the middle of sentence. Do not use the abbreviation “Fig.”. Do not abbreviate “Table.”

Figure axis labels are often a source of confusion. Use words rather than symbols. As an example, write the quantity “Rate,” or “Rate, R,” not just “R.” Put units in parentheses. Do not label axes only with units. As in Figure 1, for example, write “Rate (kb/s).”

Multipliers can be especially confusing. Write “Rate (kb/s)” or “Rate (103b/s),” not “Rate (b/s) 1000.” Figure labels should be legible, approximately 8 to 12 point type.

6.2 REFERENCES

Number citations/references consecutively in square brackets [1]. The sentence punctuation follows the brackets [2]. Multiple references [2, 4-6] are numbered between same brackets. When citing a section in a book, please give the relevant page numbers [8]. In sentences, refer simply to the reference number, as in [3]. Do not use “Ref. [3]” or “reference [3]” except at the beginning of a sentence: “Reference [3] shows ....”

Number footnotes separately in superscripts (Insert | Footnote).1 Place the actual footnote at the bottom of the column in which it is cited; do not put footnotes in the

reference list.

Note that IEEE referencing style is quite different from that use d by most physics journals. Give all authors? names; do not use “et al”. Use a space after authors? initials. Papers that have not been published should be cited as “unpublished” [4]. Papers that have been submitted or accepted for publication should be ci ted as “submitted for publication” [5]. Please give affiliations and addresses for personal communications [6]. For papers published in translation journals, please give the English citation first, followed by the original foreign-language citation [7].

Website addresses should not be used as references because they are not permanent and therefore are not archival. Also IEEE-Xplore is developing linkages to all references but not to website addresses.

6.3 ABBREVIATIONS

Define abbreviations and acronyms the first time they are used in the text, even after they have already been defined in the abstract. Abbreviations such as IEEE, SI, ac, and dc do not have to be defined. Abbreviations that incorporate periods should not have spaces: write “C.N.R.S.,” not “C.N. R. S.” Do not use abbreviations in the title unless they are unavoidable (for example, “IEEE” in the title of this article). For a more complete listing of common abbreviations and acronyms please refer to Appendix II of https://www.wendangku.net/doc/d311885992.html,/ organizations/pubs/transactions/auinfo00.pdf.

6.4 EQUATIONS

Number equations consecutively with equation numbers in parentheses flush with the right margin, as in (1). First use the equation editor to create the equation. Then select the “Equation” markup style. Pr ess the tab key and write the equation number in parentheses. To make your equations more compact, you may use the solidus ( / ), the exp function, or appropriate exponents. Use parentheses to avoid ambiguities in denominators. Punctuate equations when they are part of a sentence, as in

(1)

)

sinh(

)

cosh(

)

,

(rx

B

rx

A

j

x

u+

=

ω

Be sure that the symbols in your equation have been defined before the equation appears or immediately following. Symbols should be as used in the equations either in Roman or italics. Refer to “equation (1)” not “Eq. (1)” or “(1),” except at the beginning of a sentence: “Equation (1) is ... .”

6.5 OTHER RECOMMENDATIONS

Use one space after periods and colons. Hyphenate complex modifiers: “zero-field-cooled magnetization.” Avoid dangling participles, s uch as, “Using (1), the potential was calculated.” [It is not clear who or what used (1).] Write instead, “The potential was calculated by using equation (1) or “Using equation (1), we calculated the potential.”

Use a zero before decimal points: “0.25,” not “.25.” Use “cm3,” not “cc.” Indicate sample dimensions as “0.1 cm ? 0.2 cm,” not “0.1 ?0.2 cm2.” The abbreviation for “seconds” is “s,” not “sec.” Do not mix complete spellings and abbreviations of units: use “Mb/s” or “megabits per second,” not “megabits/s.” When expressing a range of values, write “7 to 9” or “7-9,” not “7~9.”

A parenthetical statement at the end of a sentence is punctuated outside of the closing parenthesis (like this). (A parenthetical sentence is punctuated outside the parentheses). In American English, periods and commas are outside quotation marks, like “this period”. Other punctuation is “outside”! Avoid contractions; for example, write “do not” instead of “don?t”.

Remember to check spelling. If you are not well versed in the English language, please request a colleague such as professor of English if you are in a university or a professional translator to proofread your paper.

7 SOME COMMON MISTAKES

The word “data” is plural, not singular. Use the word “micrometer” instead of “micron.” A graph within a graph is an “inset,” not an “insert.” The word “alternatively” is preferred to the word “alternately” (unless you really mean something that alternates). Use the word “whereas” instead of “while” (unless you are referring to simulta neous events). Do not use the word “essentially” to mean “approximately” or “effectively.” Do not use the word “issue” as a euphemism for “problem.”

Be aware of the different meanings of the homophones “affect” (usually a verb) and “effect” (usually a nou n), “complement” and “compliment”, “discreet” and “discrete,” “principal” (e.g., “principal investigator”) and “principle” (e.g., “principle of measurement”). Do not confuse “imply” and “infer”.

Prefixes such as “non,” “sub”, “micro”, and “ultra” are not independent words; they should be joined to the words they modify, usually without a hyphen. There is no period after the “et” in the Latin abbreviation “et al”. The abbreviation “i.e.” means “that is” and the abbreviation “e.g.” means “for example”.

A general IEEE style guide, Information for Authors,is available at:

https://www.wendangku.net/doc/d311885992.html,/organizations/pubs/transactions/auinfo00.pdf.

8 CONCLUSION

A conclusion section is very useful. Although a conclusion may review the main points of the paper, do not replicate the abstract as the conclusion. A conclusion might elaborate on the importance of the work or suggest applications and extensions.

APPENDIX

Appendices, if needed, appear before the acknowledgment.

ACKNOWLEDGMENT

The preferred spelling of the word “acknowledgment” in American English is without an “e” after the “g.” Use the

singular heading even if you have many acknowledgments. Avoid expressions such as “One of us (S.B.A.) woul d like to thank ... .” Instead, write “S.B.A. thanks ... .” Put sponsor acknowledgments in the Acknowledgment section.

This template is based in part on that used by IEEE Transactions on Consumer Electronics and thanks are extended to the creators of that template.

REFERENCES

[1] A. Vetro, H. Sun, P. DaGraca, and T. Poon, “Minimum drift

architectures for three-layer scalable DTV decoding”,IEEE Trans.

Dielectr. Electr. Insul, Vol. 44, pp. 527-536, 1998.

[2] A. N. Netravali and B. G. Haskell, Digital Pictures, 2nd ed., Plenum

Press: New York, pp. 613-651, 1995.

[3]H. Sun, W. Kwok, and J. Zdepski, “Architectures for MPEG

compressed bitstream scaling”, IEEE Electr. Insul. Mag., Vol. 6, No.4, pp. 191-199, 1996.

[4]K. Elissa, “Title of paper”, unpublished.

[5]R. Nicole, “Title of paper with only first letter of the first word

capitalized”, J. Name Stand. Abbrev., submitted for publication.

[6] C. J. Kaufman, Rocky Mountain Research Laboratories, Boulder, CO,

personal communication, 1992. [7]Y. Yorozu, M. Hirano, K. Oka, and Y. Tagawa, “Electron spectroscopy

studies on magneto-optical media and plastic substrate interface”, IEEE Transl. J. Magn. Jpn., Vol. 2, pp. 740-741, 1987 [Dig. 9th Annual Conf.

Magn. Jpn., p. 301, 1982].

[8] D.E. Fred and G, Halo, Superlative Insulators, Plenty Press, Inc., New

York, Ch.4, 2001.

Note: It is recommended that all authors provide a brief

technical biography and photo. Please follow the

following example for all authors:

First A. Author(S?72-M?76-SM?81-F?87) was born in Tel-Aviv, Israel in 1975. He received the B.Sc. degree from the Technion, Israel Institute of Technology, Haifa, Israel in 1995, the M.Sc. degree from the Massachusetts Institute of Technology, Cambridge, USA in 1999 and the Ph.D. degree from the University of the Negev, Beer Sheva, Israel in 2004. Other usual biography information includes employments, and memberships in other professional societies. It is also appropriate to include research interests, professional activities and awards that have been received.

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