SN74HC257NSR,SN74HC257D,SN74HC257PWR,SN74HC257DR,规格书,Datasheet 资料

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package Qty

Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp (3)

Samples (Requires Login)

85124012A ACTIVE LCCC FK 201TBD Call TI Call TI 8512401EA ACTIVE CDIP J 161TBD Call TI Call TI

SN54HC257J ACTIVE CDIP J 161TBD

A42

N / A for Pkg Type

SN74HC257D ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DE4ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DG4ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DR ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DRE4ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DRG4ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DT ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DTE4ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DTG4ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74HC257NE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74HC257NSR ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257NSRE4ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257NSRG4ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PW ACTIVE TSSOP PW 1690Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PWE4

ACTIVE

TSSOP

PW

16

90

Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

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Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

SN74HC257PWG4ACTIVE TSSOP PW 1690

Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM SN74HC257PWLE OBSOLETE TSSOP PW 16TBD Call TI

Call TI

SN74HC257PWR ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PWRE4ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PWRG4ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PWT ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PWTE4ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PWTG4ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258D ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DE4ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DG4ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DR ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DRE4ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DRG4ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DT ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DTE4ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DTG4ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74HC258NE4

ACTIVE

PDIP

N

16

25

Pb-Free (RoHS)

CU NIPDAU N / A for Pkg Type

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Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

SN74HC258NSR ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258NSRE4ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258NSRG4ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PW ACTIVE TSSOP PW 1690Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWE4ACTIVE TSSOP PW 1690Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWG4ACTIVE TSSOP PW 1690Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWR ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWRE4ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWRG4ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWT ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWTE4ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWTG4ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM SNJ54HC257FK ACTIVE LCCC FK 201TBD POST-PLATE N / A for Pkg Type

SNJ54HC257J

ACTIVE

CDIP

J

16

1

TBD

A42

N / A for Pkg Type

(1)

The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check https://www.wendangku.net/doc/0e4662117.html,/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

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Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN54HC257, SN74HC257 :

?Catalog: SN74HC257

?Military: SN54HC257

NOTE: Qualified Version Definitions:

?Catalog - TI's standard catalog product

?Military - QML certified for Military and Defense Applications

Addendum-Page 4

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TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Type Package Drawing Pins SPQ

Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74HC257DR SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1SN74HC257NSR SO NS 162000330.016.48.210.5 2.512.016.0Q1SN74HC257PWR TSSOP PW 162000330.012.4 6.9 5.6 1.68.012.0Q1SN74HC257PWT TSSOP PW 16250330.012.4 6.9 5.6 1.68.012.0Q1SN74HC258DR SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1SN74HC258NSR SO NS 162000330.016.48.210.5 2.512.016.0Q1SN74HC258PWR TSSOP PW 162000330.012.4 6.9 5.6 1.68.012.0Q1SN74HC258PWT

TSSOP

PW

16

250

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74HC257DR SOIC D162500333.2345.928.6 SN74HC257NSR SO NS162000367.0367.038.0 SN74HC257PWR TSSOP PW162000367.0367.035.0 SN74HC257PWT TSSOP PW16250367.0367.035.0 SN74HC258DR SOIC D162500333.2345.928.6 SN74HC258NSR SO NS162000367.0367.038.0 SN74HC258PWR TSSOP PW162000367.0367.035.0

SN74HC258PWT TSSOP PW16250367.0367.035.0