当前位置：文档库 › CD54AC245_08中文资料

CD54AC245_08中文资料

Data sheet acquired from Harris Semiconductor

SCHS245B

Features

?Buffered Inputs

?Typical Propagation Delay

-4ns at V CC = 5V, T A = 25o C, C L = 50pF ?Exceeds 2kV ESD Protection per MIL-STD-883,Method 3015

?SCR-Latchup-Resistant CMOS Process and Circuit Design ?Speed of Bipolar FAST?/AS/S with Signi?cantly Reduced Power Consumption ?Balanced Propagation Delays

?AC Types Feature 1.5V to 5.5V Operation and Balanced Noise Immunity at 30% of the Supply ?±24mA Output Drive Current -Fanout to 15 FAST? ICs

-Drives 50? Transmission Lines

Description

The ’AC245and ’ACT245are octal-bus transceivers that utilize Advanced CMOS Logic technology.They are non-inverting three-state bidirectional transceiver-buffers intended for two-way transmission from “A”bus to “B”bus or “B”bus to “A”.The logic level present on the direction input (DIR)determines the data direction.When the output enable input (OE)is HIGH,the outputs are in the high-impedance state.

Pinout

CD54AC245, CD54ACT245

(CERDIP)

CD74AC245, CD74ACT245

(PDIP , SOIC, SSOP)

TOP VIEW

Ordering Information

PART NUMBER

TEMP.RANGE (o C)PACKAGE CD54AC245F3A -55 to 12520 Ld CERDIP CD74AC245E -55 to 12520 Ld PDIP CD74AC245M -55 to 12520 Ld SOIC CD74AC245SM -55 to 12520 Ld SSOP CD54ACT245F3A -55 to 12520 Ld CERDIP CD74ACT245E -55 to 12520 Ld PDIP CD74ACT245M -55 to 12520 Ld SOIC CD74ACT245SM -55 to 125

20 Ld SSOP

NOTES:

1.When ordering,use the entire part number.Add the suffix 96to obtain the variant in the tape and reel.

2.Wafer and die for this part number is available which meets all

electrical specifications.Please contact your local TI sales office or customer service for ordering information.

1112131415161718201910

87654321DIR A0A1A2A3A4A6A5A7

GND V CC B0B1B2OE B3B4B5B6B7

September 1998 - Revised October 2000

CD54/74AC245,CD54/74ACT245

Octal-Bus Transceiver,Three-State, Non-Inverting

[ /Title (CD74AC245,

CD74ACT245)/Sub-ject (Octal-Bus Trans-ceiver,Three-State,Non-Invert-ing)/Autho r ()/Key-words (Har-ris Semi-con-ductor,Advan ced CMOS ,Harris Semi-con-

元器件交易网https://www.wendangku.net/doc/1314513531.html,

Functional Diagram

TRUTH TABLE

CONTROL INPUTS OPERATION

OE DIR L L B Data to A Bus L H A Data to B Bus H

Isolation

H = High Level, L = Low Level, X = Irrelevant

To prevent excess currents in the High-Z (isolation)modes,all I/O terminals should be terminated with 10k ? to 1M ? resistors.

181716151311

12142B0B1B2B3B4B5B6B7

DIR 1

35678A0A1A2A3A4A5A6A7

Absolute Maximum Ratings Thermal Information

DC Supply Voltage, V CC. . . . . . . . . . . . . . . . . . . . . . . .-0.5V to 6V DC Input Diode Current, I IK

For V I < -0.5V or V I > V CC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, I OK

For V O < -0.5V or V O > V CC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA DC Output Source or Sink Current per Output Pin, I O

For V O > -0.5V or V O < V CC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA DC V CC or Ground Current, I CC or I GND (Note 3) . . . . . . . . .±100mA Operating Conditions

Temperature Range, T A . . . . . . . . . . . . . . . . . . . . . .-55o C to 125o C Supply Voltage Range, V CC (Note 4)

AC T ypes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V ACT T ypes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, V I, V O . . . . . . . . . . . . . . . . .0V to V CC Input Rise and Fall Slew Rate, dt/dv

AC T ypes, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . .50ns (Max) AC T ypes, 3.6V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . .20ns (Max) ACT T ypes, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . .10ns (Max)Thermal Resistance (T ypical, Note 5)θJA (o C/W) E Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69

M Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58

SM Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70 Maximum Junction T emperature (Plastic Package) . . . . . . . . . .150o C Maximum Storage Temperature Range . . . . . . . . . .-65o C to 150o C Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . .300o C

CAUTION:Stresses above those listed in“Absolute Maximum Ratings”may cause permanent damage to the device.This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not implied.

NOTES:

3.For up to 4 outputs per device, add±25mA for each additional output.

4.Unless otherwise specified, all voltages are referenced to ground.

5.The package thermal impedance is calculated in accordance with JESD 51-7.

DC Electrical Speci?cations

PARAMETER SYMBOL

TEST

CONDITIONS

V CC

(V)

25o C

-40o C TO

85o C

-55o C TO

125o C

UNITS V I(V)I O(mA)MIN MAX MIN MAX MIN MAX

AC TYPES

High Level Input Voltage V IH-- 1.5 1.2- 1.2- 1.2-V

3 2.1- 2.1- 2.1-V

5.5 3.85- 3.85- 3.85-V Low Level Input Voltage V IL-- 1.5-0.3-0.3-0.3V

3-0.9-0.9-0.9V

5.5- 1.65- 1.65- 1.65V High Level Output Voltage V OH V IH or V IL-0.05 1.5 1.4- 1.4- 1.4-V

-0.053 2.9- 2.9- 2.9-V

-0.05 4.5 4.4- 4.4- 4.4-V

-43 2.58- 2.48- 2.4-V

-24 4.5 3.94- 3.8- 3.7-V

-75

(Note 6, 7)

5.5-- 3.85---V

-50

(Note 6, 7)

5.5---- 3.85-V

Low Level Output Voltage

V OL

V IH or V IL

0.05 1.5-0.1-0.1-0.1V 0.053-0.1-0.1-0.1V 0.05 4.5-0.1-0.1-0.1V 123-0.36-0.44-0.5V 24 4.5-0.36-0.44-0.5V 75(Note 6, 7) 5.5--- 1.65--V 50(Note 6, 7)

5.5----- 1.65V Input Leakage Current I I V CC or GND - 5.5-±0.1-±1-±1μA Three-State Leakage Current

I OZ

V IH or V IL V O =V CC or GND - 5.5

-±0.5

-±5

-±10

μA

Quiescent Supply Current MSI I CC

V CC or GND

0 5.5-8-80-160μA

ACT TYPES

High Level Input Voltage V IH -- 4.5 to 5.52-2-2-V Low Level Input Voltage V IL -- 4.5 to 5.5-0.8-0.8-0.8V High Level Output Voltage

V OH

V IH or V IL

-0.05 4.5 4.4- 4.4- 4.4-V -24 4.5 3.94- 3.8- 3.7-V -75(Note 6, 7) 5.5-- 3.85---V -50(Note 6, 7)

5.5---- 3.85-V Low Level Output Voltage

V OL

V IH or V IL

0.05 4.5-0.1-0.1-0.1V 24 4.5-0.36-0.44-0.5V 75(Note 6, 7) 5.5--- 1.65--V 50(Note 6, 7)

5.5----- 1.65V Input Leakage Current I I V CC or GND - 5.5-±0.1-±1-±1μA Three-State or Leakage Current

I OZ

V IH or V IL V O =V CC or GND - 5.5

-±0.5

-±5

-±10

μA

Quiescent Supply Current MSI

I CC V CC or GND 0 5.5-8-80-160μA Additional Supply Current per Input Pin TTL Inputs High 1 Unit Load ?I CC

V CC -2.1

4.5 to

5.5

2.4

2.8

NOTES:

6.Test one output at a time for a 1-second maximum duration.Measurement is made by forcing current and measuring voltage to minimize power dissipation.

7.Test verifies a minimum 50? transmission-line-drive capability at 85o C, 75? at 125o C.

DC Electrical Speci?cations

(Continued)

PARAMETER

SYMBOL TEST CONDITIONS

V CC (V)25o C -40o C TO 85o C -55o C TO 125o C UNITS V I (V)I O (mA)MIN MAX MIN MAX MIN MAX

ACT Input Load Table

INPUT UNIT LOAD

An, Bn0.83

OE0.64

DIR0.25

NOTE:Unit load is?I CC limit specified in DC Electrical Specifications

T able, e.g., 2.4mA max at 25o C.

Switching Speci?cations Input t r, t f = 3ns, C L= 50pF (Worst Case)

PARAMETER SYMBOL V CC (V)

-40o C TO 85o C-55o C TO 125o C

UNITS MIN TYP MAX MIN TYP MAX

AC TYPES

Propagation Delay, Data to Output t PLH, t PHL 1.5--96--106ns

3.3

(Note 9)

3.2-10.83-11.9ns

(Note 10)

2.2-7.7 2.1-8.5ns

Propagation Delay, Output Disable to Output t PLZ, t PHZ 1.5--159--175ns

3.3

4.7-1

5.9 4.4-17.5ns

5 3.7-12.7 3.5-14ns

Propagation Delay, Output Enable to Output t PZL, t PZH 1.5--159--175ns

3.3 5.6-19 5.3-21ns

5 3.7-12.7 3.5-14ns

Minimum (Valley) V OH During Switching of Other Outputs (Output Under Test Not Switching)

V OHV

See Figure 1

5- 4 at

25o C

-- 4 at

25o C

-V

Maximum (Peak) V OL During Switching of Other Outputs (Output Under Test Not Switching)

V OLP

See Figure 1

5- 1 at

25o C

-- 1 at

25o C

-V

Three-State Output Capacitance C O--15--15-pF Input Capacitance C I---10--10pF Power Dissipation Capacitance C PD

(Note 11)

--57--57-pF ACT TYPES

Propagation Delay, Data to Output t PLH, t PHL5

(Note 10)

2.7-9.1 2.5-10ns

Propagation Delay,

Output Disable to Output

t PLZ, t PHZ5 3.712.7 3.514ns

Propagation Delay,

Output Enable to Output

t PZL, t PZH5 3.813.1 3.614.4ns

Minimum (Valley) V OH During Switching of Other Outputs (Output Under Test Not Switching)

V OHV

See Figure 1

5- 4 at

25o C

-- 4 at

25o C

-V

Maximum (Peak) V OL During Switching of Other Outputs (Output Under Test Not Switching)

V OLP

See Figure 1

5- 1 at

25o C

-- 1 at

25o C

-V

Three-State Output Capacitance C O --15--15-pF Input Capacitance

C I ---10--10pF Power Dissipation Capacitance C P

D (Note 11)

--57

-pF

NOTES:

8.Limits tested 100%

9.3.3V Min is at 3.6V, Max is at 3V.10.5V Min is at 5.5V, Max is at 4.5V.

11.C PD is used to determine the dynamic power consumption per channel.

AC: P D = V CC 2 f i (C PD + C L )

ACT: P D = V CC 2 f i (C PD + C L ) + V CC ?I CC where f i = input frequency, C L = output load capacitance, V CC = supply voltage.

NOTES:

12.Input pulses have the following characteristics: PRR ≤ 1MHz, t r = 3ns, SKEW 1ns.

13.R.F.fixture with 700MHz design rules required.IC should be soldered into test board and bypassed with 0.1μF capacitor.Scope and

probes require 700MHz bandwidth.

FIGURE 1.SIMULTANEOUS SWITCHING TRANSIENT WAVEFORMS

Switching Speci?cations Input t r , t f = 3ns, C L = 50pF (Worst Case)

(Continued)

PARAMETER

SYMBOL V CC (V)

-40o C TO 85o C

-55o C TO 125o C

UNITS MIN TYP MAX MIN TYP MAX OTHER OUTPUTS

OUTPUT UNDER TEST

V OH V OL

V OHV V OLP V OL

V OH

NOTE:

14.For AC Series only: When V CC = 1.5V, R L = 1k ?.

FIGURE 2.THREE-STATE PROPAGATION DELAY TIMES AND TEST CIRCUIT

FIGURE 3.PROPAGATION DELAY TIMES

DUT WITH THREE-STATE OTHER INPUTS TIED HIGH OR LOW OUTPUT DISABLE

GND (t PHZ , t PZH )

OPEN (t PHL , t PLH )OUTPUT

R L C L

50pF

2 V CC (t PLZ , t PZL )(OPEN DRAIN)500?R L

500?

OUT INPUT LEVEL

90%V S 10%

GND

t r = 3ns

t PZL

0.2 V CC

V OL (≠V CC )

0.8 V CC OUTPUTS ENABLED

OUTPUTS DISABLED

V S

OUTPUTS ENABLED

t PLZ

t PHZ

t PZH

OUTPUTS DISABLED

t f = 3ns

OUTPUT:LOW TO OFF

TO LOW

OUTPUT:HIGH TO OFF

TO HIGH

(NOTE 14)

t r = 3ns

INPUT LEVEL An GND

t PLH t f = 3ns

90%V S 10%V S

t PHL DUT OUTPUT

R L (NOTE)OUTPUT LOAD

500?

C L 50pF

NOTE:For AC Series Only: When V CC = 1.5V , R L = 1k ?.

FIGURE 4.PROPAGATION DELAY TIMES

ACT Input Level

V CC 3V Input Switching Voltage, V S 0.5 V CC 1.5V Output Switching Voltage, V S

0.5 V CC

PACKAGING INFORMATION

Orderable Device Status(1)Package

Type Package

Drawing

Pins Package

Qty

Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)

CD54AC245F3A ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type CD54ACT245F3A ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type CD74AC245E ACTIVE PDIP N2020Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

CD74AC245EE4ACTIVE PDIP N2020Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

CD74AC245M ACTIVE SOIC DW2025Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74AC245M96ACTIVE SOIC DW202000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74AC245M96E4ACTIVE SOIC DW202000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74AC245M96G4ACTIVE SOIC DW202000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74AC245ME4ACTIVE SOIC DW2025Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74AC245MG4ACTIVE SOIC DW2025Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74AC245SM OBSOLETE SSOP DB20Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74AC245SM96ACTIVE SSOP DB202000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74AC245SM96E4ACTIVE SSOP DB202000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74AC245SM96G4ACTIVE SSOP DB202000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74ACT245E ACTIVE PDIP N2020Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

CD74ACT245EE4ACTIVE PDIP N2020Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

CD74ACT245M ACTIVE SOIC DW2025Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74ACT245M96ACTIVE SOIC DW202000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74ACT245M96E4ACTIVE SOIC DW202000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74ACT245M96G4ACTIVE SOIC DW202000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74ACT245ME4ACTIVE SOIC DW2025Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74ACT245MG4ACTIVE SOIC DW2025Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74ACT245SM OBSOLETE SSOP DB20Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74ACT245SM96ACTIVE SSOP DB202000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74ACT245SM96E4ACTIVE SSOP DB202000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD74ACT245SM96G4ACTIVE SSOP DB202000Green(RoHS&CU NIPDAU Level-1-260C-UNLIM

Orderable Device Status(1)Package

Type Package

Drawing

Pins Package

Qty

Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)

no Sb/Br)

(1)The marketing status values are defined as follows:

ACTIVE:Product device recommended for new designs.

LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.

NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.

PREVIEW:Device has been announced but is not in production.Samples may or may not be available.

OBSOLETE:TI has discontinued the production of the device.

(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check https://www.wendangku.net/doc/1314513531.html,/productcontent for the latest availability information and additional product content details.

TBD:The Pb-Free/Green conversion plan has not been defined.

Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.

Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)

(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Type Package Drawing Pins SPQ

Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)

P1(mm)W (mm)Pin1Quadrant CD74AC245M96SOIC DW 202000330.024.410.813.0 2.712.024.0Q1CD74AC245SM96SSOP DB 202000330.016.48.27.5 2.512.016.0Q1CD74ACT245M96SOIC DW 202000330.024.410.813.0 2.712.024.0Q1CD74ACT245SM96

SSOP

2000

330.0

16.4

8.2

7.5

2.5

12.0

16.0

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) CD74AC245M96SOIC DW202000346.0346.041.0 CD74AC245SM96SSOP DB202000346.0346.033.0 CD74ACT245M96SOIC DW202000346.0346.041.0 CD74ACT245SM96SSOP DB202000346.0346.033.0

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are https://www.wendangku.net/doc/1314513531.html,rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement https://www.wendangku.net/doc/1314513531.html,e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered https://www.wendangku.net/doc/1314513531.html,rmation of third parties may be subject to additional restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers Audio

Data Converters Automotive

DSP Broadband

Clocks and Timers Digital Control

Interface Medical

Logic Military

Power Mgmt Optical Networking

Microcontrollers Security

RFID Telephony

RF/IF and ZigBee?Solutions Video&Imaging

Wireless

Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265