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MLX92215LSE

Features and Benefits

Operating Voltage from 2.7V to 24V

Two Integrated Hall plates for Direction Detection Latching Magnetic Characteristics

Speed & Direction Open-Drain Outputs

Direction Output updated prior Speed Output Excellent Temperature Stability Reverse Supply Voltage Protection

Output Current Limitation and Auto-Shutoff

Under-Voltage Lockout Protection

Application Examples

Windows lifter with Anti-Pinch feature Rotation speed & direction detection Linear speed & direction detection Angular position detection

Power closures with Anti-Pinch features

Ordering Information

Part No.

Temperature Code Sensitivity Package Code

Packing Form

MLX92251LSE-AAA-000-RE L (-40°C to 150°C) +- 7.5 mT SE (TSOT-5L) RE (Tape & Reel) MLX92251LSE-ABA-000-RE

L (-40°C to 150°C)

+- 2.5 mT SE (TSOT-5L)

RE (Tape & Reel)

1 Functional Diagram

2 General Description

The Melexis MLX92251 is a second generation Hall-effect dual latch designed in mixed signal CMOS technology. The device integrates a voltage regulator, two Hall sensors with advanced offset cancellation system and two open-drain output drivers, all in a single package.

Two Hall plates are integrated on the same piece of silicon, thus using the high precision of the wafer fabrication process to ensure a fixed

spacing of 1.45mm between the sensing elements. The first Hall plate signal is used to provide the speed signal output. The combination of both the first and second Hall plate signals is then internally processed to directly deliver a direction signal output.

The MLX92251 shares the MLX922xx-based platform, synonym of high performance in terms of electrical specification, magnetic specification and protection level.

With latching magnetic characteristics, the speed (SP) output is turned low or high respectively with a sufficiently strong South or North pole facing the package top side. When removing the magnetic field, the device keeps its previous state.

The direction (DIR) output is latched in Low or High state depending on the movement direction of the applied magnetic field, as a result of certain magnetic pulse sequence on both Hall sensors.

The MLX92251 is delivered in a Green compliant 5-pin Thin Small Outline Transistor (TSOT) for surface-mount process.

Table of Contents

1 Functional Diagram (1)

2 General Description (1)

3 Glossary of Terms (3)

4 Absolute Maximum Ratings (3)

5 General Electrical Specifications (4)

6 Magnetic Specifications (5)

6.1 MLX92251LSE-AAA-000 (5)

6.2 MLX92251LSE-ABA-000 (5)

7 Output Behaviour versus Magnetic Pole (6)

8 Application Information (7)

8.1 Default Application Schematic (7)

8.2 Recommended Application Schematic for ISO7637-2 (pulses 5a and 5b) (7)

8.3 Speed (SP) Output Behavior vs. B OP/B RP (7)

8.4 Output Jitter, Speed Signal Delay and Direction Detection (8)

8.5 UV lockout and POR behaviour (8)

9 Performance Graphs (9)

9.1 Magnetic parameters vs. T A (9)

9.2 Magnetic parameters vs. V DD (9)

9.3 V DSON vs. T A (9)

9.4 V DSON vs. V DD (9)

9.5 I DD vs. T A (9)

9.6 I DD vs. V DD (9)

9.7 I LEAK vs. T A (10)

9.8 I LEAK vs. V DD (10)

9.9 Power Derating vs. T A (10)

10 Standard information regarding manufacturability of Melexis products with different soldering processes (11)

11 ESD Precautions (11)

12 SE Package Information (12)

12.1 Pin Definitions and Descriptions (12)

13 Disclaimer (13)

3 Glossary of Terms

MilliTesla (mT), Gauss Units of magnetic flux density: 1mT = 10 Gauss

RoHS Restriction of Hazardous Substances

TSOT Thin Small Outline Transistor (TSOT package) – also referred with the Melexis

package code “SE”

ESD Electro-Static Discharge

4 Absolute Maximum Ratings

Parameter Symbol Value Units

Supply Voltage V DD+27V

Supply Current I DD+20mA

Reverse Supply Voltage V DDREV-27V

Reverse Supply Current I DDREV-20mA

Output Voltage V OUT+27V

Output Current I OUT+20mA

Reverse Output Voltage V OUTREV-0.5V

Reverse Output Current I OUTREV-50mA

Operating Temperature Range T A-40 to +150C

Storage Temperature Range T S-55 to +165C

Maximum Junction Temperature T J+165C

ESD Sensitivity – HBM (1)-2500V

ESD Sensitivity – CDM (2)-1000V

Magnetic Flux Density B Unlimited mT

Table 1. Absolute maximum ratings

Exceeding the absolute maximum ratings may cause permanent damage.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

__________________

1Human Body Model according AEC-Q100-002 standard.

2Charged Device Model according AEC-Q100-011 standard.

5 General Electrical Specifications

DC Operating Parameters T A = -40°C to 150°C, V DD = 2.7V to 24V (unless otherwise specified) Parameter Symbol Test Conditions Min Typ (1) Max Units Supply Voltage V DD Operating 2.7 - 24 V Supply Current I DD V DD = 12V

3 4.5 7 mA Reverse Supply Current I DDREV V DD = -18V

1 mA Output Leakage Current I OFF V OUT = 12V, V DD = 12V, B < B RP 0.1 10 μA Output Saturation Voltage V OUTS B > B OP , I OUT = 10mA

0.2 0.5 V

Output Rise/Fall Time (2,3)

t R / t F V DD = 12V, V PU (4) = 5V, R PU = 1kΩ, C L = 50pF 0.1 0.3 1 μs Output Current Limit

I CL B > B OP , V OUT = 12V 14 25 44 mA Output ON Time under Current Limit conditions (5)

t CLON

B > B OP , V PU = 12V, R PU = 100Ω 150 230 μs Output OFF Time under Current

Limit conditions (5)

t CLOFF

B > B OP , V PU = 12V, R PU = 100Ω 3.5 ms Chopping Frequency f CHOP 400 kHz Speed Signal Delay

(2,6)

t SPD

0.4 0.85 1.6 μs Output Refresh Period t PER

3.2 5 8.4 μs

Output Jitter (p-p value) (2)

t JITTER

Over 1000 successive output switching

events @1kHz square wave, B PEAK = 50mT, t RISE =t FALL ≤100μs

±2.6 μs Maximum Switching Frequency (2,7)

f SW ≥30mT square wave magnetic field 40 66 kHz Power-On Time (8)

t PON V DD = 5V, dV DD /dt > 2V/μs 16 35 μs Under-voltage Lockout Threshold V UVL 2.2 2.4 2.7 V Under-voltage Lockout Reaction time (2)

t UVL

1 μs SE Package Thermal Resistance R TH

Single layer (1S) JEDEC board

300

°C/W

Table 2: electrical specifications

1 Typical values are defined at T A = +25oC and V DD = 12V

2 Based on device characterization results, not subject to production test

3 Measured between 0.1*V PU and 0.9*V PU

4 R PU and V PU are respectively the external pull-up resistor and pull-up power supply

5 If the Output is in Current Limitation longer than t CLON the Output is switched off in high-impedance state. The Output returns back in active state at next reaching of

B OP or after t CLOFF time interval

6 Controlled delay between direction (DIR) signal update and speed (SP) signal update

7 Maximum switching frequency corresponds to the maximum frequency of the applied magnetic field which is detected without loss of pulses 8 The Power-On Time represents the time from reaching V DD = 2.7V to the first refresh of the SP output

6 Magnetic Specifications

6.1 MLX92251LSE-AAA-000

DC Operating Parameters V DD = 2.7V to 24V and T A =-40°C to 150°C (unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Units Operating Point B OP 5 7.5 10 mT Release Point B RP

-10 -7.5 -5 mT Magnetic Matching B MATCH B OP1 – B OP2 or B RP1 – B RP2, T A = 25°C -2 2 mT B OP1 – B OP2 or B RP1 – B RP2 -3 3 mT Magnetic Offset

B OFF (B OP1 + B RP1) / 2, (B OP2 + B RP2) / 2 -2 2 mT Temperature Coefficient (1)

TC 0 ppm/°C Hall Sensors Spacing

1.45

Table 3: Magnetic specifications

6.2 MLX92251LSE-ABA-000

DC Operating Parameters V DD = 2.7V to 24V and T A =-40°C to 150°C (unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Units Operating Point B OP 0.6 2.5 4.5 mT Release Point B RP

-4.5 -2.5 -0.6 mT Magnetic Matching B MATCH B OP1 – B OP2 or B RP1 – B RP2, T A = 25°C -2 2 mT B OP1 – B OP2 or B RP1 – B RP2 -3 3 mT Magnetic Offset

B OFF (B OP1 + B RP1) / 2, (B OP2 + B RP2) / 2 -2 2 mT Temperature Coefficient (1) T

C -1100 ppm/°C Hall Sensors Spacing

1.45

Table 3: Magnetic specifications

1 Temperature coefficient value is guaranteed by design and verified by characterization and is calculated using the following formula

()C

T C T C ppm T T B B B o o o C T T o 150 ;40 ;/,10*21612251

2=?=?×?

7 Output Behaviour versus Magnetic Pole

DC Operating Parameters T A = -40°C to 150°C, V DD = 2.7V to 24V (unless otherwise specified) Parameter Test Conditions SP Output State South pole B > B OP Low North pole B < B RP High (2)

Table 4: Output behaviour versus magnetic pole (3)

2 Default SP output state during power-up

3 Magnetic pole applied perpendicularly to Hall plate “H1”, facing the branded/top side of the package

4 Default magnetic and DIR output state during power-up

Direction

Step H1 H2 DIR Output State

CCW

n x N S Low

n (x + 1) N N n (x + 2) S N n (x + 3) S S n (x + 4) ≡ n x

N S

Direction Step

H1 H2 DIR Output State

n x

High (4)

n (x + 1) S S n (x + 2) S N n (x + 3) N (4) N (4) n (x + 4) ≡ n x N S

8 Application Information

8.1 Default Application Schematic

8.2 Recommended Application Schematic for ISO7637-2 (pulses 5a and 5b)

Notes:

1. Recommended for conducted transients on supply line above 32V with duration above 500ms.

2. Recommended for conducted transients on supply line above 36V.

3. Recommended zener diode Z1 is BZX55C27 or equivalent.

8.3 Speed (SP) Output Behavior vs. B OP/B RP

8.4 Output Jitter, Speed Signal Delay and Direction Detection

8.5 UV lockout and POR behaviour

9 Performance Graphs

9.1 Magnetic parameters vs. T A

9.2 Magnetic parameters vs. V

9.3 V DSON vs. T

9.4 V DSON vs. V

9.5 I DD vs. T

9.6 I DD vs. V

9.7 I LEAK vs. T

9.8 I LEAK vs. V

9.9 Power Derating vs. T

10 Standard information regarding manufacturability of Melexis products with different soldering processes

Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods:

Reflow Soldering SMD’s (Surface Mount Devices)

?IPC/JEDEC J-STD-020

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

(classification reflow profiles according to table 5-2)

?EIA/JEDEC JESD22-A113

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

(reflow profiles according to table 2)

Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

?EN60749-20

Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat

?EIA/JEDEC JESD22-B106 and EN60749-15

Resistance to soldering temperature for through-hole mounted devices

Iron Soldering THD’s (Through Hole Devices)

?EN60749-15

Resistance to soldering temperature for through-hole mounted devices

Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

?EIA/JEDEC JESD22-B102 and EN60749-21

Solderability

For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis.

The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board.

Melexis recommends reviewing on our web site the General Guidelines soldering recommendation

(https://www.wendangku.net/doc/1a15283088.html,/Quality_soldering.aspx) as well as trim&form recommendations

(https://www.wendangku.net/doc/1a15283088.html,/Assets/Trim-and-form-recommendations-5565.aspx).

Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: https://www.wendangku.net/doc/1a15283088.html,/quality.aspx

11 ESD Precautions

Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).

Always observe Electro Static Discharge control procedures whenever handling semiconductor products.

SE Pin № Name Type Function

1 SP Output Speed Open-Drain Output

2 DIR Output Direction Open-Drain Output

3 VDD Supply Power Supply

4 GND Ground Ground pin

5 GND Ground Ground pin

12 SE Package Information

2.75 BSC

+/-0.20

SEATING PLANE

0.40

SECTION B-B’

Notes:

1. All dimensions are in millimeters

2. Outermost plastic extreme width does not include mold flash or protrusions. Mold flash and protrusions shall not exceed 0.15mm per side.

3. Outermost plastic extreme length does not include mold flash or protrusions. Mold flash and protrusions shall not exceed 0.25mm per side.

4. The lead width dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.07mm total in excess of the lead width dimension at maximum material condition.

5. Dimension is the length of terminal for soldering to a substrate.

6. Formed lead shall be planar with respect to one another with 0.076mm at seating plane.

7. This part is compliant with JEDEC specification MO-193. This part is full compliance to EIAJ specification SC-74.

Marking:

Top Side: ●51A – Name of the Device (MLX92251AA)Bottom Side: xyww x = last digit of lot number

y = last digit of year ww = week

12° REF.

12.1 Pin Definitions and Descriptions

13 Disclaimer

Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application.

The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services.

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