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BTA208X-500C中文资料

BTA208X-500C中文资料
BTA208X-500C中文资料

Three quadrant triacs BTA208X series C

high commutation

GENERAL DESCRIPTION

QUICK REFERENCE DATA

Glass passivated high commutation SYMBOL PARAMETER

MAX.MAX.MAX.UNIT triacs in a full pack,plastic envelope intended for use in motor control BTA208X-500C 600C 800C circuits where high static and dynamic V DRM Repetitive peak off-state 500600800V dV/dt and high dI/dt can occur.These voltages

devices will commutate the full rated I T(RMS)RMS on-state current 888A rms current at the maximum rated I TSM

Non-repetitive peak 65

65

65

A

junction temperature,without the aid on-state current

of a snubber.

PINNING - SOT186A

PIN CONFIGURATION

SYMBOL

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134).SYMBOL PARAMETER

CONDITIONS

MIN.MAX.UNIT -600-600-800V DRM Repetitive peak off-state -6001

6001800

V voltages

I T(RMS)RMS on-state current full sine wave;-8

A

T hs ≤ 73 ?C I TSM

Non-repetitive peak full sine wave;on-state current

T j = 25 ?C prior to surge t = 20 ms -65A t = 16.7 ms -71A I 2t I 2t for fusing

t = 10 ms

-

21A 2s dI T /dt Repetitive rate of rise of I TM = 12 A; I G = 0.2 A;100A/μs on-state current after dI G /dt = 0.2 A/μs triggering

I GM Peak gate current -2A V GM Peak gate voltage -5V P GM Peak gate power -5W P G(AV)Average gate power over any 20 ms -0.5W period

T stg Storage temperature -40150?C T j

Operating junction -

125

?C

temperature

1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 6 A/μs.

ISOLATION LIMITING VALUE & CHARACTERISTIC

T hs = 25 ?C unless otherwise specified SYMBOL PARAMETER

CONDITIONS

MIN.TYP.MAX.UNIT V isol R.M.S. isolation voltage from all f = 50-60 Hz; sinusoidal -2500

V three terminals to external waveform;

heatsink

R.H. ≤ 65% ; clean and dustfree

C isol

Capacitance from T2 to external f = 1 MHz -

10-

pF

heatsink

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS

MIN.TYP.MAX.UNIT R th j-hs Thermal resistance full or half cycle

junction to heatsink with heatsink compound -- 4.5K/W without heatsink compound -- 6.5K/W R th j-a

Thermal resistance in free air

-55

-K/W

junction to ambient

STATIC CHARACTERISTICS

T j = 25 ?C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN.TYP.MAX.UNIT I GT

Gate trigger current 2

V D = 12 V; I T = 0.1 A

T2+ G+2-35mA T2+ G-2-35mA T2- G-2-35mA I L

Latching current

V D = 12 V; I GT = 0.1 A

T2+ G+--20mA T2+ G---30mA T2- G---20mA I H Holding current V D = 12 V; I GT = 0.1 A --15mA V T On-state voltage I T = 10 A

- 1.3 1.65V V GT Gate trigger voltage V D = 12 V; I T = 0.1 A

-0.7 1.5V V D = 400 V; I T = 0.1 A; T j = 125 ?C 0.250.4-V I D

Off-state leakage current

V D = V DRM(max); T j = 125 ?C

-0.1

0.5

mA

DYNAMIC CHARACTERISTICS

T j = 25 ?C unless otherwise stated SYMBOL PARAMETER

CONDITIONS

MIN.TYP.UNIT dV D /dt Critical rate of rise of V DM = 67% V DRM(max); T j = 125 ?C; exponential 1000-V/μs off-state voltage

waveform; gate open circuit

dI com /dt Critical rate of change of V DM = 400 V; T j = 125 ?C; I T(RMS) = 8 A; without 314A/ms commutating current snubber; gate open circuit

t gt

Gate controlled turn-on I TM = 12 A; V D = V DRM(max); I G = 0.1 A;-2

μs

time

dI G /dt = 5 A/μs

2 Device does not trigger in the T2-, G+ quadrant.

MECHANICAL DATA

Notes

1. Refer to mounting instructions for F-pack envelopes.

2. Epoxy meets UL94 V0 at 1/8".

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information

Where application information is given, it is advisory and does not form part of the specification.

? Philips Electronics N.V. 1997

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

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