文档库 最新最全的文档下载
当前位置:文档库 › SN54ALS175FK中文资料

SN54ALS175FK中文资料

PACKAGING INFORMATION

Orderable Device Status(1)Package

Type Package

Drawing

Pins Package

Qty

Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)

5962-9553701Q2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-9553701QEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 83019012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 8301901EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 8301901FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 83019022A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 8301902EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 8301902FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC

JM38510/37201B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC

JM38510/37201BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC

JM38510/37202B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC

JM38510/37202BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54ALS174J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54ALS175J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54AS174J OBSOLETE CDIP J16TBD Call TI Level-NC-NC-NC SN54AS175BJ ACTIVE CDIP J161TBD Call TI Call TI

SN74ALS174D ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74ALS174DE4ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74ALS174DG4ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74ALS174DR ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74ALS174DRE4ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74ALS174DRG4ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74ALS174N ACTIVE PDIP N1625Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC SN74ALS174N3OBSOLETE PDIP N16TBD Call TI Call TI

SN74ALS174NE4ACTIVE PDIP N1625Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74ALS174NSR ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74ALS174NSRE4ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74ALS175D ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74ALS175DE4ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74ALS175DR ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74ALS175DRE4ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM SN74ALS175N ACTIVE PDIP N1625Pb-Free CU NIPDAU Level-NC-NC-NC

Orderable Device Status(1)Package

Type Package

Drawing

Pins Package

Qty

Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)

(RoHS)

SN74ALS175NSR ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74ALS175NSRE4ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74AS174D ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-2-260C-1YEAR

SN74AS174DE4ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-2-260C-1YEAR

SN74AS174DR ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-2-260C-1YEAR

SN74AS174DRE4ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-2-260C-1YEAR

SN74AS174N ACTIVE PDIP N1625Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74AS174NSR ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74AS174NSRE4ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74AS175BD ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74AS175BDE4ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74AS175BDR ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74AS175BDRE4ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74AS175BN ACTIVE PDIP N1625Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74AS175BNE4ACTIVE PDIP N1625Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74AS175BNSR ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74AS175BNSRE4ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM SNJ54ALS174FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54ALS174J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54ALS174W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54ALS175FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54ALS175J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54ALS175W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54AS174FK NRND LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54AS174J NRND CDIP J161TBD Call TI Level-NC-NC-NC SNJ54AS175BFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54AS175BJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:

ACTIVE:Product device recommended for new designs.

LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.

NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in

a new design.

PREVIEW:Device has been announced but is not in production.Samples may or may not be available.

OBSOLETE:TI has discontinued the production of the device.

(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check https://www.wendangku.net/doc/e63857737.html,/productcontent for the latest availability information and additional product content details.

TBD:The Pb-Free/Green conversion plan has not been defined.

Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.

Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)

(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers https://www.wendangku.net/doc/e63857737.html, Audio https://www.wendangku.net/doc/e63857737.html,/audio

Data Converters https://www.wendangku.net/doc/e63857737.html, Automotive https://www.wendangku.net/doc/e63857737.html,/automotive

DSP https://www.wendangku.net/doc/e63857737.html, Broadband https://www.wendangku.net/doc/e63857737.html,/broadband

Interface https://www.wendangku.net/doc/e63857737.html, Digital Control https://www.wendangku.net/doc/e63857737.html,/digitalcontrol

Logic https://www.wendangku.net/doc/e63857737.html, Military https://www.wendangku.net/doc/e63857737.html,/military

Power Mgmt https://www.wendangku.net/doc/e63857737.html, Optical Networking https://www.wendangku.net/doc/e63857737.html,/opticalnetwork Microcontrollers https://www.wendangku.net/doc/e63857737.html, Security https://www.wendangku.net/doc/e63857737.html,/security

Telephony https://www.wendangku.net/doc/e63857737.html,/telephony

Video & Imaging https://www.wendangku.net/doc/e63857737.html,/video

Wireless https://www.wendangku.net/doc/e63857737.html,/wireless

Mailing Address:Texas Instruments

Post Office Box 655303 Dallas, Texas 75265

Copyright 2005, Texas Instruments Incorporated

相关文档