RTL8672
Integrated ADSL2+ Router Controller
Datasheet
Rev. 0.4
6 May, 2008
Track ID: xxxx-nnnn-nn
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USING THIS DOCUMENT
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Though every effort has been made to ensure that this document is current and accurate, more information may have become available subsequent to the production of this guide. In that event, please contact your Realtek representative for additional information that may help in the development process.
REVISION HISTORY
Revision Release Date Summary
0.0 2008/01/18 First release.
0.1 2008/01/23 n Correcting pin 113 as ‘OVDD’
n Block diagram added
0.2 2008/01/30 n Correcting pin 12 as ‘VSS’
0.3 2008/01/31 n Correcting polarity of ‘U1ID’
0.4 2008/05/06 n‘U1ID’ should be input only, not I/O
Table of Contents
1.GENERAL DESCRIPTION (1)
2.FEATURES (2)
3.SYSTEM APPLICATIONS (2)
4.BLOCK DIAGRAM (3)
5.PIN ASSIGNMENTS (4)
6.PIN DESCRIPTIONS (5)
7.SYSTEM OVERVIEW (9)
8.ELECTRICAL REQUIREMENTS (10)
8.1.DC C HARACTERISTICS (10)
8.1.1.Absolute Maximum Rating (10)
8.1.2.Recommended Operation Conditions (10)
8.1.3.Power Consumption (10)
8.1.4.Reference Crystal (11)
8.1.5.V REF Input (11)
8.2.AC C HARACTERISTICS (11)
8.2.1.FLASH – Parallel (11)
8.2.2.FLASH – Serial (12)
8.2.3.SDRAM (12)
8.2.3.1SDRAM Input Timing (12)
8.2.3.2SDRAM Output Timing (13)
8.2.3.3SDRAM Access Control Timing (13)
8.2.4.AFE (14)
8.2.4.1Master clock (14)
8.2.4.2Transmission Interface (15)
8.2.4.3Reception Interface (15)
8.2.5.JTAG (15)
8.2.6.Reset (16)
8.2.7.V REF Timing (17)
8.2.8.Power-on sequence (17)
9.MECHANICAL DIMENSIONS (18)
10.ORDERING INFORMATION (20)
List of Tables
T ABLE 1P IN D ESCRIPTIONS OF RTL8672(128-PIN LQFP) (5)
T ABLE 2A BSOLUTE M AXIMUM R ATING (10)
T ABLE 3R ECOMMENDED O PERATION C ONDITIONS (10)
T ABLE 4P OWER C ONSUMPTION (10)
T ABLE 5R EFERENCE C RYSTAL (11)
T ABLE 6V REF I NPUT (11)
T ABLE 7FLASH I NTERFACE T IMING (11)
T ABLE 8SDRAM I NPUT T IMING (12)
T ABLE 9SDRAM O UTPUT T IMING (13)
T ABLE 10SDRAM C ONTROL T IMING (13)
T ABLE 11AFE I NTERFACE C LOCK (14)
T ABLE 12AFE TX I NTERFACE (15)
T ABLE 13AFE RX I NTERFACE (15)
T ABLE 14JTAG I NTERFACE T IMING (15)
T ABLE 15R ESET T IMING (16)
T ABLE 16V REF T IMING (17)
T ABLE 17D IMENSION OF LQFP-128 (19)
List of Figures
F IGURE 1T YPICAL A PPLICATION D IAGRAM I (2)
F IGURE 2T YPICAL A PPLICATION D IAGRAM I (2)
F IGURE 3B LOCK D IAGRAM (3)
F IGURE 4P IN-OUT D IAGRAM (4)
F IGURE 5F LASH A CCESS T IMING (12)
F IGURE 6SDRAM I NPUT T IMING (13)
F IGURE 7SDRAM O UTPUT T IMING (13)
F IGURE 8SDRAM A CCESS C ONTROL T IMING (14)
F IGURE 9B OUNDARY-S CAN G ENERAL T IMING (16)
F IGURE 10B OUNDARY-S CAN R ESET T IMING (16)
F IGURE 11R ESET T IMING (17)
F IGURE 12D RAWING OF LQFP-128 (18)
1. General Description
The Realtek RTL8672 is an integrated SoC featuring a RISC, an ADSL2+ Discrete Multi-tone (DMT) data-pump, a hardware-based ATM Segmentation and Reassembly (SAR), a hardware based packet accelerator, a 10/100Mbps IEEE 802.3 compliant Ethernet transceiver, and two USB PHY ports supporting host and device modes. Mated with Realtek RTL8271 (ADSL2+ Analog Front End), RTL8672 provides a low cost integrated solution for ADSL2+ CPE modems, routers, or gateways.
RTL8672 encompasses high-performance DSP technologies, optimized mix-signal designs, and an efficient architecture to provide a seamless WAN to LAN router controller. The embedded RISC network processor supports the MIPS I instruction set along with DSP extensions and achieves a 400MHz clock rate in a six-stage pipeline to support layer 2, 3, and other upper layer applications.
The DMT engine supports the upstream data rate from 32kbp to above 3Mbps and the downstream data rate from 32kbps to above 24Mbps throughput, and complies with:
n ANSI T1.413 Issue 2
n ITU-T G.992.1 (G..dmt) Annexes A and B
n G.992.2 (G..lite) Annexes A and B
n G.992.3 ADSL2 (G.dmt.bis) Annexes A, B, I, J, L, and M
n G.992.4 ADSL2 (G.lite.bis)
n G.992.5 ADSL2+
n Dual-latency on the same copper
n HDLC PTM on copper
The Ethernet interface offers high-speed transmission over CAT-5 UTP cable or CAT-3 UTP (10Mbps only) cable. Ethernet functions such as Crossover Detection & Auto-Correction and polarity correction are implemented to provide robust transmission and reception capability at high speeds.
2. Features
n Two-chip ADSL2+ CPE solution: RTL8672 (ADSL2+/Network Processor SoC) +
RTL8271B (ADSL2+ Analog Front End).
n Field proven DMT data-pump complies with ANSI T1.413 Issue 2, ITU-T G992.1,
G.992.2 , G.992.3, G.992.4, G.992.5
supporting Annexes A, B, I, J, L, and M.
Supports S=1/3 coding.
n Dual-latency supported on the same copper
n HDLC-PTM on copper supported
n High performance embedded RISC with MMU, TLB and DSP instruction extension. n Embedded hardware-based ATM SAR: up to 16 distinct VCs—ATM AAL5 adaptation, F4/F5 OAM cell, HEC, CRC, IP/TCP/UDP checksum offloading, and error packet
filtering— and QoS supported for CBR,
UBR, rt-VBR, and nrt-VBR.
n Embedded hardware-based packet accelerator for better throughput
performance and IP QoS
n Embedded 10/100 Base-TX Ethernet MAC and transceiver supporting Crossover
Detection & Auto-Correction and polarity
correction, IP/TCP/UDP checksum offload supported as well.
n Two on-chip USB PHY posts: one for host mode only, and one configurable as
host/device mode.
n Support serial SPI interface for device control
n Network device management via HTTP, SNMP, and CLI (UART).
n IP layer processing, DHCP, NAT, and typical higher layer applications supported n16-bit-wide, 166MHz SDRAM support up to 256Mb
n8/16-bit-wide parallel/SPI Flash support up to 128Mb
n 3.3V signaling, 1.2V core voltage; a embedded linear regulator controller to
reduce an external LDO
n Two 32-bit timers and a watchdog timer
n Embedded “Dying-Gasp” detection circuit n EJTAG interface
n Package of 128-pin LQFP available
3. System Applications
Figure 2 Typical Application Diagram I
4. Block Diagram
5. Pin Assignments
Figure 4 Pin-out Diagram
V M MD13V C T D D 3V D D 1T X O T X O V S R X I R X I V D D 1V D D 1C K I V S V D D 1V D D 3U 0D U 0D V S V S U 1D U 1D U 1I U 1V B U V D D 3D G N G P A 5/S V C S I V D A F T X D A F T X D A F T X D A F T X D A F R X D A F R X D D 14M D 15W E #O V D D R A S #C A S #M C S 3#D G N D M C S 2#I V D D M A 0M A 1M A 2M A 3O V D D M A 4M A 5M A 6M A 7I V D D M A 8M A 9M A 10M A 11M A 12O V D D M A 13M A 14M A 15M A 16M A 17M A 18
MD12IVDD MD11MD10OVDD MD9MD8MD7MD6SDCLK MD5IVDD MD4DGND MD3OVDD ENUSBOTG
MD2MD1MD0CK25MOUT
CKSEL VDD12
XI XO VSS NC VDD33IBREF VSS VREF
GPB7/JTDO GPB6/JTMS GPB5/JTDI GPB4/JTRST#GPB3/JTCK
GPB2/URTS#/SVDO GPB1/UTXD/SVDI GPB0/URXD/SVCS#IVDD
GPA7/UCTS#/SVCK
6. Pin Descriptions
Table 1 Pin Descriptions of RTL8672 (128-pin LQFP) Symbol 128 Pin# Type Description
100/10 Physical Layer
RXIP RXIN 7
8
I Ethernet physical layer differential
RX pins
TXOP TXON 4
5
O Ethernet physical layer differential
TX pins
IBREF 126 I Pull-down externally with 2.5k Ohm
for PHY reference
Ethernet PHY LED
NICLED[3:0] 55, 57, 59, 61 O LED driving signals for the
embedded Ethernet PHY;
Pins MA[22:21] sharing with
NICLED[1:0]
Clock & Reset
XI 121 I 25MHz crystal clock input.
XO 122 O 25MHz crystal clock output. CKSEL 119 I Reference clock selection; tied to
1.2 to select XO (25MHz), VSS to
select CKIN (35.328MHz) PWRRST# 41 I System reset.
SPI Control Interface
SVCS# 45 O SPI chip select pin (shared with
GPB0 and URXD)
SVDI 46 I SPI data in (shared with GPB1 and
UTXD)
SVDO 47 O SPI data out (shared with GPB2
and URTS#)
SVCK 48 O SPI reference clock (shared with
GPA7 and UCTS#)
USB Interface
U0DP, U0DM 15, 16 I/O Differential data I/O of USB PHY 0
(Host)
U1DP, U1DM 20, 19 I/O Differential data I/O of USB PHY 1
(host/device controlled by ID)
U1ID 21 I Pull-low/high to select PHY 1 as
host/device
U1VBUS 22 I USB VBUS detect pin; used for
PHY 1 configured in device mode USBLED[1:0] 54, 53 O USB LED driver output
UseOTG 114 I USB PHY1 wired to OTG block
AFE Interface
AFPWDN 40 O Power down control to AFE AFRXD[3:0] 34, 33, 32, 31 I Data input from AFE
AFTXD[3:0] 30, 29, 28, 27 O Data output to AFE
AFCLWD 35 I Word clock input from AFE
CKIN 11 I Master clock from AFE
AFCTRL 37 O Control data output to AFE
VREF 128 I Dying Gasp voltage detect input
Memory Bus
MD[15:0] 95, 96, 97, 98, 100, 101, 103, 104,
105, 106, 108, 110, 112, 115, 116, 117 I/O Data for SDRAM, parallel Flash, and ROM
MA[22:0] 59, 61, 62, 64, 65, 66, 67, 68, 69, 70,
72, 73, 74, 75, 76, 78, 79, 80, 81, 83,
84, 85, 86
O Address for SDRAM and Flash
SDCLK 107 O SDRAM clock
MCS2# 88 O Bank 0 chip select SDRAM chip
select.
MCS3# 90 O Bank 1 chip select SDRAM chip
select
OE#/RAS# 92 O Raw address strobe for SDRAM
interface; output enable for FLASH
interface
CAS# 91 O Column address strobe
WE# 94 O Write enable for SDRAM/ FLASH
interface
DQM[3:0] 66, 65, 68, 67 O DQM[3:0] for SDRAM; shared with
AA17, AA18, AA15, AA16
MCS0# 63 O ROM Bank 0 chip select for FLASH
memory
SFCS# 63 O Chip select of SPI FLASH interface
if enabled (AFPWDN pull-up on
power-on reset)
SFDI 35 I Serial data in of SPI FLASH
interface if enabled; shared with
AFCLWD
SFDO 62 O Serial data out of SPI FLASH
interface if enabled; shared with
MA20
SFCK 64 O Reference clock of SPI FLASH
interface if enabled; shared with
MA19
GPIO
GPIOA[7:5] 43, 42, 25 I/O GPIO port A
GPIOB[7:0] 52, 51, 50, 49, 48, 47, 46, 45 I/O GPIO port B
UART
UCTS# 43 I Clear to send; shared with GPA7
and SV_CK
URXD 45 I RX data; shared with GPB0 and
SV_CS#
UTXD 46 O TX data; shared with GPB1 and
SV_DI
URTS# 47 O Request to send; shared with
GPB2 and SV_DO
JTAG (shared with GPIOB7-3)
JTCK 48 I JTAG test clock; shared with GPB3 JTMS 51 I JTAG test mode select; shared with
GPB6
JTDO 52 O JTAG test data output; shared with
GPB7
JTDI 50 I JTAG test data in; shared with
GPB5
JTRST# 49 I JTAG test reset; shared with GPB4
POWER & GND
VDD12 3, 9, 10, 13, 120 P Analog 1.2V supply
VDD33 2, 14, 23, 125 P Analog 3.3V supply
VSS 6, 12, 17, 18, 123, 127 P Analog ground
DGND 24, 58, 89, 111 P Digital ground
OVDD 39, 60, 71, 82, 93, 102, 113 P 3.3V digital I/O supply
IVDD 26, 36, 44, 56, 77, 87, 99, 109 P 1.2V digital kernel supply
Misc
CK25MOUT 118 O Clock output of 25MHz for possible
peripheral use
VCTRL 1 O Output of the embedded regulator
controller to generate 1.2V VDD for
the kernel supply of the chip.
Connecting to an external PNP-BJT
base if used (BJT collector output
to IVDD); leaving no connection if
not used.
DTEST 124 - No used; leaving no connection TESTMODE 38 I Test only; leaving no connection
Pulled-down internally for normal
operation
7. System Overview TBD
8. Electrical Requirements
8.1. DC Characteristics
8.1.1. Absolute Maximum Rating
Table 2 Absolute Maximum Rating
Parameters Symbol Min Max Unit I/O supply voltage V DDIO TBD TBD V Core supply voltage V DDC TBD TBD V Storage temperature T STG TBD
ESD protection VESD TBD V
8.1.2.Recommended Operation Conditions
Table 3 Recommended Operation Conditions
Parameters Symbol Condition Min Typ Max Unit Operating
temperature
T A Ambient TBD TBD TBD °C
Digital supply for I/O
ring
V DDR TBD 3.3 TBD V
Core power supply
voltage
V DDC TBD 1.2 TBD V Input high voltage V IH TBD V Input low voltage V IL TBD V Input current V IN TBD TBD μA
8.1.3. Power Consumption
Table 4 Power Consumption
Parametes Symbol Condition Estimated Power Unit
Digital supply for I/O ring (3.3V)*V DDR ADSL (ADSL2+
interleaved mode),
Ethernet, PCI are
active
TBD mA
Core power supply voltage (1.2V) V DDC ADSL (ADSL2+
interleaved mode),
Ethernet, PCI active
TBD mA
8.1.4. Reference Crystal
Table 5 Reference Crystal
Parameters Symbol Min Typ Max Unit Center frequency f cf25 MHz Frequency tolerance +-50 ppm
8.1.5. V REF Input
Table 6 V REF Input
Parameters Symbol Min Typ Max Unit Dying gasp trigger level (high to low) V trigger 1.18 V Dying gasp trigger level (low to high) V trigger 1.42 V Thermal drift D Thermal0 V/°C
8.2. AC Characteristics
8.2.1. FLASH – Parallel
Table 7 FLASH Interface Timing
Symbol Parameter Min. Typ. Max. Units Notes T CS The timing interval between
F_CS0#(or F_CS1#) and WE#
ns
T WP The timing interval for WE# to
pulled low (RAS# for read
operation).
ns
Figure 5 Flash Access Timing
8.2.2. FLASH – Serial
TBD
8.2.3. SDRAM 8.2.3.1
SDRAM Input Timing
Table 8
SDRAM Input Timing Symbol Parameter
Min. Typ. Max. Units Notes
T SETUP
Input setup prior to rising edge of clock. Inputs included in this timing are D[15: 0] (during a read operation)
TBD
ns
T HOLD Input hold-time after the rising edge of clock. Inputs include in this timing are D[15: 0] (during a read operation)
TBD TBD ns
Figure 6 SDRAM Input Timing
8.2.3.2 SDRAM Output Timing
Table 9 SDRAM Output Timing
8.2.3.3 SDRAM Access Control Timing
Table 10 SDRAM Control Timing
Symbol Parameter Min. Typ. Max. Units Notes T REFRESH Auto-refresh timing μs
TBD ns T RCD The time interval between
RAS# active and CAS#
active
TBD ns T RP The time interval between
pre-charge and the next
active
TBD ns T RAS The time interval between
active and pre-charge
T RC The time interval between
TBD ns
active and the next active
TBD ns T RFC The time interval between
auto-refresh and active
T CAS_LATENCY The data output delay after
TBD ns
The CAS# active
Figure 8 SDRAM Access Control Timing
8.2.4. AFE
8.2.4.1 Master clock
Table 11 AFE Interface Clock
Symbol Parameter Min. Typ. Max. Units Notes
F Clock frequency 35.328 MHz
T h Clock duty cycle 50 %
8.2.4.2 Transmission Interface
Table 12 AFE TX Interface
Symbol Parameter Min. Typ. Max. Units Notes Tva r Setup time before falling edge of clock. 12 18 ns AFE
latch data
at falling
edge of
clock
8.2.4.3 Reception Interface
Table 13 AFE RX Interface
Symbol Parameter Min. Typ. Max. Units Notes
3 ns
T s Data setup-time prior to falling edge of
clock
T h Data hold-time after falling edge of clock 3 ns
8.2.5. JTAG
Table 14 JTAG Interface Timing
Symbol Parameter Min. Typ. Max. Units Notes T BSCL JTAG clock low time ns
T BSCH JTAG clock high time ns
ns T BSIS TDI, TMS setup time to rising edge of
TCK
T BSIH TDI, TMS hold time from rising edge of
ns
TCK
T BSOH TDO hold time after falling edge of TCK ns
T BSOD TDO output from falling edge of TCK ns
T BSR JTAG reset period ns
ns T BSRS TMS setup time to rising edge of JTAG
reset
T BSRH TMS hold time from rising edge of JTAG
ns
reset