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不良项目中英文对照

不良项目中英文对照
不良项目中英文对照

1>Abrasion: A surface imperfection that removes or

displaces material characterized by its large

width and length relative to its depth.

中译: 擦破/磨损一个表面的瑕疵。

移动材料时造成较大的宽度、长度、深度之特徵。

2>Bleeding: This defect is the discoloration created by the

diffusion of coloring material through an

applied coating from the substrate to the

surface of the coating.

中译: 渗出染料扩散,自底层到表层,造成表面上的瑕疵。

3>Blemish: The change in the surface appearance due to a

flaw or cosmetic defect.

中译: 污损/污点因为一个瑕疵或外观不良而改变表面外部

4>Blister: The raised bumps in the surface, caused by air

or solvent vapors forming within or under the

coating.

中译: 水泡由於来自烤漆内部或表面的空气或溶剂气体造成表

面隆起突出。

5>Blush: Discoloration or change in gloss, generally appearing at the gates, abrupt thickness

changes or other structures along flow pat.

中译: 异色通常发生在射出进料口、肉厚突然缩减、

或流道交错之处

6>Bubble: A gas pocket in a plastic molded part. For a

coating, it is the same as blister.

中译: 气泡一个气体包覆(中空)在塑胶件上,对烤漆

来说,与blister意义相同

7>Burn Mark: A condition where supper-heated trapped air in

the cavity heats or burns the surface of the

plastic part.

中译: 焦痕

8>Burr:This defect appears as a rough or sharp edge on

metal after it has been cast, cut, drilled,

stamped, and so forth. Burrs will usually snag

or tear a cleaning cloth.

中译: 毛边(头) 在材料经过铸造、切割、钻孔、冲压等等外观形成

一个粗糙或锐利边缘,毛边总是会刺穿或扯裂整齐

的衣物。

9>Chip: This defect is defined as the loss of adhesion

and the removal usually in small fragments, of

the surface coating resulting from impact by

hard objects. Sometimes it is also known as

Mar, Ding or Nick.

中译: 漆屑因为烤漆表面受到硬质物体压迫,产生小碎片,失

去附着力而剥落,如损坏、压印或刻痕。

10>Crack: A thin break (splitting) in the coating or

plastic material or sheet-metal.

中译: 裂痕/裂缝在烤漆或塑胶或钣件上,一条细薄破裂(拉裂)。

11>Crater: This type of defect is characterized by a

cup-shaped depression or cavity in the coated

surface. Sometimes confused with pinholes,

craters begin as blisters with the depression

formed as the gas forming the blister escapes

before surface hardening.

中译: 气孔这不良形态特徵,是在烤漆表面上,有一个杯形洼

地或洞穴形状。有时候会跟针孔混淆。气孔的形成

就像水泡,在烤漆表面硬化之前,气体从水泡中逸

出而形成。

12>Color Variance: A difference in hue or color from the specified

color.

中译: 色差

13>Contamination: It is a condition created by foreign material

becoming mixed with virgin plastic material.

The contamination spots are usually black or

brown in color.

中译: 污染就是外来原料与原塑料混合掺杂一起所形成。一般

污点颜色近似黑色或棕色。

14>Corrosion: This defect is caused by chemical reaction with

hot humid air or any other solvent.

中译: 腐蚀因湿热空气或任何溶剂而产生化学反应,形成不良

现像。

15>Crazing: This defect is noticeable in surface coatings

by slight break in the coating that do not

penetrate through to the substrate or a

previously applied coating.

中译: 烧裂烤漆表面上细微裂痕

16>Dent: A surface depression caused by a blow or

pressure from another object. Dents have no

characteristic size or shape.

中译: 凹痕来自另一个物体的捶击或挤压造成一个表面洼地。

凹痕没有特定的大小或形状。

17>Ding:An impression or depression formed on the

surface with impact from another hard object.中译: 压印来自其它硬物的碰撞,在表面上形成一个压痕。

18>Die Mark: This type of defect is an indentation,

depression, or line that occurs in the same

location of every part due to a damaged die,

mold, tool and so forth.

中译: 模痕不良形态像是一个压痕、凹陷洼地、线状。因为冲

模、铸模、工具等等损坏,而发生在每个零件的相

同位置。

19>Dirt:This defect often appears in the form of

irregularly distributed dust particles,

usually appearing burnt and black. These

particles generally have no common shape or

size and may appear long in shape much like tiny

hairs. Particles that are 15-20 mils in

diameter can usually be felt.

中译: 污秽/灰尘时常呈现不规则分布灰尘微粒,总是显现焦黑。这

些微粒没有共同形状或大小

20>Ejector Mark:This defect is found in compression molded

parts. It is caused by distorted the mold

ejector pin and leaves a scar on the part.

中译: 冲头压印不良常见於冲压件。它

是模具冲头歪曲,在零件上所留下伤痕。。

21>Fracture: This defect is characterized by a tear,

separation, or pulling apart of metal. A

fracture is generally found at corners or

wherever sharp radii are located.

中译: 裂口/断裂不良现象是一个撕裂、分开、扯断的钣件

通常可以在转角或任何一个尖锐的弧径位置上发现

到。

22>Flash:This is unwanted excess plastic that occurs at

the parting line or interface of molded parts.

中译: 毛边这是多余额外的塑料。发生在塑胶(铸造)件的分模

线或接合面。

23>Gloss Variance: This is a difference in the degree of light

reflected from a surface. This is also

sometimes call loss of sheen, shine, luster or

brightness.

中译: 光泽偏差(度) 来自一个表面反射光泽度数的差异。

24>Grainy Coating: This coating defect is characterized by the

presence of irregularly shaped, angular or

round protrusions evenly spread over the area

of concern.

中译: 烤漆颗粒烤漆的不良特徵,有不规则形状、尖角、或圆形凸

点均匀范围超出关心的区域。

25>Gouge: A gouge is characterized as a scratch of wider

width.

中译: 圆凿一个圆凿的特徵就像是一个较宽广宽度的抓痕。

26>Jetting: It is flow mark that is caused by the improper

injection of plastic melt into a mold cavity.

This defect sometimes also called “Snaking”.

中译: 流痕因不当射出的塑料融入模穴所引起的。

27>Knit Lines: A noticeable line or mark in the surface of a

part formed by the flow of the plastic material.中译: 结合线塑料流动形成。

28>Mar: This is coating scraped with no color change.中译: 伤痕烤漆被刮到而没有颜色改变。

29>Pinhole:Pinholes are sharp, round or irregularly shaped

depressions randomly distributed over a

surface and may range in size from those barely

visible to those the size of a pin-head. These

defects will sometimes have residual varnish or

some other solid in their centers surrounding

by a hollow, halo-like space.

中译: 针孔针孔是尖锐的、圆形的或不规则地形成洼地随机散

布在一个平面上。从针头的大小可勉强看出,或许

能按大小区分排列。

30>Pit: A pinhole bigger in size is called a pit.

中译: 坑/洞

31>Plate Out: Separation of a portion of the material during

the injection process that results in this

material being deposited on the mold. Parts

from a mold that is experiencing plate out will

have variations in the gloss of the part,

possible filling of fine textured areas and in

the extreme case, the appearance of the layers

of missing material.

中译: 表面黏模意指塑胶件射出脱模後,表层残留在模具里,造成

外表光泽度不一样。

32>Press Mark: This is also called mold mark, tool mark or die

mark. This is an indentation, depression

or line that occurs due to a damaged die, mold

or press tool.

中译: 同18项

33>Run A run is generally a long, narrow, linear band

of discoloration on a finished surface.

中译: 滑走痕迹通常是一条较长、狭窄、线状条纹的退色在已加工

完成的表面上。

34>Rust: Rust is the visible manifestation of corrosion

of the iron or iron alloys. This defect

is usually seen as a reddish brown coating,

composed mostly of hydrated iron oxides formed

on iron or its alloys, as result of exposure to

humid surroundings.

中译: 铁锈铁锈是显而易见铁或铁系合金被腐蚀的证明。通常

看到就像一层红褐色的涂层。大部份是由与水化合

作用的氧化铁所组成。就像是暴露在潮湿的环境。

35>Scratch: A scratch may be described as a roughly linear

break in a surface produced by external

influences. Scratches vary greatly in length

and depth. A characteristic common to all

scratches is that they are thin relative to

their lengths.

中译: 刮伤受到外部影响产生粗糙线状破裂在表面上。在长度

与深度上,刮伤变化极大。

36>Smudge: A dirty mark or smear appearing as a run.

Smudges usually can be wiped off the surface.中译: 污点/脏污(点状)

37>Sink Mark: Sink marks are unwanted depressions that occur

when a mass of hot plastic in a thick wall

section is not thoroughly cooled during the

molding cycle. The outside is cool, but the

inside is still hot, resulting in the wall

collapsing or sinking inward.

中译: 缩水意指多於的洼地。在塑模循环期间、当大量的热融

塑料在较厚的肉壁,不能彻底冷却时会发生。外部

冷却,但是内部依然很热,结果肉壁塌陷或向内部

凹陷。。

38>Stain: This type of defect is generally brown in color

and appears as runs. Stains can usually be wiped

off the surface.

中译: 沾污(片状) 通常是褐色而呈现就像很多滑线。

39>Step: The difference in surface alignment between two

plastic parts.

中译: 段差

40>Streaking: This defect characterized by long narrow marks,

smears, or undesirable bands of color in or on

the surface. Streaking cannot usually be felt

and in many cases may be wiped off the surface.

中译: 条纹状特徵是较长狭窄痕迹,被弄脏或多余带状的颜色。

通常不容易查觉,在许多例子是能够被擦掉。

41>Stress Mark: This type of defect usually occurs at the sharp

corners and characterized by stress cracking

due to deformation or plastic decoration

process.

中译: 应力裂缝通常会发生在尖锐转角。特徵是应力裂缝,发生於

变形或塑胶装饰品加工

42>Tapped Hole A threaded hole.

中译: 螺孔

43>Tooling Mark: This type of defect is an indentation,

depression, or line that occurs in the same

location of every part due to damaged tool.

中译: 刀痕/模痕(同第18项)

44>Underfill: A plastic part that is not complete in terms of

the amount of plastic required.

中译:不饱模

45>Weld Line: A noticeable line or mark in the surface of a

part formed by the flow of the plastic material.中译: 融合线(同第27项)

46>Warpage: Distortion of a part characterized by a bowing

or twisted condition.

中译: 翘曲变形的零件。特徵弯曲或卷曲。

SMT焊接不良现象中英文对照表

[replyview]不良现象中英文对照表 1.缺件(MISSING PARTS) 28.脚未弯(PIN NOT BENT) 55.印章错误(WRONG STAMPS) 2.错件(WRONG PARTS) 29.缺盖章(MISSING STAMP) 56.尺寸错误 (DIMENSION WRONG) 3.多件(EXCESSIVE PARTS) 30.缺卷标(MISSING LABEL) 57.二极管坏 (DIODE NG) 4.短路(SHORT) 31.缺序号(MISSING S/N) 58.晶体管坏(TRANSISTOR NG) 5.断路(OPEN) 32.序号错(WRONG S/N) 59.振荡器坏(X’TL NG) 6.线短(WIRE SHORT) 33.卷标错(WRONG LABEL) 60.管装错误(TUBES WRONG) 7.线长(WIRE LONG) 34.标示错(WRONG MARK) 61.阻值错误(IMPEDANCE WRONG) 8.拐线(WIRE POOR DDRESS) 35.脚太短(PIN SHORT) 62.版本错误(REV WRONG) 9.冷焊(COLD SOLDER) 36.J1不洁(J1 DIRTY) 63.电测不良(TEST FAILURE) 10.包焊(EXCESS SOLDER) 37.锡凹陷(SOLDER SCOOPED) 64.版本未标(NON REV LEBEL) 11.空焊(MISSING SOLDER) 38.线序错(W/L OF WIRE) 65.包装损坏 (PACKING DAMAGED) 12.锡尖(SOLDER ICICLE) 39.未测试(NO TEST) 66.印章模糊(STAMPS DEFECTIVE) 13.锡渣(SOLDER SPLASH) 40.VR变形(VR DEFORMED) 67.卷标歪斜(LABEL TILT) 14.锡裂(SODER CRACK) 41.PCB翘皮(PCB PEELING) 68.外箱损坏(CARTON DAMAGED) 15.锡洞(PIN HOLE) 42.PCB弯曲(PCB TWIST) 69.点胶不良(POOR GLUE) 16.锡球(SOLDER BALL) 43.零件沾胶(GLUE ON PARTS) 70.IC座氧化 (SOCKET RUST)

不良现象中英文对照表

良现象中英文对照表 不良现象中英文对照表 1.缺件(MISSING PARTS)…missing parts 2.错件(WRONG PARTS)…wrong parts 3.多件(EXCESSIVE PARTS)…excessive parts 4.短路(SHORT)…short 5.断路(OPEN)…open 6.线短(WIRE SHORT)…wire short 7.线长(WIRE LONG)…wire long 8.拐线(WIRE POOR DDRESS)…wire poor adress 9.冷焊(COLD SOLDER) …cold solder 10.包焊(EXCESS SOLDER)…excess solder 11.空焊(MISSING SOLDER)…missing solder 12.锡尖(SOLDER ICICLE)…icicle 13.锡渣(SOLDER SPLASH)…solder splash 14.锡裂(SODER CRACK)…solder crack 15.锡洞(PIN HOLE)..solder hole 16.锡球(SOLDER BALL)..sloder ball 17.锡桥(SOLDER BRIDGE)…solder bridge 18.滑牙(SCREW LOOSE)…screw loose 19.氧化(RUST) …rust 20.异物(FOREIGNER MATERIAL)…foreigner material 21.溢胶(EXCESSIVE GLUE) 22.锡短路(SOLDER BRIDGE) 23.锡不足(SOLDER INSUFFICIENT) 24.极性反(WRONG POLARITY) 25.脚未入(PIN UNSEATED) 26.脚未出(PIN UNVISIBLE) 27.脚未剪(PIN NO CUT) 28.脚未弯(PIN NOT BENT) 29.缺盖章(MISSING STAMP) 30.缺标签(MISSING LABEL)…missing label 31.缺序号(MISSING S/N) 32.序号错(WRONG S/N) 33.标签错(WRONG LABEL) 34.标示错(WRONG MARK) 35.脚太短(PIN SHORT) 36.J1不洁(J1 DIRTY) 37.锡凹陷(SOLDER SCOOPED) 38.线序错(W/L OF WIRE)

金属部品检验标准

1.目的 本标准旨在定义XXX金属部品品质标准,为检验员提供金属部品检验与判定的参考依据,同时是模 具及金属部品供应商对XXX品质要求认知的准则。 2.适用范围 本标准适用于XXX金属机械加工部品及其表面的喷油(电镀)、印刷。 3.术语和定义 3.1.污点杂质:残留物、润滑剂、腐蚀生成物、或沉积物,从加工或储存环境中的有机生成物。 3.2.异色:原色改变或色彩不一致。 3.3.凹痕:痕迹、凹处、或低凹处。 3.4.机械痕迹:由模具或机械加工造成(如折弯、拉伸)的无法避免的加工痕迹。 3.5.小孔:表面小孔或空隙。 3.6.刮伤:无深度的表面划痕,用手指甲感觉无感、无层次感。 3.7.刮痕:硬物或锐器造成零件表面的深度线性伤痕,用手指甲感觉有感、有层次感。 3.8.碰伤:产品表面或边缘遭硬物撞击而产生的痕迹。 3.9.毛屑(刺):模具或机械加工时的材料残留物。 3.10.断印:印刷中由于杂质或其它原因造成印刷字体中的白点等情况。 3.11.漏印:印刷内容缺划或缺角或字体断印缺陷大于0.3mm,也被认为有漏印。 3.12.色差:指实际部品颜色与承认样品颜色或色号比对超出允收值。 3.13.装配缝隙:除了设计时规定的缝隙外,由两部组件装配造成的缝隙。 3.1 4.油斑:附着在对象表面的油性液体。 3.15.漏喷:喷漆之产品表面部份因异常原因而导致涂层没有喷到露出底材之现象。 3.16.桔皮:涂装表面呈现桔子皮似的凹凸,也称桔子皮。 3.17.色斑(颜色不匀):涂装颜色不均匀。 3.18.脱漆:对材料表面喷漆(镀)面不粘着或不够粘性。 4.职责和权限 4.1.工厂品保部:负责组织对到货物料进行抽样、检验和试验,并出具、保存检验报告;负责对 IQC来料检验作业指导书的及时升级和更新,对自购来料异常具有批退权。 4.2.结构开发部:负责对金属部品等物料进行封样,并向工厂输入检验规范/图纸(包括升级维护)、 关键元器件清单及工程注意事项(ST形式)。 4.3.质量技术部:负责参与质量争议部件问题封样。 5.作业内容 5.1.外观检验标准: 5.1.1.外观检验依据 GB/T2828.1-2003 一次抽样方案Ⅱ级之抽样水准,随机取样进行检验。 严重缺陷(CR):C=0 主要缺点(MA):MA=0.65其定义为会影响产品组装导致无法使用及整机外观导致客 户质量投诉。 次要缺点(MI):MI=2.5 其定义为会影响产品之外观者。 5.1.2.外观检验方法 检验条件及方法 5.1.2.1.室内检验环境下、目距500mm、视线相对水平面45度以上、从观察物正面开始

电子电器产品不良缺陷对应英文描述

General Defect - 通用电器缺陷 cord untied or irregularly tied电线未绑或绑的不规则exposed wires金属线外露 brass wire in power cord exposed电源线的铜丝外露ground wire discontinuous地线间断 burn down烧坏 jam刮/卡死 excessive noise噪音过多 shock noise振动有噪音 switch operated not smoothly开关不顺 polarity reversed极性接反 open circuited开路 short circuited短路 grounding continuity test failed接地失败 Hi-pot test failed高压失败 leakage current test failed漏电 power supply dead无电源 dielectric strength test failed介质强度测试失败current or wattage out of specification电流/电压不合规格live wire exposed火线外露 General location - 电器通用缺陷 位置 jack插口 AC-IN jack交流输入口 DC-IN jack直流输入口 socket插座 socket cover插座盖 plug插头 plug foot插脚 polarized plug极性插头 coupling plug转化/耦合插头 flat blade plug扁脚插头 channel频道 function key功能键 nut螺母 LCD液晶显示屏 power LED indicator电源电子指示灯power cord电源线 electrode plate电极片 ON-Off switch开关 adapter适配器

品质相关英文缩写和不良现象表述

CEM Contract Manufacture service 合约委托代工 IBSC Internet Business Solution Center 国际互联网应用中心 PCEG Personal Computer Enclosure group 个人计算机外设事业群(FOXTEQ) SABG system assembly business group 系统组装事业群 Engineer standard 工标 Document center (database center)资料中心 Design Center 设计中心 Painting 烤漆(厂) Assembly组装(厂) Stamping 冲压(厂) Education and Training教育训练 proposal improvement/creative suggestion提案改善 Technological exchange and study 技术交流研习会 Technology and Development Committee 技术发展委员会

BS Brain Storming 脑力激荡 QCC Quality Control Circle 品质圈PDCA Plan Do Check Actio n 计划执行检查总结DCC delivery control center 交货管制中心Computer 计算机类产品 Consumer electronics 消费性电子产品Communication 通讯类产品 Core value(核心价值) Love 爱心 Confidence 信心 Decision 决心 Corporate culture(公司文化) Integration 融合 Responsibility 责任 Progress 进步

主要缺陷中英文对照

主要缺陷中英文对照

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德仕科技(深圳)有限公司 品管部中英文对照表(一) 主要缺陷中英文对照 序号中文英文 序 号 中文英文 1 披峰Flash 16 流痕Flow mark 2 走不齐/ 缺胶 Short shot 17 色差 abberration 3 变形/注塑 后变形 Deformation 18 夹水线Weld lines 4 偏模Mismatch 19 碰伤Bump damage 5 起泡Blister 20 银线Silver 6 污斑Grease pits 21 少数量Packing shortage 7 雾化Atomization 22 泛白Blushing 8 烧焦Burn mark 23 发白Whitening 9 油污Oil mark 24 刮伤Scratch 10 气泡Blister 25 气纹Gas lines 11 划痕Scffing 26 混色Color mixture 12 泛黄Yellowing 27 斑点/污 点/ 黑点 Macula 13 缩水Sink mark 28 结合线 14 段差29 拉伤Pull 15 抛光不良Polishing mark 30 水印Watermark 主要测量仪器中英文对照

序号中文英文 序 号 中文英文 1 分厘卡(千 分尺) Micrometer 14 卡尺Caliper 2 C表Dial gauge 15 扁分厘卡Blade micrometer 3 块规Block gauge 16 针规Pin gauge 4 CMM X-Y-Z Coordinate 17 电子卡尺Digital caliper 5 扭力计Torque meter 18 投影仪Projection apparatus 6 高度仪Height gauge 19 直角尺Square master 7 游标卡尺Vernier caliper 20 硬度机Durometer 8 牙规Scre gauge 21 半径规Radius gauge 9 角度规Universal protractor 22 特别塞规Ring gauge 10 拉/推力计Pull/Push gauge 23 弹力计Spring balance 11 塞尺Clearance gauge 24 专用夹具Special fixture 12 工具显微 镜 Tool-measuring microscope 25 千分表Dial indicator 13 1 抽样Sampling 11 抽样计划 Sampling plan 2 样品数量Sample size 12 合格Conformity

不良现象中英文对照表

1.缺件(MISSING PARTS) 2.错件(WRONG PARTS) 3.多件(EXCESSIVE PARTS) 4.短路(SHORT) 5.断路(OPEN) 6.线短(WIRE SHORT) 7.线长(WIRE LONG) 8.拐线(WIRE POOR DDRESS) 9.冷焊(COLD SOLDER) 10.包焊(EXCESS SOLDER) 11.空焊(MISSING SOLDER) 12.锡尖(SOLDER ICICLE) 13.锡渣(SOLDER SPLASH) 14.锡裂(SODER CRACK) 15.锡洞(PIN HOLE) 16.锡球(SOLDER BALL) 17.锡桥(SOLDER BRIDGE) 18.滑牙(SCREW LOOSE) 19.氧化(RUST) 20.异物(FOREIGNER MATERIAL) 21.溢胶(EXCESSIVE GLUE) 22.锡短路(SOLDER BRIDGE) 23.锡不足(SOLDER INSUFFICIENT) 24.极性反(WRONG POLARITY)25.脚未入(PIN UNSEATED) 26.脚未出(PIN UNVISIBLE) 27.脚未剪(PIN NO CUT) 28.脚未弯(PIN NOT BENT) 29.缺盖章(MISSING STAMP) 30.缺标签(MISSING LABEL) 31.缺序号(MISSING S/N) 32.序号错(WRONG S/N) 33.标签错(WRONG LABEL) 34.标示错(WRONG MARK) 35.脚太短(PIN SHORT) 36.J1不洁(J1 DIRTY) 37.锡凹陷(SOLDER SCOOPED) 38.线序错(W/L OF WIRE) 39.未测试(NO TEST) 40.VR变形(VR DEFORMED 41.PCB翘皮(PCB PEELING) 42.PCB弯曲(PCB TWIST) 43.零件沾胶(GLUE ON PARTS) 44.零件脚长(PARTS PIN LONG) 45.浮件(PARTS LIFT) 46.零件歪斜(PARTS TILT) 47.零件相触(PARTS TOUCH) 48.零件变形(PARTS DEFORMED)

塑胶产品常见不良现象分析

塑胶产品常见不良现象分析 1.填充不足(SHOT SHORT):是熔融塑料未完全流遍成型空间(模穴)的各个角落之现象. 2.毛边:熔融塑料流入分模面或侧向蕊型的对合面间隙会发生BURR;模具锁模力足够,但在浇道与横流道会合处产生薄膜状多余树脂为FLUSH. 3.收缩下陷:成型品表面产生凹陷的现象.这是体积收缩所致,通常见于肉厚部分、肋或凸出的背面、直接浇口肉厚不均的部份. 4:气泡:熔融塑料中有水份、挥发性气体于成型过程进入成型品内部而残留的空洞现象谓气泡 5:破裂(CRACKING)与龟裂(CRAXING):成型品表面裂痕严重而明显者为破裂(CRACKING).成型品表面呈毛发状裂纹,制品尖锐突角处常呈现此现象谓之龟裂现象. 6:白化定义:成型品脱模之际,因顶出销的顶力或成型品倒钩(UNDERCUT)位之阻力,该部呈现白色痕迹称为白化(BLUSHING).白化并非裂纹,但却是裂纹(龟裂)之前兆,当见于ABS.HIPS等塑件.白化是成型品内部显著的残留应力所致,应注意龟裂现象之发生. 7:变形(STRAIN)-翘曲、扭曲:变形可分成翘曲与扭曲两种现象.平行边变形者称为翘曲(WRAPING); 对角线方向的变形称为扭曲(TORSION). 8:熔合线(weld line)是熔融材料二道或二道以上合流的部分所形成的细线. 9:流痕(flow mark)是熔融材料流动的痕迹,以浇口为中心而呈现的条纹模样. 10:喷流痕是熔融塑料由浇口往成型空间(模穴)内射出时呈纽带状固化,而在成型品表面成蛇行状态. 11:银条(sliver streak)是在成型品表面或表面附近,沿材料流动方向,呈现的银白色条纹. 12:一般所谓的烧焦(burn marks),包括成形品表面因材料过热所致的变色及成型品的锐角部份或毂部.肋的前端等材料焦黑的现象.烧焦是滞留成型空间内的空气,在熔融材料进人时未能迅速排出,被压缩而显著升温,再将材料烧焦所致.烧焦之有效防止对策是在易聚集空气部位设置排气孔或利用顶出销.芯型销等的

常见术语及缺陷中英文对照

品 質 部 培 訓 教 材 相關常見術語中英文對照

1、衝壓五金工藝常見術語及缺陷中英文對照: 中 文 英 文 備注 中 文 英 文 備注 弧長 Arc Length 材料 Material 基本呎寸 Basic Dimension 厚度 Thickness 錐度 Conical Taper 扭曲 Twist 擴孔 Counterbore or Spotface 弧度 Camber 錐孔 Countersink 拱形 Crossbow 深度 Deep of Depth 翹曲 Tilt 直徑 Diameter ? 彎曲 Coilset / Bow 半徑 Radius R 公差 Tolerance 個數 Number or Times - Places 2X 孔徑 Hole 不測量呎寸 Dimension Not to Scale X.XX 版次 Revision 參考呎寸 Reference Dimension (X.XX) 呎寸 Dimension 斜度 Slope 切面 Section 球直徑 Spherical Diameter S? 利角 Sharp edges 球半徑 Spherical Radius SR 半剖角 Half section 正方形 Square □ 編號呎寸 Number Sizes 平面度 Flatness □ 比例 Scale 直線度 Straightness — 單向公差 Unilateral tolerance 圓度 Roundness ○ 雙向公差 Bilateral tolerance 圓柱度 Cylindricity 規格 Specification 線輪廓度 Profile or a Line 剖面圖 Cross – Section 面輪廓度 Profile of a Surface 擠壓 Extrusion 傾斜度 Angularity ∠ 內徑 Bore 垂直度 Perpendicularity ⊥ 內應力 Internal stress 平行度 Parallelism / / 硬度 Hardness 位置度 Position 變形 Distortion 同軸度 Concentricity ◎ 刮花 Scratch 對稱度 Symmtery 碰銲 Spot Weld 圓跳動 Circular Run out 凹槽 Fluting / Groove 全跳動 Total Run out 成形 Forming A 點 A-Ponit 基準線 Datum Line 配件 fittings 焊接件 Weldment 配合 fit 回火處理 Drawing temper 裝配 fitting 夾具 Fixture 劃傷 scuffing 剪切 Shear 螺紋 screw 或 thread 剪切力 Shear force 回火 Tempering 剪切銷 Shear pin 脆性 Brittleness 剪切應力 Shear stress 脆性斷裂 Brittle fracture 間隙 Clearance 錘擊試驗 Hammer test 截面收縮 Contraction in area 單工序衝床 Simple press tool 緊配合 Driving fit 彈簧 Spring 開口 Throat 執片 Shim 抗彎強度 Bending strength 定位銷 Pilot pin 拉伸試驗 Tensile test 斷裂試驗 Fracture test 老化 Aging 斷裂應力 Breaking stress 螺母 Nut X.XX

临床常规检验项目及英文缩写

一、临床常规检验项目及检查指标的临床意义 血常规: 1、红细胞记数RBC: 临床意义:诊断各种贫血和红细胞增多症 正常参考值:男(4.0-5.5)T/L 女(3.5-5.0)T/L 2、血红蛋白HGB 临床意义:同上 正常参考值:110-160g/L 3、红细胞比积HCT 临床意义:同上 正常参考值:0.37-0.49 4、平均红细胞体积MCV 临床意义:判断贫血的类型 正常参考值:82-92fl 5、平均红细胞血红蛋白含量MCH 临床意义:判断贫血的类型和轻重程度 正常参考值:27-31pg 6、平均红细胞血红蛋白浓度MCHC 临床意义:判断贫血的类型和轻重程度 正常参考值:320-360g/L 7、红细胞体积分布宽度RDW 临床意义:RDW增加可见于营养缺乏性贫血 正常参考值:11.6-14.8 8、白细胞记数WBC 临床意义:增高见于感染、组织损伤、白血病;降低见于血液病、自身免疫病、脾功能亢进等 正常参考值:4-10G/L 9、白细胞分类DC 临床意义:用于血液病等疾病的诊断和判断感染轻重程度。中性粒细胞增高见于感染、白血病;降低见于某些感染、自身免疫疾病、脾亢等 嗜酸性粒细胞(EOS)增高见于过敏性疾病、某些皮肤病及传染病的早期;降低见于使用肾上腺皮质激素后等。 正常参考值:分叶核粒细胞GRAN 50-70% 嗜酸性粒细胞EOS50-300G/L(G=106) 淋巴细胞L YM 20-40% 单核细胞MID 3-8% 10、血小板记数PLT 临床意义:检测凝血系统的功能 正常参考值:100-300G/L 11、平均血小板体积MPV 临床意义:判断血小板减少的原因 正常参考值:6.8-13.5fl 12、血小板压积PCT

常规生化检验项目缩写

英文缩写英文全称中文全称 TB total bilirubin 总胆红素 DB direct bilirubin 直接胆红素 TP total protein 总蛋白 ALB albumin 白蛋白 GLOB globulin 球蛋白 UREA urea 尿素 CREA creatinine 肌肝 UA uric acid 尿酸 GLU glucose 血糖 ALT alanine amiotransferase丙氨酸氨基转移酶AST aspartate aminotransferase 门冬氨酸氨基转移酶GGT γ-glutamyl transpeptadase谷氨酰转肽酶 CK creatine kinase肌酸肌酶 CK-MB creatine kinase-MB 肌酸肌酶同工酶LDH lactate dehydrogenase 乳酸脱氢酶 α-HBD α-hydroxybutyric dehydrogenaseα-羟丁酸脱氢酶AMY serum amylase 血淀粉酶 TG triglyceride 甘油三脂 CHOL cholesterol胆固醇 HDL-c high-density lipoprotein cholesterol 高密度脂蛋白

LDL-c low-density lipoprotein cholesterol 低密度脂蛋白VLDL very low-density lipoprotein 极低密度脂蛋白Ca serum calcium钙 Mg serum magnesium镁 IP inorganic phosphate无机磷 ALP alkaline phosphatase碱性磷酸酶 TBA total biliary acid 总胆汁酸 ASO antistreptolysin抗链球菌溶血素O a-AG a-acid glycoprotein a-酸性糖蛋白CRP C-reactive protein C反应蛋白 RF rheumatoid factor 类风湿因子 MTP mili-total protein微量蛋白 IgG immunoglobin G 免疫球蛋白G IgA immunoglobin A 免疫球蛋白A IgM immunoglobin M 免疫球蛋白M C3 complement C3 补体C3 C4 complement C4 补体C4 cTNT troponin T 肌钙蛋白T MYOG myoglobin 肌红蛋白

不良现象英文翻译

中文名称英文名称中文名称英文名称 管脚长lead long 屏蔽罩击穿shield breakdown 脱脚lead pull off PCB不清洁PCB dirty 弯脚角度大lead bend angle big PCB变形PCB deformation 弯脚角度小lead bend angle small PCB来料不良Incoming PCB NG 元件插反component insert inverse PCB线路不良Circuit NG on PCB 元件插错component insert wrong PCB有裂/缺PCB crack/flaw 元件漏插missing component 批峰burr 元件损伤component damaged 破损dilapidation 元件压铜皮component press pad 偏移shift 按键不良keystroke no click 气泡air bulb 按键装反keystroke assemble inverse 其它others 表盖刮伤surface cover scratch 日期印漏missing date code stamp 包焊excess solder 日期印错wrong date code stamp 标签不良label NG 日期印模糊date code stamp vague 标签刮伤label scratch 绕线交叉wrap wire cross 标签漏missing label 绕组不均匀wrap no even 标签来料不良incoming label NG 绕组错coil wrong 标签模糊label vague 输出插头松output plug loose 标签填错fill wronly in label 手插管脚长M/I lead long 标签贴错label stick wrongly 手插管脚短M/I lead short 标签贴反label stick inverse 输出.输入线破损output&input wire dameged 标签贴偏label stick with offset 少插跳线missing jumper wire 标签贴斜label stick lean 输出线断output wire open 标签有气泡label with air bulb 输出线内部错位output wire wrong inside 标签脏污label dirty 输出线头断output wire head breakdown 有灰尘dust 手插元件插错M/I component wrong 板响board with noise 手插元件插反M/I component inverse 保险管夹松fuse clip loose 手插元件多插M/I component excessive 变压器断线wire of transformer breakdown 手插元件高M/I component high 插错insert wrongly 手插元件漏插miss M/I component 初,次级绕反inverse 手插元件损伤M/I component damage 贴反mounting inverse 少垫片lack of gasket 次级对磁蕊短路secondary short to magnet 上盖变形upper case deformation 初级短路primary circuit short 少件lack of component 次级短路secondary circuit short 高件component raise up 初级断线open circuit in primary 红胶溢出red adhesive overflow 次级断线open circuit in secondary 竖件component stand up 初级胶带破tape damage in primary 少锡insufficient solder 次级胶带破tape damage in secondary 元件氧化component oxidize 初级圈数多excessive primary wrap 元件虚焊empty solder 初级圈数少insufficient primary wrap 元件短路component short circuit 次级圈数少insufficient secondary wrap 元件贴反component mount inverse 次级圈数多excessive secondary wrap 元件翘起component lift up 次级绕错匝数is wrong 元件损伤component damage 插破侧盖side cover break 元件偏移component excursion 插破骨架bobbin break 元件翻面component turnover 超声波压伤ultrasonic press injury 元件多贴excessive component 磁头装反magnetic core inverse 元件漏贴missing component 错位wrong position 元件脱落component break off 磁芯不干净magnetic core dirty 输入插头松input plug loose

不良中英文对照表

不良现象中英文对照表 1.缺件(missing parts) 2.错件(wrong parts) 3.多件(excessive parts) 4.短路(short) 5.断路(open) 6.线短(wire short) 7.线长(wire long) 8.拐线(wire poor ddress) 9.冷焊(cold solder) 10.包焊(excess solder) 11.空焊(missing solder) 12.锡尖(solder icicle) 13.锡渣(solder splash) 14.锡裂(soder crack) 15.锡洞(pin hole) 16.锡球(solder ball) 17.锡桥(solder bridge) 18.滑牙(screw loose) 19.氧化(rust) 20.异物(foreigner material) 21.溢胶(excessive glue) 22.锡短路(solder bridge) 23.锡不足(solder insufficient) 24.极性反(wrong polarity) 25.脚未入(pin unseated) 26.脚未出(pin unvisible) 27.脚未剪(pin no cut) 28.脚未弯(pin not bent) 29.缺盖章(missing stamp) 30.缺标签(missing label) 31.缺序号(missing s/n) 32.序号错(wrong s/n) 33.标签错(wrong label) 34.标示错(wrong mark) 35.脚太短(pin short) 36.j1不洁(j1 dirty) 37.锡凹陷(solder scooped) 38.线序错(w/l of wire) 39.未测试(no test) 40.vr变形(vr deformed) 43.零件沾胶(glue on parts) 41.pcb翘皮(pcb peeling) 42.pcb弯曲(pcb twist) 44.零件脚长(parts pin long) 45.浮件(parts lift) 46.零件歪斜(parts tilt) 47.零件相触(parts touch) 48.零件变形(parts deformed) 49.零件损坏(parts damaged) 50.零件脚脏(pin dirty) 51.零件多装(parts excess) 52.零件沾锡(solder on parts) 53.零件偏移(parts shift) 54.包装错误(wrong packing) 55.印章错误(wrong stamps) 56.尺寸错误(dimension wrong) 57.二极管坏(diode ng) 58.晶体管坏(transistor ng) 59.振荡器坏(x’tl ng) 60.管装错误(tubes wrong) 61.阻值错误(impedance wrong) 62.版本错误(rev wrong) 63.电测不良(test failure) 64.版本未标(non rev lebel) 65.包装损坏(packing damaged) 66.印章模糊(stamps defective) 67.标签歪斜(label tilt) 68.外箱损坏(carton damaged) 69.点胶不良(poor glue) 70.ic座氧化(socket rust) 71.缺ul标签(missing ul label) 72.线材不良(wire failure) 73.零件脚损坏(pin damaged) 74.金手指沾锡(solder on golden fingers) 75.包装文件错(racking doc wrong) 76.包装数量错(packing q’ty wrong) 77.零件未定位(parts unseated) 78.金手指沾胶(glue on golden fingers) 79.垫片安装不良(washer unseated) 80.线材安装不良(wire unseated) 81.立碑(tombstone)

不良描述中英文对照

不良描述中英文对照(五金,塑料,PCB) 1.Plastic parts 塑膠部件- Inspection Points /檢查要點: Abrasion/划痕,Bubbles/气泡, Burrs/毛刺, Bad Plating/電鍍不良, Contamination/雜質, Crack/爆裂, Combine Lines/結合線, Deformation/變形, Flow Marks/流痕, Greasy Dirt/油污, Haze/霧狀, Jelly/泠膠, Mold Marks/模痕, Melange Color/混色, Oppilation Hole/盲孔, Pull White/拉白, Pour Hole uneven/澆口不平, Wrong Stamping/字麥不符, Short Shots/缺料, Shrinkage/縮水, Stripped Screw/螺絲滑牙, Top White/頂白, Weld Lines/夾水紋, Wrong Dimension/尺寸不符, Wrong Texture/紋理錯誤, Light/發亮;-质量- 2. Metal Parts 五金部件 Inspection Points /檢查要點: Abrasion/划痕, Bad Weld/焊接不良, Burrs/毛刺, Bad Plating/電鍍不良, Bend angle/折彎角度, Contamination/雜質, Crack/爆裂, Deformation/變形, Dents/凹痕, Greasy Dirt/油污, Mold Marks/模痕, Missing Stamp/漏沖壓, Oppilation Hole/盲孔, Pressing Marks/壓痕, Rust/生鏽, Wrong Stamping/字麥錯誤, Short Shots/缺料, Stripped Screw/螺絲滑牙, Pits/疤痕, Specks/斑點 Wrong Texture/紋理錯誤, Wrong Dimension/尺寸不符;bb 3. Painting parts / SilkScreen parts 噴油/絲印部件 Inspection Points /檢查要點: Bleeding/滲色, Bad Painting/噴油不良, Contamination/雜質, deviate position/偏位, Flow Marks/流痕, Missing paint/漏噴, Over Paint/肥油, Pits/疤痕, Poor Adhesion/附著力差, Print Words Leans/印刷字體傾斜, Pooring Paint/薄油, Silkscreen Haze/絲印模糊, Silkscreen Stamping Inconsistency/絲印字樣不一致, Scratch/划傷, Speck/斑點, Uneven Surface Oil/表面油層不均勻, Words Break Off/字体斷開, Wrong Color/錯誤顏色, Wrong Texture/紋理錯誤;-

缺陷中英文词汇对比

A . 尺寸,形状缺陷 铸造缺陷casting defects 尺寸超差impropershrinkage allowance 尺寸不合格wrong size 模样错误excess rappingof pattern, deformed pattern, pattern error 壁厚不均differentthickness 铸型下垂mold sag 错型mold shift,shift, miss-match, cross-joint 舂移ram off, ramaway 塌型mold drop,drop off, drop out, drop sticker 上型下沉,沉芯sag( 上型和型芯下垂导致壁厚减小) 飞翅fins, joint flash 翘曲warp age,buckling, warping, camber 铸件变形warped casting 挤箱push up,cramp-off 型裂broken mold,cracked 掉砂crush ofmold, crush 变形deformation,casting distortion, warped casting B. 缩孔(由凝固收缩引起) 缩孔shrinkage,shrinkaged cavity 内部缩孔internalshrinkage, dispersed shrinkage, blind shrinkage 敞露缩孔open shrinkage,external shrinkages, sink marks, depression 缩松porosity, shrinkage porosity,leakers, micro shrinkage, disperded shrinkage 缩陷sink marks,draw, suck-in 芯面缩孔core shrinkage 内角缩孔cornershrinkage, fillet shrinkage 出汗孔extruded bead,exudation 线状缩孔fissure likeshrinkage C. 气体缺陷(由气体引起的孔) 气孔blowholes,gas hole, blow 针孔pinholes 裂纹状缺陷,线状缺陷fissure defects D. 裂纹 裂纹crack 缩裂shrinkage crack 季裂seasoncracking, season crack 应力热裂hot cracking,hot tearing, hot tear 淬火裂纹quench crack,quenching crack 应力冷裂cold cracking,breakage, cold tearing, cold tear 龟裂crack 激冷层裂纹,白裂chill crack E. 夹杂物 夹渣slaginclusion, slag blowholes 砂眼sandinclusion, raised sand, sand hole

软件检验中英文对照

Acceptance testing | 验收测试 Acceptance Testing|可接受性测试 Accessibility test | 软体适用性测试 actual outcome|实际结果 Ad hoc testing | 随机测试 Algorithm analysis | 算法分析 algorithm|算法 Alpha testing | α测试 analysis|分析 anomaly|异常 application software|应用软件 Application under test (AUT) | 所测试的应用程序Architecture | 构架 Artifact | 工件 ASQ|自动化软件质量(Automated Software Quality)Assertion checking | 断言检查 Association | 关联 Audit | 审计 audit trail|审计跟踪 Automated Testing|自动化测试 Backus-Naur Form|BNF范式

baseline|基线 Basic Block|基本块 basis test set|基本测试集 Behaviour | 行为 Bench test | 基准测试 benchmark|标杆/指标/基准 Best practise | 最佳实践 Beta testing | β测试 Black Box Testing|黑盒测试 Blocking bug | 阻碍性错误 Bottom-up testing | 自底向上测试 boundary value coverage|边界值覆盖 boundary value testing|边界值测试 Boundary values | 边界值 Boundry Value Analysis|边界值分析 branch condition combination coverage|分支条件组合覆盖branch condition combination testing|分支条件组合测试branch condition coverage|分支条件覆盖 branch condition testing|分支条件测试 branch condition|分支条件 Branch coverage | 分支覆盖

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