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MPXA6115A Rev 3, 01/2007

Freescale Semiconductor Technical Data

High Temperature Accuracy

Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated

The MPXA6115A/MPXH6115A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the pressure sensor a logical and economical choice for the system designer.

The MPXA6115A/MPXH6115A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure.

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.Features ?Improved Accuracy at High Temperature

?Available in Small and Super Small Outline Packages ? 1.5% Maximum Error over 0° to 85°C

?Ideally suited for Microprocessor or Microcontroller-Based Systems ?Temperature Compensated from -40° to +125°C

Durable Thermoplastic (PPS) Surface Mount Package

Typical Applications ?Aviation Altimeters ?Industrial Controls

?Engine Control/Manifold Absolute Pressure (MAP)

Weather Station and Weather Reporting Device Barometers

ORDERING INFORMATION

Device Type

Options

Case No.

MPX Series Order No.

Packing Options

Device Marking

SMALL OUTLINE PACKAGE Basic Element Absolute, Element Only 482MPXA6115A6U Rails MPXA6115A Absolute, Element Only 482MPXA6115A6T1Tape & Reel

MPXA6115A Ported Element

Absolute, Axial Port 482A MPXA6115AC6U Rails MPXA6115A Absolute, Axial Port

482A

MPXA6115AC6T1

Tape & Reel

MPXA6115A

SUPER SMALL OUTLINE PACKAGE Basic Element Absolute, Element Only 1317MPXH6115A6U Rails MPXH6115A Absolute, Element Only 1317

MPXH6115A6T1

Tape & Reel

MPXH6115A Ported Element

Absolute, Axial Port 1317A MPXH6115AC6U Rails MPXH6115A Absolute, Axial Port

1317A MPXH6115AC6T1

Tape & Reel

MPXH6115A

MPXA6115A MPXH6115A SERIES

INTEGRATED PRESSURE SENSOR 15 TO 115 kPA (2.2 TO 16.7 psi)

0.2 TO 4.8 V OUTPUT

SMALL OUTLINE PACKAGE

PIN NUMBERS (1)

1.Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the notch in the lead.

1N/C 5N/C 2V S

6N/C 3GND 7N/C 4

V OUT

N/C

SUPER SMALL OUTLINE PACKAGE

PIN NUMBERS (1)

1.Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the notch in the lead

1N/C 5N/C 2V S 6N/C 3

GND 7N/C 4

V OUT

N/C

Sensors

MPXA6115A Figure 1. Fully Integrated Pressure Sensor Schematic

Table 1. Maximum Ratings (1)

1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Rating

Symbol Value Units Maximum Pressure (P1 > P2)P max 400kPa Storage Temperature T stg -40° to +125°°C Operating Temperature

T A -40° to +125°

°C Output Source Current @ Full Scale Output (2)2.Maximum Output Current is controlled by effective impedance from V out to Gnd or V out to V S in the application circuit.

I o +0.5mAdc Output Sink Current @ Minimum Pressure Offset (2)

I o --0.5

mAdc

Pins 1, 5, 6, 7, and 8 are NO CONNECTS

Sensing Element

V OUT

V S

Gain Stage #2GND

and Ground Reference Shift Circuitry

Thin Film Temperature Compensation

and

Gain Stage #1

Sensors

MPXA6115A

Table 2. Operating Characteristics (V S = 5.0 Vdc, T A = 25°C unless otherwise noted, P1 > P2)

Characteristic

Symbol Min Typ Max Unit Pressure Range P OP 15—115kPa Supply Voltage (1)V S 4.75 5.0 5.25Vdc Supply Current

I o - 6.010mAdc Minimum Pressure Offset (2)

(0 to 85°C)

@ V S = 5.0 Volts V off 0.133

0.200

0.268

Vdc

Full Scale Output (3)

(0 to 85°C)

@ V S = 5.0 Volts V FSO 4.633 4.700 4.768Vdc

Full Scale Span (4)

(0 to 85°C)

@ V S = 5.0 Volts V FSS 4.433 4.500 4.568Vdc

Accuracy (5)(0 to 85°C)

———±1.5%V FSS Sensitivity V/P —45.9—mV/kPa Response Time (6)t R — 1.0—ms Warm-Up Time (7)——20—ms Offset Stability (8)

—

±0.25

—

%V FSS

1.Device is ratiometric within this specified excitation range.

2.Offset (V off ) is defined as the output voltage at the minimum rated pressure.

3.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.

4.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.

5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following:?Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range.

?Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to

and from the minimum or maximum operating temperature points, with zero differential pressure applied.

?Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum

or maximum rated pressure at 25°C.

?TcSpan:Output deviation over the temperature range of 0° to 85°C, relative to 25°C.?TcOffset:Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.6.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.7.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.8.Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.

Sensors

MPXA6115A Figure 2. Cross Sectional Diagram SSOP (Not to Scale)

Figure 3. Typical Application Circuit (Output Source Current Operation)

Figure 4. Output versus Absolute Pressure

Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317).

Figure 3 shows a typical application circuit (output source current operation).

Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output

curves are shown for operation over 0 to 85×C temperature range. The output will saturate outside of the rated pressure range.

A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXA6115A/MPXH6115A series pressure sensor operating

characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.

Wire Bond Stainless Steel Cap

Thermoplastic

Case

Die Bond

Sealed Vacuum Reference

Fluoro Silicone Gel Die Coat

Lead Frame

Absolute Element

Die

V S Pin 2

+5.0 V

GND Pin 3

V out Pin 4MPXA6115A MPXH6115A

to ADC

100 nF

51 K

47 pF

O u t p u t (V o l t s )

5.04.54.03.53.0Pressure (ref: to sealed vacuum) in kPa

MAX

MIN

51015202530354045505560657075808590951001052.52.01.51.00.5

110Transfer Function:

V out = V s * (.009*P-.095) ± Error V S = 5.0 Vdc TEMP = 0 to 85oC

115120

TYP

Sensors

MPXA6115A

Transfer Function (MPXA6115A/MPXH6115A)

Nominal Transfer Value:Vout = VS x (0.009 x P - 0.095)

± (Pressure Error x Temp. Factor x 0.009 x VS)VS = 5.0 ± 0.25 Vdc

Temperature Error Band

MPXA6115A/MPXH6115A SERIES

Break Points Temp Multiplier - 4030 to 851125

1.75

Temperature in Co

4.03.0

2.00.0

1.0-40

-20

204060140

12010080Temperature Error Factor

NOTE: The Temperature Multiplier is a linear response from 0oC to -40oC and from 85oC to 125oC

Pressure Error Band

Error Limits for Pressure

3.02.01.0-1.0-2.0-3.0

0.020

Pressure (in kPa)

P r e s s u r e E r r o r (k P a )

15 to 115 (kPa)

±1.5 (kPa)

100

120

Pressure Error (Max)

Sensors

MPXA6115A MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES

Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a

solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.

Figure 5. SOP Footprint (Case 482)

Figure 6. SSOP Footprint (Case 1317 and 1317A)

0.66016.76

0.060 TYP 8X 1.52

0.100 TYP 2.54

0.3007.62

inch mm

0.100 TYP 8X 2.54

0.027 TYP 8X 0.690.053 TYP 8X 1.35

inch mm

0.3879.83

0.1503.81

0.0501.27TYP

PACKAGE DIMENSIONS

CASE 482-01

ISSUE O

SMALL OUTLINE PACKAGE

CASE 482A-01

ISSUE A

SMALL OUTLINE PACKAGE

MPXA6115A Sensors

MPXA6115A PACKAGE DIMENSIONS

Sensors

PACKAGE DIMENSIONS

MPXA6115A Sensors

MPXA6115A PACKAGE DIMENSIONS

Sensors

PACKAGE DIMENSIONS

MPXA6115A Sensors

MPXA6115A PACKAGE DIMENSIONS

Sensors

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MPXA6115A