FEATURES
?High-speed access time: 70, 100, and 120 ns ?CMOS low power operation
– 120 mW (typical) operating
– 6 μW (typical) CMOS standby
?TTL compatible interface levels
?Single 3V ± 10% V CC power supply
?Fully static operation: no clock or refresh required
?Three state outputs
?Data control for upper and lower bytes ?Industrial temperature available
?Available in the 44-pin TSOP (Type II) and 48-pin mini BGA DESCRIPTION
The ISSI IS62LV12816L is a high-speed, 2,097,152-bit static RAM organized as 131,072 words by 16 bits. It is fabricated using ISSI's high-performance CMOS technology. This highly reliable process coupled with innovative circuit design techniques, yields high-performance and low power consumption devices.
When CE is HIGH (deselected), the device assumes a standby mode at which the power dissipation can be reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable and Output Enable inputs, CE and OE. The active LOW Write Enable (WE) controls both writing and reading of the memory.
A data byte allows Upper Byte (UB) and Lower Byte (LB) access.
The IS62LV12816L is packaged in the JEDEC standard 44-pin TSOP (Type II) and 48-pin mini BGA.
The specification contains ADVANCE INFORMATION. ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. ? Copyright 1998, Integrated Silicon Solution, Inc.
IS62LV12816L
2Integrated Silicon Solution, Inc.
ADVANCE INFORMATION SR002-0C
ISSI
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PIN CONFIGURATIONS 44-Pin TSOP (Type II)
TRUTH TABLE
I/O PIN
Mode
WE CE OE LB UB I/O0-I/O7I/O8-I/O15Vcc Current Not Selected X H X X X High-Z High-Z I SB 1, I SB 2
Output Disabled H L H X X High-Z High-Z I CC
X L X H H High-Z High-Z Read
H L L L H D OUT High-Z I CC
H L L H L High-Z D OUT H L L L L D OUT D OUT Write L L X L H D IN High-Z I CC
L L X H L High-Z D IN L
L
X
L
L
D IN
D IN
PIN DESCRIPTIONS
A0-A16Address Inputs I/O0-I/O15Data Inputs/Outputs CE
Chip Enable Input OE Output Enable Input WE
Write Enable Input
LB Lower-byte Control (I/O0-I/O7)UB Upper-byte Control (I/O8-I/O15)NC No Connection Vcc Power GND
Ground
48-Pin mini BGA
IS62LV12816L
ISSI
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POWER SUPPLY CHARACTERISTICS (1) (Over Operating Range)
-70-100-120Symbol Parameter Test Conditions Min.Max.Min.Max.Min.Max.Unit I CC Vcc Dynamic Operating V CC = Max.,
Com.—40—30—20mA Supply Current I OUT = 0 mA, f = f MAX Ind.—60—50—40I SB 1
TTL Standby Current V CC = Max.,Com.—0.4—0.4—0.4mA
(TTL Inputs)
V IN = V IH or V IL Ind.— 1.0— 1.0— 1.0CE ≥ V IH , f = 0I SB 2CMOS Standby
V CC = Max.,
Com.—15—15—15μA
Current (CMOS Inputs)
CE ≥ V CC – 0.2V,Ind.
—
25
—
25
—
25
V IN ≥ V CC – 0.2V, or V IN ≤ 0.2V, f = 0
Note:
1.At f = f MAX , address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter
Test Conditions Min.Max.Unit V OH Output HIGH Voltage V CC = Min., I OH = –1 mA 2.0—V V OL Output LOW Voltage V CC = Min., I OL = 2.1 mA
—0.4V V IH Input HIGH Voltage 2.2V CC + 0.2V V IL (1)Input LOW Voltage –0.20.4V I LI Input Leakage GND ≤ V IN ≤ V CC
–11μA I LO
Output Leakage
GND ≤ V OUT ≤ V CC , Outputs Disabled –1
1
μA
Notes:
1.V IL (min.) = –
2.0V for pulse width less than 10 ns.
ABSOLUTE MAXIMUM RATINGS (1)
Symbol Parameter
Value
Unit V TERM Terminal Voltage with Respect to GND –0.5 to Vcc+0.5V T BIAS Temperature Under Bias –40 to +85°C V CC Vcc Related to GND –0.3 to +4.0V T STG Storage Temperature –65 to +150
°C P T
Power Dissipation
1.0
W
Note:
1.Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
OPERATING RANGE
Range
Ambient Temperature
V CC
Commercial 0°C to +70°C 3.0V ± 10%Industrial
–40°C to +85°C
3.0V ± 10%
IS62LV12816L
4Integrated Silicon Solution, Inc.
ADVANCE INFORMATION SR002-0C
ISSI
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AC TEST CONDITIONS
Parameter
Unit Input Pulse Level
0.4V to 2.2V
Input Rise and Fall Times 5 ns Input and Output Timing 1.5V and Reference Level Output Load
See Figures 1 and 2
AC TEST LOADS
CAPACITANCE (1)
Symbol Parameter Conditions Max.Unit C IN Input Capacitance V IN = 0V 6pF C OUT
Input/Output Capacitance
V OUT = 0V
8
pF
Note:
1.Tested initially and after any design or process changes that may affect these parameters.
Figure 1
Figure 2
IS62LV12816L
ISSI
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READ CYCLE SWITCHING CHARACTERISTICS (1) (Over Operating Range)
-70
-100-120Symbol
Parameter Min.Max.Min.Max.Min.Max.Unit t RC Read Cycle Time 70—100—120—ns t AA Address Access Time —70—100—120ns t OHA Output Hold Time 10—15—15—ns t ACE CE Access Time —70—100—120ns t DOE OE Access Time —35—50—60ns t HZOE (2)OE to High-Z Output —25—30040ns t LZOE (2)OE to Low-Z Output 5—5—5—ns t HZCE (2)CE to High-Z Output 025030040ns t LZCE (2)CE to Low-Z Output 10—10—10—ns t BA LB , UB Access Time —35—50—60ns t HZB LB , UB to High-Z Output 025035050ns t LZB
LB , UB to Low-Z Output
—
—
—
ns
Notes:
1.Test conditions assume signal transition times of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0.4 to
2.2V and output loading specified in Figure 1.
2.Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
AC WAVEFORMS
READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = V IL , UB or LB = V IL )
IS62LV12816L
6Integrated Silicon Solution, Inc.
ADVANCE INFORMATION SR002-0C
ISSI
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WRITE CYCLE SWITCHING CHARACTERISTICS (1,2) (Over Operating Range)
-70
-100-120Symbol
Parameter Min.Max.Min.Max.Min.Max.Unit t WC Write Cycle Time 70—100—120—ns t SCE CE to Write End
65—80—100—ns t AW Address Setup Time to Write End 65—80—100—ns t HA Address Hold from Write End 0—0—0—ns t SA Address Setup Time 0—0—0—ns t PWB LB , UB Valid to End of Write 60—80—100—ns t PWE WE Pulse Width 60—80—100—ns t SD Data Setup to Write End 30—40—50—ns t HD Data Hold from Write End 0—0—0—ns t HZWE (3)WE LOW to High-Z Output —30—40—50ns t LZWE (3)
WE HIGH to Low-Z Output
5
—
5
—
5
—
ns
Notes:
1.Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0.4V to
2.2V and output loading specified in Figure 1.
2.The internal write time is defined by the overlap of CE LOW and UB or LB , and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the write.
3.Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
AC WAVEFORMS READ CYCLE NO. 2(1,3)
1.WE is HIGH for a Read Cycle.
2.The device is continuously selected. OE , CE , UB , or LB = V IL .
3.Address is valid prior to or coincident with CE LOW transition.
ISSI?IS62LV12816L
AC WAVEFORMS
WRITE CYCLE NO. 1(1,2)(WE Controlled) Array
Notes:
1.WRITE is an internally generated signal asserted during an overlap of the LOW states on the CE and WE
inputs and at least one of the LB and UB inputs being in the LOW state.
2.WRITE = (CE) [ (LB) = (UB) ] (WE).
IS62LV12816L
8Integrated Silicon Solution, Inc.
ADVANCE INFORMATION SR002-0C
ISSI
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DATA RETENTION SWITCHING CHARACTERISTICS
Symbol
Parameter
Test Condition
Min.Max.Unit V DR
Vcc for Data Retention See Data Retention Waveform 1.5 3.3V I DR
Data Retention Current Vcc = 2.0V, CE ≥ Vcc – 0.2V —15μA t SDR Data Retention Setup Time See Data Retention Waveform 0
—ns t RDR
Recovery Time
See Data Retention Waveform
t RC
—
ns
DATA RETENTION WAVEFORM (CE Controlled)
IS62LV12816L
ISSI
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Integrated Silicon Solution, Inc.
2231 Lawson Lane Santa Clara, CA 95054Fax: (408) 588-0806Toll Free: 1-800-379-4774
email: sales@https://www.wendangku.net/doc/3e14242568.html, https://www.wendangku.net/doc/3e14242568.html,
ISSI
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ORDERING INFORMATION Commercial Range: 0°C to +70°C
Speed (ns)
Order Part No.Package 70IS62LV12816L-70T TSOP (Type II)70IS62LV12816L-70B Mini BGA 100IS62LV12816L-100T TSOP (Type II)100IS62LV12816L-100B Mini BGA 120IS62LV12816L-120T TSOP (Type II)120
IS62LV12816L-120B
Mini BGA
Industrial Range: –40°C to +85°C
Speed (ns)
Order Part No.Package 70IS62LV12816L-70TI TSOP (Type II)70IS62LV12816L-70BI
Mini BGA
100IS62LV12816L-100TI TSOP (Type II)100IS62LV12816L-100BI Mini BGA 120IS62LV12816L-120TI TSOP (Type II)120
IS62LV12816L-120BI Mini BGA