Parameter
Max.
Units
V CES
Collector-to-Emitter Voltage 600V
I C @ T C = 25°C Continuous Collector Current 28I C @ T C = 100°C Continuous Collector Current 16I CM Pulsed Collector Current Q
58A
I
LM
Clamped Inductive Load Current R 58I F @ T C = 100°C Diode Continuous Forward Current 12I FM Diode Maximum Forward Current 58t sc Short Circuit Withstand Time 10μs V GE
Gate-to-Emitter Voltage
± 20V P D @ T C = 25°C Maximum Power Dissipation 100P D @ T C = 100°C Maximum Power Dissipation 42
T J Operating Junction and
-55 to +150
T STG
Storage Temperature Range
°C
Soldering Temperature, for 10 sec.300 (0.063 in. (1.6mm) from case)
Mounting Torque, 6-32 or M3 Screw.
10 lbf?in (1.1 N?m)
IRG4BC30KD
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE
V CES = 600V
V CE(on) typ. = 2.21V
@V GE = 15V, I C = 16A
Short Circuit Rated
UltraFast IGBT
4/24/2000
PD -91595A
Parameter Min.
Typ.
Max.
Units
R θJC Junction-to-Case - IGBT –––––– 1.2R θJC Junction-to-Case - Diode
–––––– 2.5°C/W
R θCS Case-to-Sink, flat, greased surface
–––0.50–––R θJA Junction-to-Ambient, typical socket mount ––––––80Wt
Weight
–––
2 (0.07)
–––
g (oz)
Thermal Resistance
Absolute Maximum Ratings
W
Features
? High short circuit rating optimized for motor control, t sc =10μs, @360V V CE (start), T J = 125°C, V GE = 15V
? Combines low conduction losses with high switching speed
? previous generations
? IGBT co-packaged with HEXFRED TM ultrafast, ultrasoft recovery antiparallel diodes
? Latest generation 4 IGBTs offer highest power density motor controls possible
? HEXFRED TM diodes optimized for performance with IGBTs. Minimized recovery characteristics reduce noise, EMI and switching losses
? This part replaces the IRGBC30KD2 and IRGBC30MD2 products
? For hints see design tip 97003
Benefits
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IRG4BC30KD
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Parameter Min.Typ.Max.Units Conditions Q g Total Gate Charge (turn-on)—67100I C = 16A Q ge Gate - Emitter Charge (turn-on)—1116nC V CC = 400V See Fig.8Q gc Gate - Collector Charge (turn-on)—2537V GE = 15V t d(on)Turn-On Delay Time —60—t r Rise Time —42—T J = 25°C
t d(off)Turn-Off Delay Time —160250I C = 16A, V CC = 480V t f Fall Time —80120V GE = 15V, R G = 23?E on Turn-On Switching Loss —0.60—Energy losses include "tail"E off Turn-Off Switching Loss —0.58—mJ and diode reverse recovery E ts Total Switching Loss — 1.18 1.6See Fig. 9,10,14t sc Short Circuit Withstand Time 10——μs V CC = 360V, T J = 125°C
V GE = 15V, R G = 10? , V CPK < 500V
t d(on)Turn-On Delay Time —58—T J = 150°C,See Fig. 11,14t r
Rise Time
—42—I C = 16A, V CC = 480V
t d(off)Turn-Off Delay Time —210—V GE = 15V, R G = 23?t f Fall Time
—160—Energy losses include "tail"E ts Total Switching Loss
— 1.69—mJ and diode reverse recovery L E Internal Emitter Inductance —7.5—nH Measured 5mm from package C ies Input Capacitance —920—V GE = 0V C oes Output Capacitance
—110—pF V CC = 30V See Fig. 7C res Reverse Transfer Capacitance —27—? = 1.0MHz t rr Diode Reverse Recovery Time —4260ns T J = 25°C See Fig.—80120T J = 125°C 14 I F = 12A I rr Diode Peak Reverse Recovery Current — 3.5 6.0A T J = 25°C See Fig.— 5.610T J = 125°C 15 V R = 200V Q rr Diode Reverse Recovery Charge —80180nC T J = 25°C See Fig.—220600T J = 125°C 16 di/dt = 200Aμs di (rec)M /dt
Diode Peak Rate of Fall of Recovery —180—A/μs T J = 25°C See Fig.During t b
—
160—T J = 125°C 17
Parameter Min.Typ.Max.Units Conditions
V (BR)CES Collector-to-Emitter Breakdown Voltage S 600——V V GE = 0V, I C = 250μA ?V (BR)CES /?T J Temperature Coeff. of Breakdown Voltage —0.54—V/°C V GE = 0V, I C = 1.0mA V CE(on)Collector-to-Emitter Saturation Voltage — 2.21 2.7
I C = 16A V GE = 15V
— 2.88—V I C = 28A
See Fig. 2, 5— 2.36—
I C = 16A, T J = 150°C V GE(th)Gate Threshold Voltage 3.0— 6.0V CE = V GE , I C = 250μA ?V GE(th)/?T J Temperature Coeff. of Threshold Voltage —-12—mV/°C
V CE = V GE , I C = 250μA g fe
Forward Transconductance T 5.48.1—S V CE = 100V, I C = 16A I CES Zero Gate Voltage Collector Current ——250μA
V GE = 0V, V CE = 600V
——2500
V GE = 0V, V CE = 600V, T J = 150°C V FM Diode Forward Voltage Drop — 1.4 1.7V
I C = 12A See Fig. 13— 1.3 1.6
I C = 12A, T J = 150°C I GES Gate-to-Emitter Leakage Current ——±100nA
V GE = ±20V
Switching Characteristics @ T J = 25°C (unless otherwise specified)
Electrical Characteristics @ T J = 25°C (unless otherwise specified)
ns
ns
IRG4BC30KD
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Fig. 1 - Typical Load Current vs. Frequency
(Load Current = I RMS of fundamental)
Fig. 2 - Typical Output Characteristics Fig. 3 - Typical Transfer Characteristics
IRG4BC30KD
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Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig. 5 - Typical Collector-to-Emitter Voltage
vs. Junction Temperature
Fig. 4 - Maximum Collector Current vs. Case
Temperature
IRG4BC30KD
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Resistance Junction Temperature
Fig. 7 - Typical Capacitance vs.
Collector-to-Emitter Voltage Fig. 8 - Typical Gate Charge vs.
Gate-to-Emitter Voltage
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Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
Collector-to-Emitter Current
110
100
0.4
0.8
1.2
1.6
2.0
2.4
FM
F I n s t a n t a n e o u s F o r w a r d C u r r e n t - I (A )
Fo rwa rd Voltage Drop - V (V)
IRG4BC30KD
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Fig. 14 - Typical Reverse Recovery vs. di f /dt
Fig. 15 - Typical Recovery Current vs. di f /dt
Fig. 16 - Typical Stored Charge vs. di f /dt Fig. 17 - Typical di (rec)M /dt vs. di f /dt
200
400
600
100
1000
f
di /dt - (A/μs)R R Q - (n C )
10
100
1000
10000
100
1000
f d i /d t - (A /μs)
d i (r
e c )M /d t
- (A /μs )
40
80
120
160
100
1000
f
di /dt - (A/μs)t - (n s )
r
r 1
10
100
100
1000
f
di /dt - (A/μs)I - (A )
I R R M
IRG4BC30KD
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Fig. 18a - Test Circuit for Measurement of
I LM , E on , E off(diode), t rr , Q rr , I rr , t d(on), t r , t d(off), t f
t1t2
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
E off , t d(off), t f
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
Defining E on , t d(on), t r
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Defining E rec , t rr , Q rr , I rr
IRG4BC30KD
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V g G A T E S IG NA L
DE V ICE U NDE R T E S T
CUR RE N T D.U.T.
V O LT A G E IN D.U.T.
CUR RE N T IN D1
t0t1t2
Figure 19. Clamped Inductive Load Test
Circuit Figure
20. Pulsed Collector Current
Test Circuit
=
480V
4 X I C @25°C
Figure 18e. Macro Waveforms for Figure 18a's Test Circuit
IRG4BC30KD
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Notes:
Q Repetitive rating: V GE =20V; pulse width limited by maximum junction temperature (figure 20)
R V CC =80%(V CES ), V GE =20V, L=10μH, R G = 23? (figure 19)S Pulse width ≤ 80μs; duty factor ≤ 0.1%.T Pulse width 5.0μs, single shot.
Case Outline TO-220AB
0.55 (.022)0.46 (.018)
3 X
2.92 (.115)2.64 (.104)
1.32 (.052)1.22 (.048)
- B -
4.69 (.185)4.20 (.165)
3.78 (.149)3.54 (.139)
- A -6.47 (.255)6.10 (.240)
1.15 (.045) M IN
4.06 (.160)3.55 (.140)3 X
3.96 (.160)3.55 (.140)
3 X 0.93 (.037)0.69 (.027)
0.36 (.014) M B A M
10.54 (.415)10.29 (.405)
2.87 (.113)2.62 (.103)
15.24 (.600)14.84 (.584)
14.09 (.555)13.47 (.530)
1.40 (.055)1.15 (.045)3 X
2.54 (.100)
2X
1 2 3
4
CONFORMS TO JEDEC OUTLINE TO-220AB
D im e ns io ns in M illim e ters a nd (In c he s)
LE A D A S S IG N M E N T S 1 - G A TE
2 - C O LLE C TO R
3 - EM IT TE R
4 - C O LLE C TO R
N O TE S :
1 D IM E N S IO N S & T O LE R A N C IN G P E R A N S I Y 14.5M , 1982.
2 C O N TR O LLIN G D IM E N S IO N : IN C H.
3 D IM E N S IO N S A R E S H O W N M ILLIM E TE R S (IN C H
ES ).
4 C O N FO R M S TO JE D E C O U TLIN E T O -220AB.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
IR EUROPEAN REGIONAL CENTRE: 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111
IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 (0)838 4630
IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673 Tel: 886-(0)2 2377 9936
Data and specifications subject to change without notice. 10/00