cd4011b-TI
The CD4011B, CD4012B, and CD4023B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PWR suffix). The CD4011B and CD4023B types also are supplied in 14-lead thin shrink small-outline packages (PW suffix).
PACKAGING INFORMATION
Orderable Device Status(1)Package
Type Package
Drawing
Pins Package
Qty
Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)
89265AKB3T OBSOLETE CFP WR14TBD Call TI Call TI
89266AKB3T OBSOLETE CFP WR16TBD Call TI Call TI
89273AKB3T OBSOLETE CFP WR14TBD Call TI Call TI
CD4011BE ACTIVE PDIP N1425Pb-Free
(RoHS)
CU NIPDAU N/A for Pkg Type
CD4011BEE4ACTIVE PDIP N1425Pb-Free
(RoHS)
CU NIPDAU N/A for Pkg Type CD4011BF ACTIVE CDIP J141TBD A42N/A for Pkg Type CD4011BF3A ACTIVE CDIP J141TBD A42N/A for Pkg Type CD4011BF3AS2534OBSOLETE CDIP J14TBD Call TI Call TI CD4011BK3OBSOLETE CFP WR14TBD Call TI Call TI
CD4011BM ACTIVE SOIC D1450Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BM96ACTIVE SOIC D142500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BM96E4ACTIVE SOIC D142500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BM96G4ACTIVE SOIC D142500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BME4ACTIVE SOIC D1450Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BMG4ACTIVE SOIC D1450Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BMT ACTIVE SOIC D14250Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BMTE4ACTIVE SOIC D14250Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BMTG4ACTIVE SOIC D14250Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BNSR ACTIVE SO NS142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BNSRE4ACTIVE SO NS142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BNSRG4ACTIVE SO NS142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BPW ACTIVE TSSOP PW1490Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BPWE4ACTIVE TSSOP PW1490Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BPWG4ACTIVE TSSOP PW1490Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BPWR ACTIVE TSSOP PW142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BPWRE4ACTIVE TSSOP PW142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4011BPWRG4ACTIVE TSSOP PW142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BE ACTIVE PDIP N1425Pb-Free CU NIPDAU N/A for Pkg Type
Orderable Device Status(1)Package
Type Package
Drawing
Pins Package
Qty
Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)
(RoHS)
CD4012BEE4ACTIVE PDIP N1425Pb-Free
(RoHS)
CU NIPDAU N/A for Pkg Type
CD4012BF3A ACTIVE CDIP J141TBD A42N/A for Pkg Type CD4012BF3AS2534OBSOLETE CDIP J14TBD Call TI Call TI CD4012BM ACTIVE SOIC D1450Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BM96ACTIVE SOIC D142500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BM96E4ACTIVE SOIC D142500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BM96G4ACTIVE SOIC D142500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BME4ACTIVE SOIC D1450Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BMG4ACTIVE SOIC D1450Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BMT ACTIVE SOIC D14250Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BMTE4ACTIVE SOIC D14250Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BMTG4ACTIVE SOIC D14250Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BNSR ACTIVE SO NS142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BNSRE4ACTIVE SO NS142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BNSRG4ACTIVE SO NS142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BPWR ACTIVE TSSOP PW142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BPWRE4ACTIVE TSSOP PW142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4012BPWRG4ACTIVE TSSOP PW142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BE ACTIVE PDIP N1425Pb-Free
(RoHS)
CU NIPDAU N/A for Pkg Type
CD4023BEE4ACTIVE PDIP N1425Pb-Free
(RoHS)
CU NIPDAU N/A for Pkg Type CD4023BF ACTIVE CDIP J141TBD A42N/A for Pkg Type CD4023BF3A ACTIVE CDIP J141TBD A42N/A for Pkg Type CD4023BF3AS2534OBSOLETE CDIP J14TBD Call TI Call TI CD4023BM ACTIVE SOIC D1450Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BM96ACTIVE SOIC D142500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BM96E4ACTIVE SOIC D142500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BM96G4ACTIVE SOIC D142500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Orderable Device Status(1)Package
Type Package
Drawing
Pins Package
Qty
Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)
CD4023BME4ACTIVE SOIC D1450Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BMG4ACTIVE SOIC D1450Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BMT ACTIVE SOIC D14250Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BMTE4ACTIVE SOIC D14250Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BMTG4ACTIVE SOIC D14250Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BNSR ACTIVE SO NS142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BNSRE4ACTIVE SO NS142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BNSRG4ACTIVE SO NS142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BPW ACTIVE TSSOP PW1490Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BPWE4ACTIVE TSSOP PW1490Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BPWG4ACTIVE TSSOP PW1490Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BPWR ACTIVE TSSOP PW142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BPWRE4ACTIVE TSSOP PW142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CD4023BPWRG4ACTIVE TSSOP PW142000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM JM38510/05051BCA ACTIVE CDIP J141TBD A42N/A for Pkg Type JM38510/05052BCA ACTIVE CDIP J141TBD A42N/A for Pkg Type JM38510/05053BCA ACTIVE CDIP J141TBD A42N/A for Pkg Type (1)The marketing status values are defined as follows:
ACTIVE:Product device recommended for new designs.
LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.
NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.
PREVIEW:Device has been announced but is not in production.Samples may or may not be available.
OBSOLETE:TI has discontinued the production of the device.
(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check https://www.wendangku.net/doc/4f13862095.html,/productcontent for the latest availability information and additional product content details.
TBD:The Pb-Free/Green conversion plan has not been defined.
Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.
Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)
(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal Device Package Type Package Drawing
Pins
SPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4011BM96SOIC
D 142500330.016.4 6.59.0 2.18.016.0Q1CD4011BMT SOIC
D 14250330.016.4 6.59.0 2.18.016.0Q1CD4011BNSR SO
NS 142000330.016.48.210.5 2.512.016.0Q1CD4011BPWR TSSOP
PW 142000330.012.4 6.9 5.6 1.68.012.0Q1CD4012BM96SOIC
D 142500330.016.4 6.59.0 2.18.016.0Q1CD4012BMT SOIC
D 14250330.016.4 6.59.0 2.18.016.0Q1CD4012BNSR SO
NS 142000330.016.48.210.5 2.512.016.0Q1CD4012BPWR TSSOP
PW 142000330.012.4 6.9 5.6 1.68.012.0Q1CD4023BM96SOIC
D 142500330.016.4 6.59.0 2.18.016.0Q1CD4023BMT SOIC
D 14250330.016.4 6.59.0 2.18.016.0Q1CD4023BNSR SO
NS 142000330.016.48.210.5 2.512.016.0Q1CD4023BPWR TSSOP PW 142000
330.012.4 6.9 5.6 1.68.012.0Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) CD4011BM96SOIC D142500346.0346.033.0 CD4011BMT SOIC D1*******.0346.033.0 CD4011BNSR SO NS142000346.0346.033.0 CD4011BPWR TSSOP PW142000346.0346.029.0 CD4012BM96SOIC D142500346.0346.033.0 CD4012BMT SOIC D1*******.0346.033.0 CD4012BNSR SO NS142000346.0346.033.0 CD4012BPWR TSSOP PW142000346.0346.029.0 CD4023BM96SOIC D142500346.0346.033.0 CD4023BMT SOIC D1*******.0346.033.0 CD4023BNSR SO NS142000346.0346.033.0
CD4023BPWR TSSOP PW142000346.0346.029.0
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