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HLMP-7xxx中文资料

Subminiature Lamps Reliability Data

Description

The following cumulative test results have been obtained from testing performed at HP Optoelec-tronics Division in accordance with the latest revision of MIL- STD-883.Hewlett-Packard tests parts at the absolute maximum rated condi-tions recommended for the device. The actual performance you obtain from HP parts depends on the electrical and environmen-tal characteristics of your applica-

Point Typical Performance

Stress Test Total Device

Units Total Failure Rate Colors

Conditions

Hours

Tested

Failed

MTBF

(% /1 K Hours)

Standard Red T A = 55°C, I F = 50 mA 2,658,0002,21002,658,000≤0.038%HER, Green,T A = 55°C, I F = 30 mA

10,423,000

7,063

10,423,000

≤0.010 %

Emerald Green,Orange, Yellow,AS and TS AlGaAs Yellow

T A = 55°C, I F = 20 mA

3,218,000

2,098

3,218,000

≤0.031 %

Table 1. Life Tests

Demonstrated Performance

Failure Rate Prediction

The failure rate of semiconductor devices is determined by the junction temperature of the

device. The relationship between ambient temperature and actual junction temperature is given by the following:

T J (°C) = T A (°C) + θJA P AVG where T A = ambient temperature in °C

θJA = thermal resistance of junction-to-ambient in °C/watt

HLMP-Pxxx, Qxxx,6xxx, 70xx

tion but will probably be better than the performance outlined in Table 1.

P AVG = average power dissipated in watts

The estimated MTBF and failure rate at temperatures lower than the actual stress temperature can be determined by using an

Arrhenius model for temperature acceleration. Results of such calculations are shown in the table below using an activation energy of 0.43 eV (reference MIL-HDBK-217).

Table 2.

Point Typical Performance in Time[2]

Performance[1] in Time(90%Confidence) Ambient Temp.Junction Temp.Failure Rate Failure Rate I F(°C)(°C)MTBF[1](%/1K Hours)MTBF[2](%/1K Hours) 30851053,340,0000.030 %1,451,0000.069 % 75954,782,0000.021 %2,077,0000.048 %

65856,983,0000.014 %3,033,0000.033 %

557510,423,0000.010 %4,527,0000.022 %

456515,930,0000.006 %6,919,0000.014 %

355524,986,0000.004 %10,852,0000.009 %

254540,313,0000.002 %17,509,0000.006 % Notes:

1.The point typical MTBF (which represents 60% confidence level) is the total device hours divided by the number of

failures. In the case of zero failures, one failure is assumed for this calculation.

2.The 90% confidence MTBF represents the minimum level of reliability performance which is expected from 90% of all

samples. This confidence interval is based on the statistics of the distribution of failures. The assumed distribution of failures is exponential. This particular distribution is commonly used in describing useful life failures. Refer to MIL-STD-690B for details on this methodology.

3. A failure is any LED which does not emit light.

Example of Failure Rate Calculation:

Assume a device operating 8 hours/day, 5 days a week. The utilization factor, given 168 hours/week is:

(8 hours/day) x (5 days/week) ÷ (168 hours/week) = 0.25

The point failure rate per year (8760 hours) at 55°C ambient temperature is:

(0.010%/1K hours) x 0.25 x (8760 hours/year) = 0.022% per year

Similarly, 90% confidence level failure rate per year at 55°C:

(0.022%/1K hours) x 0.25 x (8760 hours/year) = 0.048% per year

Table 3. Environmental Tests

Units Units Test Name Reference Test Conditions Tested Failed Infra-red solder HP application note 1028Re-flow at 235°C Peak, above1,9120

Re-flow185°C for 90 sec. max.

Solder Heat Resistance MIL-STD-883 Method 2003Sn 60, Pb 40, solder at 260°C for3,5960

5 seconds

Temperature Cycle MIL-STD-883 Method 1010-55°C to 100°C, 15 min. dwell,

5 min. transfer 20 cycles83080

500 cycles83080 Humidity Life JIS C 7021 Method B-1185°C, 85 % RH, 10 mA, 1000 hours1,6800

condition C

Humidity Life JIS C 7021 Method B-1185°C, 85 % RH, 30 mA, 1000 hours1120

condition C

Humidity Life JIS C 7021 Method B-1185°C, 85 % RH, 20 mA, 1000 hours1120

condition C

Power Temperature Automotive specs.-40°C to 85°C, 15 min. dwell, 5 min.

Cycle transfer, 20 mA, 5 mins. On/Off

20 cycles3360

500 cycles3360 Corrosion MIL-STD-883 Method 100935°C, 24 hours380 Salt Atmosphere

Table 4. Mechanical Tests

Units Units Test Name Reference Test Conditions Tested Failed Mechanical Shock MIL-STD-883 Method 2002 3 shocks each X1, X2, Y1, Y2, Z1, Z2600

axis, 3000 g, 0.3msec. pulse

Vibration Variable MIL-STD-883 Method 2007 4 cycles, 4 minute each X1, Y1, Y2600 Frequency axis at 20 g minimum, 20 to 2000 Hz

Vibration Fatigue MIL-STD-883 Method 200532 ± 8 hours each X, Y, Z axis at 20 g600

minimum, 96 hours total

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