文档库 最新最全的文档下载
当前位置:文档库 › HMC604LP3中文资料

HMC604LP3中文资料

L O W

N O I S E A M P L I F I

E R S

- S M T 5

HMC604LP3 / 604LP3E v00.0308GaAs PHEMT MMIC LOW NOISE AMPLIFIER w/ BYPASS MODE, 4.8 - 6.0 GHz General Description Features Functional Diagram

Typical Applications Electrical Specifi cations, T

= +25° C The H MC604LP3(E) is a versatile, high dynamic range GaAs MMIC Low Noise Amplifi er that integrates a low loss LNA bypass mode on the IC. The amplifi er is ideal for WiMAX & C-band Radio receivers operating between 4.8 and 6.0 GH z and provides 1.5 dB noise fi gure, 15 dB of gain and +26 dBm IP3 from a single supply of +5V @ 42mA. Input and output return losses are 12 and 14 dB respectively with no external matching components required. A single control line (0/Vdd) is used to switch between LNA mode and a low loss bypass mode which reduces the current consumption to 10 μA.Noise Figure: 1.5 dB Output IP3: +26 dBm Gain: 15 dB Integrated Low Loss LNA Bypass Path Single Supply: +3V or +5V 50 Ohm Matched Output/Input 16 Lead 3x3mm QFN Package: 9 mm 2The HMC604LP3 / HMC604LP3E is ideal for:? WiMAX/C-band Radio ? Fixed Wireless ? Tower Mounted Amplifi ers ? Public Safety Infrastructure ? Telematics & DSRC

L O W N O I S E A M P L I F I E R S - S M T 5

AMPLIFIER w/ BYPASS MODE, 4.8 - 6.0 GHz

LNA Broadband Gain & Return Loss @ Vdd= 3V -30-20-10010204.0 4.5 5.0 5.5 6.0 6.57.0 S21 S11 S22R E S P O N S E (d B )FREQUENCY (GHz)-30

-20

-10010

20

4.0 4.5

5.0 5.5

6.0 6.5

7.0

S21 S11 S22R

E S P O N S E (d B )FREQUENCY (GHz)

LNA Broadband Gain

& Return Loss @ Vdd= 5V LNA Gain vs. Temperature 10111213141516

174.6 4.85 5.2 5.4 5.6 5.86

G A

I N (

d B )

FREQUENCY (GHz)9101112131415164.6 4.85 5.2 5.4 5.6 5.862.7V 3.0V 3.3V 4.5V 5.0V 5.5V

G A I N (

d B )

FREQUENCY (GHz)LNA Gain vs. Vdd LNA Noise Figure vs. Temperature 0

0.51

1.5

2

2.5

4.6 4.85

5.2 5.4 5.6 5.86

N

O I

S E F I G

U R E

(d B )FREQUENCY (GHz)

1.2

1.4

1.6

1.82

4.6 4.85

5.2 5.4 5.6 5.862.7V 3.0V 3.3V 4.5V 5.0V 5.5V N

O

I

S

E F I G

U R

E

(d B )FREQUENCY (GHz)

LNA Noise Figure vs. Vdd

L O W

N O I S E A M P L I F I

E R S

- S M T 5

LNA Output IP3 vs. Temperature LNA Input Return Loss vs. Temperature @ Vdd= 3V LNA Input Return Loss vs. Temperature @ Vdd= 5V LNA Output IP3 vs. Vdd -30-25-20-15-10-504.6 4.85 5.2 5.4 5.6 5.86+25C +85C -40C R E T U R N L O S S (d B )FREQUENCY (GHz)-30-25-20-15-10-504.6 4.85 5.2 5.4 5.6 5.86+25C +85C -40C R E T U R N L O S S (d B )FREQUENCY (GHz)LNA Output Return Loss vs. Temperature @ Vdd= 3V LNA Output Return Loss vs. Temperature @ Vdd= 5V -30-25-20-15-10-504.6 4.85 5.2 5.4 5.6 5.86+25C +85C -40C R E T U R N L O S S (d B )FREQUENCY (GHz)-30-25-20-15-10-504.6 4.85 5.2 5.4 5.6 5.86+25C +85C -40C R E T U R N L O S S (d B )FREQUENCY (GHz)16182022242628304.6 4.85 5.2 5.4 5.6 5.86

I P 3 (d B m )FREQUENCY (GHz)121416182022242628304.6 4.85 5.2 5.4 5.6 5.862.7V 3.0V 3.3V 4.5V 5.0V 5.5V I P 3 (d B m )FREQUENCY (GHz)AMPLIFIER w/ BYPASS MODE, 4.8 - 6.0 GHz

L O W N O I S E A M P L I F I E R S - S M T 5

LNA Psat vs. Temperature LNA Psat vs. Vdd

0246810121416184.6 4.85 5.2 5.4 5.6 5.86

P s a t (

d B m )FREQUENCY (GHz)0

246

8

1012

14

16

18

4.6 4.85

5.2 5.4 5.6 5.862.7V 3.0V 3.3V 4.5V

5.0V 5.5V

P

s a

t

(

d B m

)

FREQUENCY (GHz)

LNA Output P1dB vs. Temperature LNA Output P1dB vs. Vdd 0246810121416184.6 4.85 5.2 5.4 5.6 5.86

P 1d B (d B m )FREQUENCY (GHz)0

246

8101214

16

18

4.6 4.85

5.2 5.4 5.6 5.862.7V

3.0V 3.3V

4.5V

5.0V 5.5V

P 1d B (d B m )FREQUENCY (GHz)

-50

-45-40

-35

-30

-25

4.6 4.85

5.2 5.4 5.6 5.86

I

S

O L

A

T

I

O N

(

d

B

)

FREQUENCY (GHz)

LNA Reverse Isolation vs. Temperature

AMPLIFIER w/ BYPASS MODE, 4.8 - 6.0 GHz

L O W

N O I S E A M P L I F I

E R S

- S M T 5

Bypass Mode Broadband Gain & Return Loss [1]Bypass Mode Broadband Gain & Return Loss [2]-35-30-25-20-15-10-504.0 4.5 5.0 5.5 6.0 6.57.0S21S11S22R E S P O N S E (d B )FREQUENCY (GHz)-35-30-25-20-15-10-504.0 4.5 5.0 5.5 6.0 6.57.0S21S11S22R E S P O N S E (d B )FREQUENCY (GHz)-4-3.5-3-2.5-2-1.5-1-0.504.6 4.85 5.2 5.4 5.6 5.86+25C +85C -40C I N S E R T I O N L O S S (d B )FREQUENCY (GHz)-4-3.5-3-2.5-2-1.5-1-0.504.6 4.85 5.2 5.4 5.6 5.86+25C +85C -40C I N S E R T I O N L O S S (d B )FREQUENCY (GHz)Bypass Mode Insertion Loss vs. Temperature [1]Bypass Mode Insertion Loss vs. Temperature [2]AMPLIFIER w/ BYPASS MODE, 4.8 - 6.0 GHz

L O W N O I S E A M P L I F I E R S - S M T 5

-30-25-20-15-10-504.6 4.85 5.2 5.4 5.6 5.86+25C +85C -40C R E T U R N L O S S (d B )FREQUENCY (GHz)-30

-25

-20

-15-10-5

4.6 4.85

5.2 5.4 5.6 5.86

+25C +85C -40C R

E T U R N L O S S (d B )FREQUENCY (GHz)

1618

20

22242628304.6 4.85 5.2 5.4 5.6 5.86+25C +85C -40C I P 3 (d B m )FREQUENCY (GHz)20

22

24

262830

4.6 4.85

5.2 5.4 5.6 5.86

+25C +85C

-40C

P 1d

B

(

d B m

)

FREQUENCY (GHz)

Bypass Mode Input Return Loss vs. Temperature [1]Bypass Mode

Output Return Loss vs. Temperature [1]

Bypass Mode Output IP3 vs. Temperature [1]Bypass Mode

Output P1dB vs. Temperature [1]Bypass Mode

Psat vs. Temperature [1]

AMPLIFIER w/ BYPASS MODE, 4.8 - 6.0 GHz

20

2224

2628

30

4.6 4.85

5.2 5.4 5.6 5.86

+25C +85C -40C

P s a t

(d

B m

)FREQUENCY (GHz)

L O W

N O I S E A M P L I F I

E R S

- S M T 5

Typical Supply Current vs. Vdd Absolute Maximum Ratings Outline Drawing NOTES:1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.

Truth Table

[2] Max peak refl ow temperature of 260 °C Package Information ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS AMPLIFIER w/ BYPASS MODE, 4.8 - 6.0 GHz

L O W N O I S E A M P L I F I E R S - S M T 5

Pin Descriptions

Application Circuit

AMPLIFIER w/ BYPASS MODE, 4.8 - 6.0 GHz

L O W

N O I S E A M P L I F I

E R S

- S M T 5

[1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350Evaluation PCB The circuit board used in the fi nal application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and exposed paddle should be con-nected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request.List of Materials for Evaluation PCB 117160

[1]AMPLIFIER w/ BYPASS MODE, 4.8 - 6.0 GHz

L O W N O I S E A M P L I F I E R S - S M T 5

Notes:

AMPLIFIER w/ BYPASS MODE, 4.8 - 6.0 GHz

相关文档