XP1024-BD-EV1中文资料
26.0-31.0 GHz GaAs MMIC Power Amplifier
Features
Chip Device Layout
Balanced Design Provides Good Output Match On-Chip Temperature Compensated Output Power Detector
(1) Measured at +17 dBm per tone output carrier level across the full frequency band.(2) Measured using constant current.
(3) Measured with either Vdet1,2=1.0V or Vdet1,2=5.5V and Rdet=5.6k
April 2007 - Rev 17-Apr-07
XP1024-BD
26.0-31.0 GHz GaAs MMIC Power Amplifier
Power Amplifier Measurements
April 2007 - Rev 17-Apr-07
26.0-31.0 GHz GaAs MMIC Power Amplifier
Power Amplifier Measurements (cont.)
OIP3avg vs. freq, at 13, 15, and 17dBm per tone
O I P 3a v g (d B m )
OIP3avg vs. freq at 15dBm per tone, sample of 5
(Vd = 4V / Vg = -0.55V)
P o u t (d B m )
April 2007 - Rev 17-Apr-07
RF In
DET 1
1
1
1
2
345678
10
9
13
12
11
14
17
16
15
3.90726.0-31.0 GHz GaAs MMIC Power Amplifier
April 2007 - Rev 17-Apr-07
XP1024-BD
App Note [1] Biasing - It is recommended to separately bias the upper and lower amplifiers at Vd(1)=4.5V Id(1+2)=220mA, and
Vd(3,4)=4.5V Id(3a+3b)=Id(4a+4b)=440mA, although best performance will result in separately biasing Vd1 through Vd4, with
Id1=80mA, Id2=140mA, Id3a=Id3b=Id4a=Id4b=220mA. It is recommended to use active biasing to keep the currents constant as the RF power and temperature vary; this gives the most reproducible results. Depending on the supply voltage available and the power dissipation constraints, the bias circuit may be a single transistor or a low power operational amplifier, with a low value resistor in
26.0-31.0 GHz GaAs MMIC Power Amplifier
April 2007 - Rev 17-Apr-07
Device Schematic
26.0-31.0 GHz GaAs MMIC Power Amplifier
Block Diagram
Vd4a
RF In
RF Out
Vg1Vdet2Vdiff2
Vd4b Vg4b Vd3a Vg3b Vg2Stage Arm 3b & 4b
Detector 1
Lange Coupler
Stage Arm 3a & 4a
Detector 2
Lange Coupler
Stages 1 & 2
R=50 Ohm
R=50 Ohm
Vg3a Vd3a Vd1
Vg4a Vdet1Vdiff1
Stages 1 & 2 Schematic
R=50.0
R=250.0
R=250.0
R=50.0
R=500.0
R=5.0
R=5.0
R=16.0
R=5.0
R=16.0
R=5.0
Vd1
Vg1
RF Out
RF IN
Vg2
Detector 2 Schematic
Vdiff2
Vdet2
R=375.0
R=725.0
R=50.0
R=200.0
R=200.0
R=100.0R=50.0
Stages 3 & 4 Schematic
V4a/b
RF In
R=50.0
R=15.0
R=5.0
R=5.0R=400.0
R=50.0
R=5.0
R=15.0
R=5.0
RF Out
Vg3a/b Vd3a/b
Vd4a/b
R=400.0
Detector 1 Schematic
R=200.0
R=100.0Vdet1
RF
R=50.0R=200.0
R=50.0
R=725.0
Vdiff1
R=375.0
April 2007 - Rev 17-Apr-07
Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures:
Do not ingest.
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.Observe government laws and company regulations when discarding this product. This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
26.0-31.0 GHz GaAs MMIC Power Amplifier
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or systems without the express written approval of the President and General Counsel of Mimix
Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a
significant injury to the user. (2) A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded anti-static workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care,sharp tweezers.
Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as
possible. The mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule.Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy Specifications for Bare Die" application note.If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.0012 thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin
eutectic (80% Au 20% Sn) has a melting point of approximately 280 oC (N ote: Gold Germanium should be avoided). The work station temperature should be 310 oC +/- 10 oC. Exposure to these extreme temperatures should be kept to minimum. The collet should be heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during placement.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x
0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum wire should be
avoided. Thermo-compression bonding is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters.
Bonds should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible.
April 2007 - Rev 17-Apr-07
Part Number for Ordering Description
XP1024-BD-000V Where “V” is RoHS compliant die packed in vacuum release gel paks
XP1024-BD-EV1
XP1024 die evaluation module