ZXMN6A25K;中文规格书,Datasheet资料

ZXMN6A25K

60V DPAK N-channel enhancement mode MOSFET

Summary

Description

This new generation trench MOSFET from Zetex features a unique structure combining the benefits of low on-resistance and fast switching, making it ideal for high efficiency power management applications.

Features

?Low on-resistance ?Fast switching speed ?Low gate drive ?

DPAK package

Applications

?DC-DC converters

?Power management functions ?Disconnect switches ?

Motor control

Ordering information

Device marking

ZXMN 6A25

V (BR)DSS R DS(on) (?)I D (A)60

0.050 @ V GS = 10V 10.70.070 @ V GS = 4.5V

9

Device

Reel size (inches)

Tape width (mm)

Quantity per reel ZXMN6A25KTC

13

16

2,500

Absolute maximum ratings

Parameter Symbol Limit Unit Drain-source voltage V DSS60V Gate-source voltage V GS±20V Continuous drain current@ V GS= 10V; T amb=25°C(b)I D10.7A

@ V GS= 10V; T amb=70°C(b)8.6A

@ V GS= 10V; T amb=25°C(a)7A Pulsed drain current(c)I DM36A Continuous source current (body diode)(b)I S11.8A Pulsed source current (body diode)(c)I SM36A Power dissipation at T amb =25°C(a)P D 4.25W Linear derating factor34mW/°C Power dissipation at T amb =25°C(b)P D9.85W Linear derating factor78.7mW/°C Power dissipation at T amb =25°C(d)P D 2.11W Linear derating factor16.8mW/°C Operating and storage temperature range T j, T stg-55 to +150°C Thermal resistance

Parameter Symbol Limit Unit Junction to ambient(a)R?JA29.4°C/W Junction to ambient(b)R?JA12.7°C/W Junction to ambient(d)R?JA59.1°C/W NOTES:

(a)For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in

still air conditions.

(b)For a device surface mounted on FR4 PCB measured at t ?10 sec.

(c)Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D=0.02 pulse width=300?s - pulse width limited by maximum

junction temperature.

(d)For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz. copper, in

still air conditions.

Thermal characteristics

Electrical characteristics (at T amb = 25°C unless otherwise stated)

Parameter Symbol

Min.

Typ.

Max.

Unit

Conditions

Static

Drain-source breakdown voltage

V (BR)DSS

60

V I D = 250?A, V GS =0V Zero gate voltage drain current I DSS

1.0?A V DS = 60V, V GS =0V Gate-body leakage

I GSS 100

nA V GS =±20V, V DS =0V Gate-source threshold voltage V GS(th)1

3V I D = 250?A, V DS =V GS Static drain-source on-state resistance (*)

NOTES:

(*)Measured under pulsed conditions. Pulse width ?300?s; duty cycle ?2%.R DS(on)

0.050?V GS = 10V, I D = 3.6A 0.070

?V GS = 4.5V, I D = 3.0A Forward transconductance (*)(?)g fs 10.2

S

V DS = 15V, I D = 4.5A Dynamic (?)Input capacitance C iss 1063pF V DS = 30V, V GS =0V f=1MHz

Output capacitance

C oss 104pF Reverse transfer capacitance C rss

64

pF

Switching (?) (?)(?)Switching characteristics are independent of operating junction temperature (?)For design aid only, not subject to production testing.

Turn-on-delay time t d(on) 3.8ns V DD = 30V, I D = 1A R G ?6.0?, V GS = 10V

Rise time

t r 4.0ns Turn-off delay time t d(off)26.2ns Fall time t f 10.6ns Gate charge Q g 11.0nC V DS = 30V, V GS = 5V I D = 1.4A

Total gate charge Q g 20.4nC V DS = 30V, V GS = 10V I D = 1.4A

Gate-source charge Q gs 4.1nC Gate drain charge Q gd 5.1nC Source-drain diode Diode forward voltage (*)V SD 0.850.95

V T j =25°C, I S = 5.5A, V GS =0V

Reverse recovery time (?)t rr 22.0ns T j =25°C, I S = 2.2A,di/dt=100A/?s

Reverse recovery charge (?)

Q rr 21.4

nC

Typical characteristics

Typical characteristics

Package outline - DPAK

Note: Controlling dimensions are in inches. Approximate dimensions are provided in millimeters

DIM Inches Millimeters

DIM Inches Millimeters Min Max Min Max Min Max Min Max A 0.0860.094 2.18 2.39e

0.090 BSC 2.29 BSC A1-0.005

-0.127

H 0.3700.4109.4010.41b 0.0200.0350.5080.89L 0.0550.070 1.40 1.78b20.0300.0450.762 1.14L10.108 REF 2.74 REF b30.2050.215 5.21 5.46L20.020 BSC 0.508 BSC c 0.0180.0240.4570.61L30.0350.0650.89 1.65c20.0180.0230.4570.584L40.0250.0400.635 1.016D 0.2130.245 5.41 6.22L50.0450.060 1.14 1.52D10.205- 5.21-θ1°0°10°0°10°E 0.2500.265 6.35 6.73θ°0°15°0°15°E10.170- 4.32-

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Definitions

Product change

Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders.

Applications disclaimer

The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances.

Life support

Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:

A. Life support devices or systems are devices or systems which:

1.are intended to implant into the body

or

2.support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to

cause the failure of the life support device or to affect its safety or effectiveness.

Reproduction

The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned.

Terms and Conditions

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For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.

Quality of product

Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer.

To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: https://www.wendangku.net/doc/837302765.html,/salesnetwork

Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD(Electrostatic discharge)

Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced.

Green compliance

Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding reg-ulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions.

All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives.

Product status key:

“Preview”Future device intended for production at some point. Samples may be available

“Active”Product status recommended for new designs

“Last time buy (LTB)”Device will be discontinued and last time buy period and delivery is in effect

“Not recommended for new designs”Device is still in production to support existing designs and production

“Obsolete”Production has been discontinued

Datasheet status key:

“Draft version”This term denotes a very early datasheet version and contains highly provisional information, which

may change in any manner without notice.

“Provisional version”This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance.

However, changes to the test conditions and specifications may occur, at any time and without notice.“Issue”This term denotes an issued datasheet containing finalized specifications. However, changes to

specifications may occur, at any time and without notice.

Zetex sales offices

Europe

Zetex GmbH Kustermann-park Balanstra?e 59

D-81541 München Germany

Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@https://www.wendangku.net/doc/837302765.html, Americas

Zetex Inc

700 Veterans Memorial Highway

Hauppauge, NY 11788

USA

Telephone: (1) 631 360 2222

Fax: (1) 631 360 8222

usa.sales@https://www.wendangku.net/doc/837302765.html,

Asia Pacific

Zetex (Asia Ltd)

3701-04 Metroplaza Tower 1

Hing Fong Road, Kwai Fong

Hong Kong

Telephone: (852) 26100 611

Fax: (852) 24250 494

asia.sales@https://www.wendangku.net/doc/837302765.html,

Corporate Headquarters

Zetex Semiconductors plc

Zetex Technology Park, Chadderton

Oldham, OL9 9LL

United Kingdom

Telephone: (44) 161 622 4444

Fax: (44) 161 622 4446

hq@https://www.wendangku.net/doc/837302765.html,

? 2006 Published by Zetex Semiconductors plc

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ZXMN6A25K