MPXHZ6130A6U;MPXHZ6130AC6U;中文规格书,Datasheet资料

Document Number: MPXHZ6130A

Rev 1.1, 05/2010

Pressure

Freescale Semiconductor

Data Sheet: Technical Data

?2006-2010, 2012 Freescale Semiconductor, Inc. All rights reserved.

Media Resistant and High

Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated

The MPXHZ6130A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The sensor's packaging has been designed to provide resistance to high humidity conditions as well as common automotive media. The small form factor and high reliability of on-chip integration make the Freescale Semiconductor, Inc. pressure sensor a logical and economical choice for the system designer.

The MPXHZ6130A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure.

Features

? 1.5% Maximum Error Over 0° to 85°C

?Resistant to High Humidity and Common Automotive Media ?Improved Accuracy at High Temperature

?Ideally suited for Microprocessor or Microcontroller-Based Systems ?Temperature Compensated from -40° to +125°C

?

Durable Thermoplastic (PPS) Surface Mount Package

ORDERING INFORMATION

Device Name

Package Options Case No.

# of Ports

Pressure Type

Device Marking None Single Dual

Gauge Differential Absolute

Super Small Outline Package (MPXHZ6130A Series)MPXHZ6130A6U Rail 1317?

?MPXHZ6130A MPXHZ6130AC6U Rail 1317A

??

MPXHZ6130A

MPXHZ6130A

15 to 130 kPa (2.2 to 18.9 psi)

0.2 to 4.8 V Output

Series

MPXHZ6130A6U CASE 1317MPXHZ6130AC6U CASE 1317A

SUPER SMALL OUTLINE PACKAGES

Application Examples

?Aviation Altimeters ?Industrial Controls

?Engine Control/Manifold Absolute Pressure (MAP)

?Weather Stations and Weather Reporting Devices

Pressure

MPXHZ6130A Sensors

Operating Characteristics

Table 1. Operating Characteristics (V S = 5.0 Vdc, T A = 25°C unless otherwise noted, P1 > P2.

Characteristic

Symbol Min Typ Max Unit Pressure Range P OP 15—130kPa Supply Voltage (1)1.Device is ratiometric within this specified excitation range.

V S 4.75 5.0 5.25Vdc Supply Current

I o — 6.010mAdc Minimum Pressure Offset (2)

(0 to 85°C)

@ V S = 5.0 Volts 2.Offset (V off ) is defined as the output voltage at the minimum rated pressure.

V off

0.132

0.200

0.268

Vdc

Full Scale Output (3)

(0 to 85°C)

@ V S = 5.0 Volts 3.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.

V FSO

4.632 4.700 4.768Vdc

Full Scale Span (4)

(0 to 85°C)

@ V S = 5.0 Volts 4.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.V FSS

4.365 4.500 4.635Vdc

Accuracy (5)(0 to 85°C)

5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following:Linearity:

Output deviation from a straight line relationship with pressure over the specified pressure range.

Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.

Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.

TcSpan:Output deviation over the temperature range of 0° to 85°C, relative to 25°C.

TcOffset:

Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.

———±1.5%V FSS Sensitivity V/P —39.2—mV/kPa Response Time (6)6.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.t R — 1.0—ms Warm-Up Time (7)7.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.——20—ms Offset Stability (8)

8.Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.

—

—

±0.25

—

%V FSS

Pressure

MPXHZ6130A

Sensors

Maximum Ratings

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

Figure 1. Fully Integrated Pressure Sensor Schematic

Table 2. Maximum Ratings (1)

1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Rating

Symbol Value Units Maximum Pressure (P1 > P2)P max 400kPa Storage Temperature T stg -40° to +125°°C Operating Temperature

T A -40° to +125°

°C Output Source Current @ Full Scale Output (2)2.Maximum Output Current is controlled by effective impedance from V OUT to Gnd or V OUT to V S in the application circuit.

I o +0.5mAdc Output Sink Current @ Minimum Pressure Offset (2)

I o --0.5

mAdc

Pins 1, 5, 6, 7, and 8 are NO CONNECTS

Sensing Element

V OUT

V S Gain Stage #2GND

and Ground Reference Shift Circuitry

Thin Film Temperature Compensation

and

Gain Stage #1

4

2

3

Pressure

MPXHZ6130A Sensors

On-chip Temperature Compensation and Calibration

Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output

curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range.

A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be

transmitted to the sensor diaphragm. The gel die coat and durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. Contact the factory for more information regarding media compatibility in your specific application.

Figure 2. Cross Sectional Diagram SSOP (not to scale)

Figure 3. Typical Application Circuit (Output Source Current Operation)

Figure 4. Output vs. Absolute Pressure

Wire Bond Stainless Steel Cap Thermoplastic

Case

Die Bond

Sealed Vacuum Reference

Fluoro Silicone Gel Die Coat

Lead Frame

Absolute Element

P1

Die

V S Pin 2

+5.0 V

GND Pin 3

V out Pin 4

MPXHZ6130A

to ADC

100 nF

51 K 47 pF

O u t p u t (V o l t s )

5.0

4.5

4.03.53.0Pressure (ref: to sealed vacuum) in kPa

MAX

MIN

10

20

30

40

50

60

70

80

90

100

2.52.01.51.00.5

110

Transfer Function:V out =Vs x (0.007826 xP(kPa) - 0.07739)+/- (PE x TM x Vs x 0.007826)PE = +/- 1.725kPa TM = 1 @ 0 to 85°C

Vs = 5.0Vdc 120

TYP

130

140

Pressure

MPXHZ6130A

Sensors

Nominal Transfer Value:

V out = V S x (0.007826 x P(kPa) - 0.07739)

± (Pressure Error x Temp. factor x 0.007826 x V S )V S = 5.0 ± 0.25 Vdc

Transfer Function (MPXHZ6130A)

Temperature Error Band

MPXHZ6130A Series

Break Points Temp Multiplier

- 403 0 to 851 125

1.75

Temperature in Co

4.03.0

2.00.0

1.0-40

-20

20

4060140

12010080Temperature Error Factor

NOTE: The Temperature Multiplier is a linear response from 0oC to -40oC and from 85oC to 125oC

Pressure Error Band

Error Limits for Pressure

3.02.01.0-1.0-2.0-3.0

0.020

Pressure (in kPa)

P r e s s u r e E r r o r (k P a )

15 to 130 (kPa)

±1.725 (kPa)

40

60

80

100

120

Pressure

Error (Max)

Pressure

MPXHZ6130A Sensors

MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES

Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a

solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.

Figure 5. SSOP Footprint (Case 1317 and 1317A)

0.027 TYP 8X 0.690.053 TYP 8X 1.35

inch mm

0.3879.83

0.1503.81

0.0501.27TYP

Pressure

PACKAGE DIMENSIONS

ISSUE H

SUPER SMALL OUTLINE PACKAGE

MPXHZ6130A Sensors

Pressure

PACKAGE DIMENSIONS

ISSUE H

SUPER SMALL OUTLINE PACKAGE

MPXHZ6130A

Sensors

Pressure

PACKAGE DIMENSIONS

ISSUE H

SUPER SMALL OUTLINE PACKAGE

MPXHZ6130A Sensors

Pressure

PACKAGE DIMENSIONS

CASE 1317A-04

ISSUE D

SUPER SMALL OUTLINE PACKAGE

MPXHZ6130A

Sensors

分销商库存信息:

FREESCALE

MPXHZ6130A6U MPXHZ6130AC6U