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BAS16XV2T1G;BAS16XV2T1;中文规格书,Datasheet资料

BAS16XV2T1,

BAS16XV2T5,

SBAS16XV2T1G

Switching Diode

Features

?High?Speed Switching Applications

?Lead Finish: 100% Matte Sn (Tin)

?Qualified Reflow Temperature: 260°C

?Extremely Small SOD?523 Package

?AEC?Q101 Qualified and PPAP Capable

?S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

?Pb?Free Packages are Available

MAXIMUM RATINGS

Rating Symbol Value Unit Continuous Reverse Voltage V R75V Continuous Forward Current I F200mA Peak Forward Surge Current I FM(surge)500mA Repetitive Peak Forward Current I FRM500mA

Non?Repetitive Peak Forward Current (Square Wave, T J = 25°C prior to surge) t = 1 m s

t = 1 ms

t = 1 s I FSM

4.0

1.0

0.5

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Total Device Dissipation, (Note 1) T A = 25°C

Derate above 25°C P D200

1.57

mW/°C

Thermal Resistance, Junction?to?

Ambient RθJA635°C/W Junction and Storage Temperature T J, T

stg?55 to 150°C 1.FR-5 Minimum Pad.

https://www.wendangku.net/doc/f24281578.html,

Device Package Shipping?

ORDERING INFORMATION

BAS16XV2T1SOD?5233000 / Tape & Reel

?For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D.

SOD?523

CASE 502

PLASTIC

A6= Specific Device Code

M= Date Code

G= Pb?Free Package

MARKING

DIAGRAM

BAS16XV2T1G SOD?523

(Pb?Free)

3000 / Tape & Reel

BAS16XV2T5G SOD?523

(Pb?Free)

8000 / Tape & Reel (Note: Microdot may be in either location) SBAS16XV2T1G SOD?523

(Pb?Free)

3000 /T ape & Reel

ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted)

Characteristic

Symbol

Min

Max

Unit

OFF CHARACTERISTICS

Reverse Voltage Leakage Current (V R = 75 V)

(V R = 75 V, T J = 150°C)(V R = 25 V, T J = 150°C)I R

??? 1.05030m A

Reverse Breakdown Voltage (I BR = 100 m A)V (BR)75

V Forward Voltage (I F = 1.0 mA)(I F = 10 mA)(I F = 50 mA)(I F = 150 mA)

V F

????71585510001250mV

Diode Capacitance (V R

= 0, f = 1.0 MHz)C D ? 2.0pF Forward Recovery Voltage (I F = 10 mA, t r = 20 ns)V FR ? 1.75V Reverse Recovery Time

(I F = I R = 10 mA, R L = 50 Ω)

rr ? 6.0

ns Stored Charge

(I F = 10mA to V R = 5.0V, R L = 500 Ω)

Q S

Notes: 1. A 2.0 k Ω variable resistor adjusted for a Forward Current (I F ) of 10 mA.2. Input pulse is adjusted so I R(peak) is equal to 10 mA.3. t p ? t rr

V R

t r

10%

90%

I I OUTPUT PULSE

(I F = I R = 10 mA; MEASURED

at i R(REC) = 1.0 mA)

INPUT SIGNAL Figure 1. Recovery Time Equivalent Test Circuit

100

V F , FORWARD VOLTAGE (VOLTS)

1.0

0.1

V R , REVERSE VOLTAGE (VOLTS)

1.0

0.1

0.01

0.680V R , REVERSE VOLTAGE (VOLTS)

0.64

0.60

0.56

0.52

C D , D I O D E C A P A C I T A N C E (p F )

2468

I F , F O R W A R D C U R R E N T (m A )

Figure 2. Forward Voltage Figure 3. Leakage Current

Figure 4. Capacitance

I R , R E V E R S E C U R R E N T (μA )

PACKAGE DIMENSIONS

SOD ?523CASE 502?01ISSUE E

NOTES:

1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2.CONTROLLING DIMENSION: MILLIMETERS.

3.MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.

MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

4.DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-TRUSIONS, OR GATE BURRS.

DIM MIN NOM MAX MILLIMETERS D 1.10 1.20 1.30E 0.700.800.90A 0.500.600.70b 0.250.300.35c 0.070.140.20L 0.30 REF H 1.50 1.60 1.70

*For additional information on our Pb ?Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

E RECOMMENDED

SIDE VIEW

BOTTOM VIEW

0.150.200.25

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

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BAS16XV2T1G BAS16XV2T1